SN54ACT8990FJR [TI]

SPECIALTY MICROPROCESSOR CIRCUIT, PQCC44;
SN54ACT8990FJR
型号: SN54ACT8990FJR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SPECIALTY MICROPROCESSOR CIRCUIT, PQCC44

总线控制器
文件: 总15页 (文件大小:303K)
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SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
32  
Members of the Texas Instruments  
SCOPE Family of Testability Products  
Execute Instructions for Up to 2 Clock  
Cycles  
Compatible With the IEEE Standard  
1149.1-1990 (JTAG) Test Access Port and  
Boundary-Scan Architecture  
Each Device Includes Four Bidirectional  
Event Pins for Additional Test Capability  
Inputs Are TTL-Voltage Compatible  
Control Operation of Up to Six Parallel  
Target Scan Paths  
EPIC (Enhanced-Performance Implanted  
CMOS) 1-µm Process  
Accommodate Pipeline Delay to Target of  
Up to 31 Clock Cycles  
Packaged in 44-Pin Plastic Leaded Chip  
Carrier (FN), 68-Pin Ceramic Pin Grid Array  
(GB), and 68-Pin Ceramic Quad Flat  
Packages (HV)  
32  
Scan Data Up to 2 Clock Cycles  
description  
The ’ACT8990 test-bus controllers (TBC) are members of the Texas Instruments SCOPE testability  
integrated-circuit family. This family of components supports IEEE Standard 1149.1-1990 (JTAG) boundary  
scan to facilitate testing of complex circuit-board assemblies. The ’ACT8990 differ from other SCOPE  
integrated circuits. Their function is to control the JTAG serial-test bus rather than being target  
boundary-scannable devices.  
TherequiredsignalsoftheJTAGserial-testbustestclock(TCK), testmodeselect(TMS), testdatainput(TDI),  
and test data output (TDO) can be connected from the TBC to a target device without additional logic. This is  
done as a chain of IEEE Standard 1149.1-1990 boundary-scannable components that share the same  
serial-testbus. TheTBCgeneratesTMSandTDIsignalsforitstarget(s), receivesTDOsignalsfromitstarget(s),  
and buffers its test clock input (TCKI) to a test clock output (TCKO) for distribution to its target(s). The TMS, TDI,  
and TDO signals can be connected to a target directly or via a pipeline, with a retiming delay of up to 31 bits.  
Since the TBC can be configured to generate up to six separate TMS signals [TMS (5 0)], it can be used to  
control up to six target scan paths that are connected in parallel (i.e., sharing common TCK, TDI, and TDO  
signals).  
While most operations of the TBC are synchronous to TCKI, a test-off (TOFF) input is provided for output control  
of the target interface, and a test-reset (TRST) input is provided for hardware/software reset of the TBC. In  
addition, four event [EVENT (30)] I/Os are provided for asynchronous communication to target device(s).  
Each event has its own event generation/detection logic, and detected events can be counted by two 16-bit  
counters.  
The TBC operates under the control of a host microprocessor/microcontroller via the 5-bit address bus  
[ADRS (40)] and the 16-bit read/write data bus [DATA (150)]. Read (RD) and write (WR) strobes are  
implemented such that the critical host-interface timing is independent of the TCKI period. Any one of  
24 registers can be addressed for read and/or write operations. In addition to control and status registers, the  
TBC contains two command registers, a read buffer, and a write buffer. Status of the TBC is transmitted to the  
host via ready (RDY) and interrupt (INT) outputs.  
Major commands can be issued by the host to cause the TBC to generate the TMS sequences necessary to  
move the target(s) from any stable test-access-port (TAP) controller state to any other stable TAP state, to  
execute instructions in the Run-Test/Idle TAP state, or to scan instruction or test data through the target(s). A  
32-bit counter can be preset to allow a predetermined number of execution or scan operations.  
Serial data that appears at the selected TDI input (TDI1 or TDI0) is transferred into the read buffer, which can  
be read by the host to obtain up to 16 bits of the serial-data stream. Serial data that is transmitted from the TDO  
output is written by the host to the write buffer.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SCOPE and EPIC are trademarks of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
description (continued)  
The SN54ACT8990 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74ACT8990 is characterized for operation from 0°C to 70°C.  
SN54ACT8990 . . . HV PACKAGE  
(TOP VIEW)  
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61  
60  
NC  
DATA0  
DATA1  
NC  
NC  
10  
TMS5/EVENT3  
TMS4/EVENT2  
NC  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
DATA2  
DATA3  
NC  
TMS3/EVENT1  
TMS2/EVENT0  
NC  
DATA4  
GND  
V
CC  
GND  
TMS1  
NC  
V
CC  
NC  
DATA5  
DATA6  
NC  
TMS0  
TDO  
NC  
DATA7  
DATA8  
NC  
TCKO  
TCKI  
NC  
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
NC – No internal connection  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
SN74ACT8990 . . . FN PACKAGE  
(TOP VIEW)  
6
5
4
3
2 1 44 43 42 41 40  
7
DATA0  
DATA1  
DATA2  
DATA3  
DATA4  
GND  
39 TMS5/EVENT3  
38 TMS4/EVENT2  
8
9
37  
TMS3/EVENT1  
TMS2/EVENT0  
10  
11  
12  
13  
14  
15  
16  
17  
36  
35  
34  
33  
32  
31  
30  
29  
V
CC  
GND  
V
TMS1  
TMS0  
TDO  
TCKO  
TCKI  
CC  
DATA5  
DATA6  
DATA7  
DATA8  
18 19 20 21 22 23 24 25 26 27 28  
SN54ACT8990 . . . GB PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
8
9
10  
11  
A
B
C
D
E
F
G
H
J
K
L
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
Table 1. Terminal Assignments  
TERMINAL  
NAME  
TERMINAL  
NAME  
TERMINAL  
NAME  
TERMINAL  
NAME  
NC  
NO.  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
NO.  
B10  
B11  
C1  
NO.  
F11  
G1  
G2  
G10  
G11  
H1  
NO.  
K6  
K7  
K8  
K9  
K10  
K11  
L2  
NC  
ADRS4  
NC  
NC  
NC  
NC  
DATA5  
NC  
V
CC  
DATA2  
DATA15  
ADRS1  
ADRS0  
NC  
C2  
DATA1  
NC  
TDI0  
NC  
C3  
NC  
TMS1  
NC  
C10  
C11  
D1  
TMS4/EVENT2  
TMS5/EVENT3  
DATA4  
TCKI  
DATA9  
NC  
INT  
H2  
DATA6  
TDO  
RD  
H10  
H11  
J1  
L3  
TRST  
DATA0  
NC  
D2  
DATA3  
TMS0  
DATA8  
DATA7  
TCKO  
NC  
L4  
DATA12  
DATA13  
NC  
D10  
D11  
E1  
TMS3/EVENT1  
NC  
L5  
J2  
L6  
ADRS3  
ADRS2  
NC  
NC  
J10  
J11  
K1  
L7  
DATA14  
TOFF  
TDI1  
E2  
GND  
L8  
E10  
E11  
F1  
V
NC  
L9  
CC  
TMS2/EVENT0  
NC  
K2  
NC  
L10  
NC  
GND  
RDY  
WR  
V
CC  
K3  
DATA10  
DATA11  
NC  
F2  
NC  
K4  
F10  
GND  
K5  
NC – No internal connection  
functional block diagram  
Target  
Host  
Interface  
Interface  
Read Data Bus  
Write Data Bus  
16  
16  
16  
5
DATA(150)  
ADRS(40)  
RD  
TMS(52)/  
EVENT(30)  
4
Counter Block  
Event  
Block  
WR  
RDY  
INT  
Host  
Block  
Command Block  
Serial Block  
2
2
TMS(10)  
Sequencer  
Block  
TDI(10)  
TDO  
TOFF  
TCKO  
TCKI  
TRST  
Inputs have internal pullup resistors.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
Terminal Functions  
TERMINAL NAME  
I/O  
DESCRIPTION  
Address inputs. ADRS4ADRS0 form the 5-bit address bus that interfaces the TBC to its host. These inputs  
specify the TBC register to be read from or written to.  
ADRS4ADRS0  
I
Data inputs and outputs. DATA15DATA0 form the 16-bit bidirectional data bus that interfaces the TBC to its  
host. Data is read from or written to the TBC register using this data bus.  
DATA15DATA0  
I/O  
O
GND  
INT  
NC  
Ground  
Interrupt. INT transmits an interrupt signal to the host. When the TBC requires service from the host, INT is  
asserted (low). INT will remain asserted (low) until the host has completed the required service.  
No connection  
Read strobe. RD is the active low output enable for the data bus. RD is used as the strobe for reading data from  
the selected TBC register.  
RD  
I
Ready. RDY transmits a status signal to the host. When the TBC is ready to accept a read or write operation  
from the host, RDY is asserted (low). RDY is not asserted (high) when the TBC is in recovery from a read, write,  
command, or reset operation.  
RDY  
TCKI  
TCKO  
O
Test clock input. TCKI is the clock input for the TBC. Most operations of the TBC are synchronous to TCKI.  
When enabled, all target interface outputs change on the falling edge of TCKI. Sampling of target interface  
inputs are configured to occur on either the rising edge or falling edge of TCKI.  
I
Testclockoutput. TCKOdistributesTCKtothetarget(s). TheTCKOisconfiguredtobedisabled, constantzero,  
constant one, or to follow TCKI. When TCKO follows TCKI, it is delayed to match the delay of generating the  
TDO and TMS signals.  
O
Test data inputs. The TDI1TDI0 serial inputs are used for shifting test data from the target(s). The TDI inputs  
can be directly connected to the TDO pin(s) of the target(s).  
TDI1TDI0  
TDO  
I
Test data output. TDO is used for shifting test data into the target(s). TDO can be directly connected to the TDI  
terminal(s) of the target(s).  
O
Test mode select outputs. These parallel outputs transmit TMS signals to the target(s), which direct them  
through their TAP controller states. TMS1TMS0 can be directly connected to the TMS terminals of the  
target(s).  
TMS1TMS0  
O
Test mode select outputs or event inputs/outputs. These I/Os can be configured for use as either TMS outputs  
or event inputs/outputs. As TMS outputs, they function similarly to TMS1TMS0 above. As event I/Os, they  
can be used to receive/transmit interrupt signals to/from the target(s).  
TMS5TMS2/  
EVENT3EVENT0  
I/O  
Test-off input. TOFF is the active low output disable for all outputs and I/Os of the target interface (TCKO, TDO,  
TMS, TMS/EVENT).  
TOFF  
TRST  
WR  
I
I
I
Test-reset input. TRST is used to initiate hardware and software reset operations of the TBC. Hardware reset  
begins when TRST is asserted (low). Software reset begins when TRST is released (high) and proceeds  
synchronously to TCKI to completion in a predetermined number of cycles.  
Write input. WR is the strobe for writing data to a TBC data register. Signals present at the data and address  
buses are captured on the rising edge of WR.  
V
CC  
Supply voltage  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
I
CC  
CC  
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
I
CC  
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA  
Maximum power dissipation at T = 55°C (in still air) (see Note 2): FN package . . . . . . . . . . . . . . . . . . . 1.5W  
Storage temperature range, T  
O
O
CC  
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 75 mils.  
Formoreinformation, refertothePackageThermalConsiderationsapplicationnoteintheABTAdvancedBiCMOSTechnologyData  
Book, literature number SCBD002.  
recommended operating conditions  
SN54ACT8990  
SN74ACT8990  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
0.8  
V
0
0
V
V
0
0
V
V
V
I
CC  
CC  
Output voltage  
V
O
CC  
–8  
CC  
–8  
I
I
High-level output current  
Low-level output current  
Operating free-air temperature  
mA  
mA  
°C  
OH  
8
8
OL  
T
A
–55  
125  
0
70  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54ACT8990  
SN74ACT8990  
A
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN  
4.4  
3.7  
5.4  
4.7  
MAX  
MIN  
4.4  
3.7  
5.4  
4.7  
MAX  
I
I
I
I
I
I
= –20 µA  
= 8 mA  
= –20 µA  
= –8 mA  
= 20 µA  
4.4  
3.7  
5.4  
4.7  
OH  
OH  
OH  
OH  
OL  
OL  
V
= 4.5 V  
CC  
V
V
V
OH  
V
V
= 5.5 V  
= 4.5 V  
CC  
0.1  
0.5  
0.1  
0.5  
0.1  
0.5  
CC  
V
OL  
to 5.5 V  
= 8 mA  
ADRS, RD,  
WR, TCKI  
V
V
V
= 5.5 V,  
= 5.5 V  
= 5.5 V,  
V = V  
or GND  
±1  
±1  
±1  
CC  
CC  
CC  
I
CC  
CC  
I
µA  
I
V = V  
I
±1  
±1  
±1  
TDI, TOFF,  
TRST  
V = GND  
I
–35  
–35  
–70  
–250  
–35  
–35  
–250  
–35  
–35  
–250  
INT, RDY, TCKO,  
TDO, TMS  
V
O
= V  
or GND  
±10  
±10  
±10  
CC  
CC  
µA  
I
OZ  
CC  
V
V
= V  
±10  
±10  
±10  
DATA,  
TMS/EVENT  
O
V
V
= 5.5 V  
= 5.5 V,  
CC  
= GND  
–70  
100  
–250  
–250  
–250  
O
CC  
V = V  
or GND  
450*  
450  
450  
µA  
I
CC  
= 50 pF  
L
I
O
= 0,  
I
V
CC  
= 5.5 V,  
C
mA  
f
= 30 MHz  
clock  
*
C
C
C
V = V  
or GND  
or GND  
or GND  
5
pF  
pF  
pF  
i
I
CC  
CC  
CC  
9*  
8*  
V = V  
I
io  
o
V = V  
I
* On products compliant to MIL-PRF-38535, this parameter does not apply.  
Typical values are at V  
For I/O ports, the parameter I  
OZ  
= 5 V.  
CC  
includes the input leakage.  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature (see Figure 1)  
SN54ACT8990  
SN74ACT8990  
UNIT  
MIN  
MAX  
MIN  
0
MAX  
f
Clock frequency  
Pulse duration  
0
30  
30  
MHz  
ns  
clock  
w
RD low  
5.5  
5.5  
8
WR low  
5.5  
8
t
EVENT high or low  
TCKI high or low  
TRST low  
ns  
ns  
10.5  
6
10.5  
6
ADRS before RD↑  
6.5  
6.5  
6
ADRS before WR↑  
DATA before WR↑  
EVENT before TCKI↑  
EVENT before TCKI↓  
TDI before TCKI↑  
TDI before TCKI↓  
6.5  
6
t
su  
Setup time  
6
5.5  
5
ns  
ns  
ns  
5
2
2
2
2
ADRS after RD↑  
5
ADRS after WR↑  
DATA after WR↑  
EVENT after TCKI↑  
EVENT after TCKI↓  
TDI after TCKI↑  
5.5  
5.5  
5.5  
5
5
5.5  
5
t
h
Hold time  
5
4
2.5  
2.5  
TDI after TCKI↓  
4
Applies only in the case where ADRS (4-0) = 10110 (read buffer).  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature (see Figure 1)  
SN54ACT8990  
SN74ACT8990  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
30  
MAX  
MIN  
30  
MAX  
f
t
t
max  
PLH  
PHL  
8
43  
43  
17  
16  
16  
15  
15  
17  
19  
17  
19  
20  
19  
19  
19  
20  
21  
28  
19  
19  
23  
20  
22  
20  
23  
20  
21  
20  
16  
14  
15  
14  
16.2  
16.7  
19.5  
19.5  
5.3  
2.5  
3.7  
5.5  
4.4  
3.3  
2.3  
3.6  
2.9  
5.2  
3.1  
5.1  
1.5  
3.5  
3.8  
6.8  
4.9  
3.6  
4.1  
4.8  
4.3  
5
39.3  
39.3  
13.8  
13  
ADRS  
DATA  
8
RD↑  
5.3  
2.5  
3.7  
5.5  
4.4  
3.3  
2.3  
3.6  
2.9  
5.2  
3.1  
5.1  
1.5  
3.5  
3.8  
6.8  
4.9  
3.6  
4.1  
4.8  
4.3  
5
t
ns  
ns  
RDY  
INT  
PLH  
WR↑  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
12.9  
13.1  
13.4  
14.1  
15.9  
15.6  
17.5  
17.9  
17.5  
18.2  
17.5  
18.9  
17.6  
22.6  
15.3  
15.3  
19.2  
17.4  
19.5  
17.7  
19.9  
18.5  
18.8  
18.7  
12.2  
10.3  
12.2  
10.8  
14.7  
13.6  
PLH  
PHL  
PHL  
PLH  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
TCKI↑  
TCKI↑  
TCKI↑  
RDY  
ns  
ns  
TCKO  
TCKI↓  
TCKI↓  
TCKI↓  
TCKI↓  
RD↓  
TCKO  
TDO  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TMS  
TMS/EVENT  
DATA  
INT  
t
TCKI↑  
TCKI↓  
PZH  
RDY  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
PZH  
PZL  
PZH  
PZL  
PZH  
PZL  
PZH  
PZL  
PZH  
PZL  
PZH  
PZL  
PZH  
PZL  
TCKO  
TDO  
TCKI↓  
TCKI↓  
TCKI↓  
4.6  
5.1  
2
4.6  
5.1  
2
TMS  
TMS/EVENT  
TCKO  
TDO  
3.2  
4.6  
3.1  
4.4  
3.5  
3.1  
1.9  
3.2  
4.6  
3.1  
4.4  
3.5  
3.1  
1.9  
TOFF↑  
TOFF↑  
TOFF↑  
TMS  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature (continued) (see Figure 1)  
SN54ACT8990  
SN74ACT8990  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
MIN  
2.3  
2.7  
3.8  
4.1  
6.7  
4.8  
5.1  
5
MAX  
15.3  
16.4  
18.4  
17.1  
20.4  
21.1  
21.7  
20.7  
22.4  
20.6  
22.5  
20.5  
15.6  
15.5  
16.6  
15.4  
19.1  
17  
MIN  
2.3  
2.7  
3.8  
4.1  
6.7  
4.8  
5.1  
5
MAX  
13.8  
13.9  
15.4  
14.8  
19.8  
20.4  
21.3  
20.3  
21.9  
20.1  
22.1  
20.1  
15.4  
15.3  
16.5  
15.4  
17.1  
15.8  
17.3  
16.2  
20.8  
20  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
PZH  
PZL  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
PHZ  
PLZ  
TMS/EVENT  
DATA  
TOFF↑  
RD↑  
TCKI↓  
TCKI↓  
TCKI↓  
TCKI↓  
TCKO  
TDO  
6.9  
4.6  
4.7  
2.8  
5
6.9  
4.6  
4.7  
2.8  
5
TMS  
TMS/EVENT  
TCKO  
TOFF↓  
TOFF↓  
TOFF↓  
TOFF↓  
TRST↓  
TRST↓  
TRST↓  
TRST↓  
4.4  
5.6  
4.6  
4.8  
4.4  
4.5  
2.4  
5.7  
4.2  
6
4.4  
5.6  
4.6  
4.8  
4.4  
4.5  
2.4  
5.7  
4.2  
8
TDO  
TMS  
18.8  
17.1  
23  
TMS/EVENT  
DATA  
20.3  
19.6  
18  
19.5  
17.8  
18.7  
17.8  
21.1  
19.9  
INT  
RDY  
6.1  
6.5  
4.8  
6
6.1  
6.5  
4.8  
6
18.8  
17.8  
21.1  
20  
TMS/EVENT  
4.2  
4.2  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT8990, SN74ACT8990  
TEST-BUS CONTROLLERS  
IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES  
SCAS190E – JUNE 1990 – REVISED JANUARY 1997  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
TEST  
S1  
S1  
1 kΩ  
t
t
/t  
Open  
PLH PHL  
From Output  
Under Test  
t
/t  
V
GND  
PLZ PZL  
CC  
/t  
PHZ PZH  
C
= 50 pF  
L
(see Note A)  
t
w
LOAD CIRCUIT  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
3 V  
Timing Input  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
t
t
h
su  
3 V  
0 V  
1.5 V  
1.5 V  
3 V  
0 V  
Data Input  
Output  
Control  
(high-level  
enabling)  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
t
PZL  
t
PLZ  
V  
3 V  
0 V  
CC  
Output  
Waveform 1  
Input  
t
1.5 V  
1.5 V  
50% V  
t
CC  
10% V  
CC  
CC  
S1 at V  
(see Note B)  
CC  
V
OL  
OH  
PLH  
PHZ  
t
PHL  
t
PZH  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
90% V  
50% V  
50% V  
Output  
CC  
CC  
V
50% V  
CC  
(see Note B)  
OL  
0 V  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A.  
C
includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
For testing pulse duration: t = t = 1 to 3 ns. Pulse polarity can be either high-to-low-to-high or low-to-high-to-low.  
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
5962-9322801MXA  
5962-9322801MYA  
SN74ACT8990FN  
SN74ACT8990FNR  
SNJ54ACT8990GB  
SNJ54ACT8990HV  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CFP  
HV  
68  
68  
44  
44  
68  
68  
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-3-220C-168 HR  
Level-3-220C-168 HR  
Level-NC-NC-NC  
Level-NC-NC-NC  
CPGA  
PLCC  
PLCC  
CPGA  
CFP  
GB  
FN  
26  
500  
1
FN  
GB  
HV  
1
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPLC004A – OCTOBER 1994  
FN (S-PQCC-J**)  
PLASTIC J-LEADED CHIP CARRIER  
20 PIN SHOWN  
Seating Plane  
0.004 (0,10)  
0.180 (4,57) MAX  
0.120 (3,05)  
D
0.090 (2,29)  
D1  
0.020 (0,51) MIN  
3
1
19  
0.032 (0,81)  
0.026 (0,66)  
4
18  
D2/E2  
D2/E2  
E
E1  
8
14  
0.021 (0,53)  
0.013 (0,33)  
0.050 (1,27)  
9
13  
0.007 (0,18)  
M
0.008 (0,20) NOM  
D/E  
D1/E1  
D2/E2  
NO. OF  
PINS  
**  
MIN  
0.385 (9,78)  
MAX  
MIN  
MAX  
MIN  
MAX  
0.395 (10,03)  
0.350 (8,89)  
0.356 (9,04)  
0.141 (3,58)  
0.191 (4,85)  
0.291 (7,39)  
0.341 (8,66)  
0.169 (4,29)  
0.219 (5,56)  
0.319 (8,10)  
0.369 (9,37)  
20  
28  
44  
52  
68  
84  
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)  
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)  
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)  
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)  
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)  
4040005/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-018  
1
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IMPORTANT NOTICE  
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enhancements, improvements, and other changes to its products and services at any time and to discontinue  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
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