SN54F175FK-00 [TI]
F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20;型号: | SN54F175FK-00 |
厂家: | TEXAS INSTRUMENTS |
描述: | F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20 输出元件 逻辑集成电路 触发器 |
文件: | 总10页 (文件大小:409K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
54F175,74F175
54F175 74F175 Quad D Flip-Flop
Literature Number: SNOS163A
November 1994
54F/74F175 Quad D Flip-Flop
General Description
Features
Y
Edge-triggered D-type inputs
The ’F175 is a high-speed quad D flip-flop. The device is
useful for general flip-flop requirements where clock and
clear inputs are common. The information on the D inputs is
stored during the LOW-to-HIGH clock transition. Both true
and complemented outputs of each flip-flop are provided. A
Master Reset input resets all flip-flops, independent of the
Clock or D inputs, LOW.
Y
Buffered positive edge-triggered clock
Y
Asynchronous common reset
Y
True and complement output
Y
Guaranteed 4000V minimum ESD protection
Package
Commercial
74F175PC
Military
Package Description
Number
N16E
J16A
16-Lead (0.300 Wide) Moldual-In-L
×
54F175DM (Note 2)
16-Lead Ceramic Dual-In-Line
74F175SC (Note 1)
74F175SJ (Note 1)
M16A
M16D
W16A
E20A
16-Lead (0.150 Wideed Small tlinJEDEC
×
16-Lead (0.300 WSmall Outline, EIAJ
×
54F175FM (Note 2)
54F175LM (Note 2)
16-LeCerpack
20-Lead Cmic Leess Chip arrier, Type C
e
Note 1: Devices also available in 13 reel. Use suffix
SCX and SJX.
×
Note 2: Military grade device with environmental and burn-in processing. Use su
, FMQB LMQB.
Logic Symbols
on Diagrams
Pin Assignm
DIP, SC and
Pin Assignment
for LCC
IEEE/IEC
TL/F/9490–1
TL/F/9490–2
–5
TL/F/9490–3
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9490
RRD-B30M75/Printed in U. S. A.
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
Output I /I
HIGH/LOW
OH OL
b
20 mA/ 0.6 mA
b
20 mA/ 0.6 mA
b
20 mA/ 0.6 mA
D –D
0
Data Inputs
1.0/1.0
1.0/1.0
1.0/1.0
50/33.3
50/33.3
3
CP
Clock Pulse Input (Active Rising Edge)
Master Reset Input (Active LOW)
True Outputs
MR
b
b
Q –Q
0
1 mA/20 mA
1 mA/20 mA
3
Q –Q
0
Complement Outputs
3
Functional Description
Truth Table
The ’F175 consists of four edge-triggered D flip-flops with
individual D inputs and Q and Q outputs. The Clock and
Master Reset are common. The four flip-flops will store the
state of their individual D inputs on the LOW-to-HIGH clock
(CP) transition, causing individual Q and Q outputs to follow.
A LOW input on the Master Reset (MR) will force all Q out-
puts LOW and Q outputs HIGH independent of Clock or
Data inputs. The ’F175 is useful for general logic applica-
tions where a common Master Reset and Clock are accept-
able.
Inputs
CP
Outputs
MR
D
Q
Q
n
n
n
L
H
H
X
X
L
H
L
L
H
L
H
L
e
e
e
H
L
HIGH Voltage Level
LOW Voltage Level
Immaterial
X
e
L
LOW-to-HIGH Clock Transition
Logic Diagram
TL/F/9490–4
Please note that this diagraded only fof logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
b
b
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
§
a
55 C to 150 C
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
TRI-STATE Output
É
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Symbol
Parameter
U
C
Conditions
Min
Typ
Max
V
V
V
V
Input HIGH Voltage
2.0
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
Input LOW Voltage
0.8
IL
e b
18 mA
Input Clamp Diode Voltage
.2
Min
Min
I
CD
OH
IN
e b
e b
e b
Output HIGH
Voltage
54F 10% V
2.5
2.5
2.7
I
I
I
1 mA
1 mA
1 mA
CC
OH
OH
OH
74F 10% V
74F 5% V
V
CC
CC
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
I
I
20 mA
20 mA
OL
CC
OL
V
Min
Max
Max
Max
0.0
0.5
CC
OL
e
I
I
I
Input HIGH
Current
54F
74F
20.0
5.0
V
V
V
2.7V
IH
IN
mA
mA
mA
V
e
Input HIGH Curre
Breakdown Test
54
7
100
7.0
7.0V
BVI
IN
e
V
CC
Output HIG
5
74F
250
50
CEX
OUT
Leak
e
All Other Pins Grounded
V
ID
In
T
I
ID
1.9 mA
4F
F
4.75
e
IOD
I
O
Cir
V
150 mV
OD
3.75
mA
0.0
All Other Pins Grounded
b
e
0.5V
I
I
I
Input L
0.6
mA
mA
Max
Max
V
IL
IN
b
b
e
0V
OUT
Output Short-Circuit Current
Power Supply Current
60
150
V
OS
CC
e
e
CP
L
MR
22.5
34.0
mA
Max
e
HIGH
D
n
3
AC Electrical Characteristics
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
50 pF
e
50 pF
T
, V
CC
e
Mil
T
, V
A CC
Com
A
e a
Symbol
Parameter
V
Units
CC
e
C
C
L
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
f
Maximum Clock Frequency
Propagation Delay
100
140
80
100
MHz
ns
max
t
t
4.0
4.0
5.0
6.5
6.5
8.5
3.5
4.0
8.5
4.0
4.0
7.5
9.5
PLH
CP to Q or Q
n
10.5
PHL
n
t
Propagation Delay
MR to Q
PHL
4.5
4.0
9.0
6.5
11.5
8.0
4.5
4.0
15.0
10.0
4.5
4.0
13.0
9.0
ns
ns
n
t
Propagation Delay
MR to Q
PLH
n
AC Operating Requirements
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
e
Symbol
Parameter
T
, V
CC
Mil
Max
T
A C
Co
Max
Un
A
e a
V
CC
Min
Max
Min
Min
t (H)
s
Setup Time, HIGH or LOW
3.0
3.0
3.0
3.0
t (L)
s
D to CP
n
ns
ns
t (H)
h
Hold Time, HIGH or LOW
D to CP
n
1.0
1.0
1.0
2.0
1.0
1.0
t (L)
h
t
t
(H)
(L)
CP Pulse Width
HIGH or LOW
4.0
5.0
4.0
5.
4.0
5.0
w
w
t
t
(L)
MR Pulse Width, LOW
5.0
5.0
5.0
5.0
ns
ns
w
Recovery Time, MR to CP
rec
4
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 175
S
C
X
Temperature Range Family
e
e
54F Military
Special Variations
e
74F Commercial
QB
Military grade device with
environmental and burn-in
processing
Device Type
e
X
Devices shipped in 13 reel
×
Package Code
Temperature Range
e
e
e
e
e
e
P
D
F
L
S
SJ
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline SOIC JEDEC
Small Outline SOIC EIAJ
e
e
a
C
M
Commercial (0 C to 70 C)
§
§
b a
Military ( 55 C to 125 C)
§
§
Physical Dimensions inches (millimeters)
20-Terminal Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
16-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)
×
NS Package Number M16A
6
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0.300 Wide) Molded Small tline PacAJ (SJ
×
NS Package Number 6D
6-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N16E
7
Physical Dimensions inches (millimeters) (Continued)
16 Lead Ceramic FlatpaF)
NS Package Number W16
LIFE SUPPORT
NATIONAL’S AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCAs used herein:
1. Life support ms are devices or
systems which, (ed for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Tel: 1(800) 272-9959
TWX: (910) 339-9240
National Semiconductor
GmbH
Livry-Gargan-Str. 10
D-82256 Furstenfeldbruck
Germany
Tel: (81-41) 35-0
Telex: 527649
Fax: (81-41) 35-1
National Semiconductor National Semiconductor
National Semiconductores
Do Brazil Ltda.
Rue Deputado Lacorda Franco
120-3A
Sao Paulo-SP
Brazil 05418-000
Tel: (55-11) 212-5066
Telex: 391-1131931 NSBR BR
Fax: (55-11) 212-1181
National Semiconductor
(Australia) Pty, Ltd.
Building 16
Business Park Drive
Monash Business Park
Nottinghill, Melbourne
Victoria 3168 Australia
Tel: (3) 558-9999
Japan Ltd.
Hong Kong Ltd.
Sumitomo Chemical
Engineering Center
Bldg. 7F
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
1-7-1, Nakase, Mihama-Ku Hong Kong
Chiba-City,
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Ciba Prefecture 261
Tel: (043) 299-2300
Fax: (043) 299-2500
Fax: (3) 558-9998
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明