SN54HC191TDE2 [TI]
4 位同步加/减二进制计数器 | TD | 0 | 25 to 25;
| 型号： | SN54HC191TDE2 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4 位同步加/减二进制计数器 | TD | 0 | 25 to 25 逻辑集成电路 触发器 计数器 |
| 文件： | 总6页 (文件大小：416K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Sample &
Buy
Support &
Community
Product
Folder
Tools &
Software
Technical
Documents
SN54HC191-DIE
ZHCSC96 –MARCH 2014
SN54HC191-DIE 4 位同步加/减二进制计数器
1
1 特性
•
•
•
•
•
•
•
宽工作电压范围
这些计数器特有一个完全独立的时钟电路。 改变运行
模式的控制（CTEN 和 D/U）输入上的变化对于计数
器在计时发生前的内容没有影响。 计数器的功能只能
由符合稳定设置和保持时间要求的条件控制。
低功耗
低输入电流
单条加/减计数控制线路
前瞻电路提高了级联计数器的速度
计数模式下的完全同步
异步可预先设定的负载控制
这些计数器是完全可编程的；也就是说，通过在负载
(LOAD) 输入上放置一个低电平，并且在数据输入上敲
入所需的数据可将每个输出预先设定为其中任一电平。
输出变化为与数据输入一致，而这一变化与 CLK 电平
无关。 这个特性使这些计数器可被用作模块化 N 驱动
器，只需用预先设定的输入修改计数长度。
2 说明
SN54HC191-DIE 是一款 4 位同步，可逆的，加/减二
进制计数器。 通过使所有触发电路同时计时来提供同
步计数运行，这样，当控制计数方向的逻辑电路发出指
令时，输出变化相互间保持一致。 这个运行模式消除
了通常与异步（纹波时钟）计数器相关的输出计数尖
峰。
可提供两个输出来执行级联功能：纹波时钟 (RCO) 和
最大/最小 (MAX/MIN) 计数。 在计数为零（所有输出
低电平）下计数，或者最大（9 或 15）上计数
时，MAX/MIN 产生一个持续时间大致等于一个完整时
钟周期的高电平输出脉冲。 RCO 在同样的条件下产生
一个低电平输出脉冲，但仅限于 CLK 为低位的情况
下。 如果使用并行计时，可通过将 RCO 馈入随后计
数器的 CTEN 来轻松实现计数器级联，或者在使用并
行启用时馈入 CLK 来实现计数器级联。 MAX/MIN 可
为高速运行提供前瞻性。
如果计数-使能 (CTEN) 输入为低位，四个触发电路的
输出在时钟 (CLK) 输入从低电平向高电平转换时触
发。 CTEN 位于高位时禁止计数操作。 计数的方向由
向下/向上 (D/U) 输入的电平决定。 当 D/U 为低位时，
计数器作加计数，而当 D/U 为高位时，计数器作减计
数。
Ordering Information(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN54HC191TDE1
SN54HC191TDE2
154
10
SN54HC191
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SCLS748
SN54HC191-DIE
ZHCSC96 –MARCH 2014
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
3 Bare Die Information
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
Silicon with backgrind
10.5 mils.
Floating
TiW/AlCu2%
1199 nm
2
Copyright © 2014, Texas Instruments Incorporated
SN54HC191-DIE
www.ti.com.cn
ZHCSC96 –MARCH 2014
Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
1068.553
390.373
Y MAX
2818.613
2772.893
2115.033
1713.713
1375.893
255.753
255.753
255.753
311.633
311.633
626.593
1723.873
2013.433
2823.693
2823.693
2800.833
B
QB
1
2
968.527
290.347
285.267
310.667
310.667
310.667
978.687
1316.507
1819.427
2157.247
2263.927
2284.247
2284.247
2246.147
1809.267
1286.027
2718.587
2672.867
2015.007
1613.687
1275.867
155.727
155.727
155.727
211.607
211.607
526.567
1623.847
1913.407
2723.667
2723.667
2700.807
QA
3
385.293
CTEN
D/U
4
410.693
5
410.693
QC
6
410.693
QD
7
1078.713
1416.533
1919.453
2257.273
2363.953
2384.273
2384.273
2346.173
1909.293
1386.053
GND
D
8
9
C
10
11
12
13
14
15
16
LOAD
MAX/MIN
RCO
CLK
A
VCC
Copyright © 2014, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN54HC191TDE1
SN54HC191TDE2
ACTIVE
ACTIVE
0
0
154
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
25 to 25
25 to 25
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jun-2022
Addendum-Page 2
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
SN54HC191WR
HC/UH SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, CDFP16, CERAMIC, FP-16
TI
SN54HC192J-00
HC/UH SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, CDIP16, CERAMIC, DIP-16
TI
SN54HC193FK-00
HC/UH SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, CQCC20
TI
©2020 ICPDF网 联系我们和版权申明