SN54HC00TDF2 [TI]

4 通道、2 输入、2V 至 6V 与非门 | TD | 0 | 25 to 25;


型号：	SN54HC00TDF2
厂家：	TEXAS INSTRUMENTS
描述：	4 通道、2 输入、2V 至 6V 与非门 \| TD \| 0 \| 25 to 25 逻辑集成电路
文件：	总6页 (文件大小：327K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SN54HC00-DIE

ZHCSC36 –FEBRUARY 2014

SN54HC00-DIE 四路 2 输入正与非门

1 特性

•

宽工作电压范围

低功耗

低输入电流

2 说明

此 SN54AC00-DIE 器件包含 4 个独立的 2 输入与非门。每个门在正逻辑中执行布尔函数：Y = A • B 或 Y = A +

B。

Ordering Information⁽¹⁾

PACKAGE

DESIGNATOR

PRODUCT

PACKAGE

ORDERABLE PART NUMBER

PACKAGE QUANTITY

SN54HC00TDF1

SN54HC00TDF2

400

SN54HC00

Bare die in waffle pack⁽²⁾

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality

Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room

temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not

warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SCLS747

SN54HC00-DIE

ZHCSC36 –FEBRUARY 2014

www.ti.com.cn

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3 Bare Die Information

BACKSIDE

POTENTIAL

BOND PAD

METALLIZATION COMPOSITION

BOND PAD

THICKNESS

DIE THICKNESS

BACKSIDE FINISH

Silicon with backgrind

10.5 mils.

Floating

TiW/AlCu2%

1199 nm

SN54HC00-DIE

www.ti.com.cn

ZHCSC36 –FEBRUARY 2014

Bond Pad Coordinates in Microns

DESCRIPTION

PAD NUMBER

X MIN

166.5

504.9

645.3

902.7

1097.1

1090.8

834.3

693.9

375.3

166.5

Y MIN

413.1

155.7

299.7

440.1

580.5

888.3

632.7

X MAX

267.3

605.7

746.1

1003.5

1197.9

1191.6

935.1

794.7

476.1

267.3

Y MAX

513.9

256.5

400.5

540.9

681.3

989.1

733.5

GND

VCC

xxx

PACKAGE OPTION ADDENDUM

www.ti.com

9-Nov-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

SN54HC00TDF1

SN54HC00TDF2

ACTIVE

400

RoHS & Green

Call TI

N / A for Pkg Type

25 to 25

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

9-Nov-2021

OTHER QUALIFIED VERSIONS OF SN54HC00-DIE :

Space : SN54HC00-SP

•

NOTE: Qualified Version Definitions:

Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

•

Addendum-Page 2

重要声明和免责声明

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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

SN54HC00TDF2 [TI]

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