SN54HC157-SP [TI]
四路 2 线路至 1 线路数据选择器/多路复用器;
| 型号： | SN54HC157-SP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 四路 2 线路至 1 线路数据选择器/多路复用器 复用器 解复用器 |
| 文件： | 总21页 (文件大小：1120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢇ ꢃꢄ ꢅꢆ ꢂꢇ
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SCLS113D − DECEMBER 1982 − REVISED SEPTEMBER 2003
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 15 LSTTL Loads
D
D
D
Typical t = 11 ns
pd
6-mA Output Drive at 5 V
Low Power Consumption, 80-µA Max I
Low Input Current of 1 µA Max
CC
SN54HC157 . . . J OR W PACKAGE
SN74HC157 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HC157 . . . FK PACKAGE
(TOP VIEW)
A/B
1A
V
CC
G
1
2
3
4
5
6
7
8
16
15
14
13
3
2
1
20 19
18
4A
4B
NC
1B
1Y
NC
2A
2B
4
5
6
7
8
1B
4A
4B
17
16
1Y
2A
12 4Y
15 4Y
14
9 10 11 12 13
11
10
9
2B
3A
3B
3Y
3A
2Y
GND
NC − No internal connection
description/ordering information
These data selectors/multiplexers contain inverters and drivers to supply full data selection to the four output
gates. A separate strobe (G) input is provided. A 4-bit word is selected from one of two sources and is routed
to the four outputs. The ’HC157 devices present true data.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
†
T
A
PACKAGE
PDIP − N
PACKAGE
Tube of 25
Tube of 40
SN74HC157N
SN74HC157N
SN74HC157D
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
SN74HC157DR
SN74HC157DT
SN74HC157NSR
SN74HC157DBR
SN74HC157PW
SN74HC157PWR
SN74HC157PWT
SNJ54HC157J
SNJ54HC157W
SNJ54HC157FK
SOIC − D
HC157
SOP − NS
HC157
HC157
−40°C to 85°C
SSOP − DB
Reel of 2000
Reel of 250
Tube of 25
TSSOP − PW
HC157
CDIP − J
CFP − W
LCCC − FK
SNJ54HC157J
SNJ54HC157W
SNJ54HC157FK
Tube of 150
Tube of 55
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢇ ꢃ ꢄꢅꢆ ꢂ ꢇ
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SCLS113D − DECEMBER 1982 − REVISED SEPTEMBER 2003
FUNCTION TABLE
INPUTS
OUTPUT
Y
DATA
SELECT
A/B
G
A
X
L
B
X
X
X
L
H
L
L
L
L
X
L
L
L
L
H
X
X
H
L
H
H
H
H
logic diagram (positive logic)
2
1A
4
1Y
3
1B
5
2A
7
9
2Y
3Y
6
2B
11
3A
10
3B
14
4A
12
4Y
13
4B
15
G
1
A/B
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢇ ꢃꢄ ꢅꢆ ꢂꢇ
ꢉ ꢊꢋꢌ ꢍꢊꢎ ꢏ ꢐ ꢑ ꢒꢏ ꢓꢁꢐ ꢔ ꢕ ꢆ ꢒꢏ ꢓꢁꢐ ꢌꢋꢔꢋ ꢀꢐ ꢏꢐ ꢅꢔꢕ ꢍꢀꢖ ꢗꢊ ꢏꢔ ꢓ ꢎꢏ ꢐꢘ ꢐ ꢍꢀ
SCLS113D − DECEMBER 1982 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC157
MIN NOM
SN74HC157
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢂ ꢇꢈ ꢀꢁ ꢇ ꢃ ꢄꢅꢆ ꢂ ꢇ
ꢉꢊ ꢋ ꢌꢍ ꢊ ꢎꢏ ꢐ ꢑ ꢒꢏꢓ ꢁ ꢐ ꢔ ꢕ ꢆ ꢒꢏꢓ ꢁ ꢐ ꢌꢋꢔꢋ ꢀꢐ ꢏꢐ ꢅꢔꢕ ꢍꢀꢖ ꢗꢊ ꢏꢔ ꢓꢎ ꢏꢐ ꢘꢐꢍꢀ
SCLS113D − DECEMBER 1982 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC157
SN74HC157
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
I
IH
IL
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
80
OL
= 7.8 mA
0.4
OL
I
I
V = V
I
or 0
6 V
1000
160
10
nA
µA
pF
I
CC
V = V
I
or 0,
I
O
= 0
6 V
CC
CC
C
2 V to 6 V
3
10
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
63
SN54HC157
SN74HC157
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
125
25
MIN
MAX
190
38
MIN
MAX
160
32
2 V
4.5 V
6 V
13
A or B
A/B
G
Y
Y
Y
Y
11
21
32
27
2 V
67
125
25
190
38
160
31
4.5 V
6 V
18
t
pd
ns
14
21
32
27
2 V
59
115
23
170
34
145
29
4.5 V
6 V
16
13
20
29
25
2 V
28
60
90
75
t
t
4.5 V
6 V
8
12
18
15
ns
6
10
15
13
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢂꢇ ꢈ ꢀꢁꢇ ꢃꢄ ꢅꢆ ꢂꢇ
ꢉ ꢊꢋꢌ ꢍꢊꢎ ꢏ ꢐ ꢑ ꢒꢏ ꢓꢁꢐ ꢔ ꢕ ꢆ ꢒꢏ ꢓꢁꢐ ꢌꢋꢔꢋ ꢀꢐ ꢏꢐ ꢅꢔꢕ ꢍꢀꢖ ꢗꢊ ꢏꢔ ꢓ ꢎꢏ ꢐꢘ ꢐ ꢍꢀ
SCLS113D − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
81
SN54HC157
SN74HC157
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
190
38
MIN
MAX
290
58
MIN
MAX
235
47
2 V
4.5 V
6 V
23
A or B
A/B
G
Y
Y
Y
Y
18
33
49
41
2 V
81
210
42
320
64
260
52
4.5 V
6 V
23
t
pd
ns
18
36
54
45
2 V
91
190
38
290
58
235
47
4.5 V
6 V
24
18
33
49
41
2 V
45
210
42
315
63
265
53
t
t
4.5 V
6 V
17
ns
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
40
pF
pd
PARAMETER MEASUREMENT INFORMATION
V
CC
From Output
Under Test
Test
Point
Input
50%
50%
0 V
C
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
50%
10%
50%
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
90%
t
90%
OH
Input
50%
10%
50%
10%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
0 V
OL
t
r
f
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-86061012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
86061012A
SNJ54HC
157FK
5962-8606101EA
5962-8606101VEA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
5962-8606101EA
SNJ54HC157J
5962-8606101VE
A
SNV54HC157J
5962-8606101VFA
ACTIVE
CFP
W
16
25
TBD
TBD
A42
N / A for Pkg Type
5962-8606101VF
A
SNV54HC157W
SN54HC157J
SN74HC157D
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC157J
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC157
SN74HC157DBR
SN74HC157DBRE4
SN74HC157DBRG4
SN74HC157DE4
SN74HC157DG4
SN74HC157DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DB
DB
DB
D
16
16
16
16
16
16
16
16
16
2000
2000
2000
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
D
40
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
250
Green (RoHS
& no Sb/Br)
SN74HC157DRE4
SN74HC157DRG4
SN74HC157DT
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC157DTE4
SN74HC157DTG4
SN74HC157N
ACTIVE
SOIC
SOIC
PDIP
D
16
16
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC157
ACTIVE
ACTIVE
D
N
250
25
Green (RoHS
& no Sb/Br)
-40 to 85
HC157
Pb-Free
(RoHS)
-40 to 85
SN74HC157N
SN74HC157N3
SN74HC157NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
-40 to 85
-40 to 85
25
2000
2000
90
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC157N
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
HC157
SN74HC157NSR
SN74HC157NSRG4
SN74HC157PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
16
16
16
16
16
16
16
16
16
16
16
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
PW
PW
PW
PW
PW
PW
PW
PW
FK
Green (RoHS
& no Sb/Br)
SN74HC157PWE4
SN74HC157PWG4
SN74HC157PWR
SN74HC157PWRE4
SN74HC157PWRG4
SN74HC157PWT
SN74HC157PWTE4
SN74HC157PWTG4
SNJ54HC157FK
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
5962-
86061012A
SNJ54HC
157FK
SNJ54HC157J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8606101EA
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SNJ54HC157J
SNJ54HC157W
SNJ54HC157W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC157, SN54HC157-SP, SN74HC157 :
Catalog: SN74HC157, SN54HC157
•
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Military: SN54HC157
•
Space: SN54HC157-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
•
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC157DBR
SN74HC157DR
SN74HC157PWR
SN74HC157PWT
SSOP
SOIC
DB
D
16
16
16
16
2000
2500
2000
250
330.0
330.0
330.0
330.0
16.4
16.4
12.4
12.4
8.2
6.5
6.9
6.9
6.6
10.3
5.6
2.5
2.1
1.6
1.6
12.0
8.0
8.0
8.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
TSSOP
TSSOP
PW
PW
5.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC157DBR
SN74HC157DR
SN74HC157PWR
SN74HC157PWT
SSOP
SOIC
DB
D
16
16
16
16
2000
2500
2000
250
367.0
333.2
367.0
367.0
367.0
345.9
367.0
367.0
38.0
28.6
35.0
35.0
TSSOP
TSSOP
PW
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Applications
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Copyright © 2013, Texas Instruments Incorporated
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