SN54HC245WR [TI]
HC/UH SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20;型号: | SN54HC245WR |
厂家: | TEXAS INSTRUMENTS |
描述: | HC/UH SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 CD 输出元件 逻辑集成电路 |
文件: | 总22页 (文件大小:1171K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
D
D
D
Typical t = 12 ns
pd
High-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
6-mA Output Drive at 5 V
Low Input Current of 1 μA Max
Low Power Consumption, 80-μA Max I
CC
SN54HC245 . . . J OR W PACKAGE
SN74HC245 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HC245 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
3
2
1
20 19
18
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
4
5
6
7
8
17
16
15
14
9 10 11 12 13
GND
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses are effectively isolated.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HC245N
SN74HC245N
SN74HC245DW
SN74HC245DWR
SN74HC245NSR
SN74HC245DBR
SN74HC245PW
SN74HC245PWR
SN74HC245PWT
SNJ54HC245J
SOIC − DW
HC245
SOP − NS
HC245
HC245
−40°C to 85°C
SSOP − DB
TSSOP − PW
HC245
CDIP − J
CFP − W
LCCC − FK
SNJ54HC245J
SNJ54HC245W
SNJ54HC245FK
−55°C to 125°C
SNJ54HC245W
SNJ54HC245FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
FUNCTION TABLE
INPUTS
OPERATION
OE
L
DIR
L
B data to A bus
A data to B bus
Isolation
L
H
H
X
logic diagram (positive logic)
1
DIR
19
18
OE
B1
2
A1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O
O
CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
O
O
CC
Continuous current through V or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
CC
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC245
MIN NOM
SN74HC245
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
CC
V
CC
0
0
V
CC
V
CC
V
V
I
Output voltage
O
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
Δt/Δv
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC245
SN74HC245
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 μA
OH
5.9
V
V = V or V
V
OH
I
IH
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
OL
= 20 μA
0.1
0.1
V
OL
V = V or V
V
I
IH
IL
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
DIR or OE V = V or 0
6 V
1000
10
nA
μA
μA
pF
I
I
CC
A or B
V
O
= V or 0
6 V
0.01
OZ
CC
CC
V = V or 0,
I
O
= 0
6 V
160
10
80
I
CC
C
DIR or OE
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
40
SN54HC245
SN74HC245
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
105
21
MIN
MAX
160
32
MIN
MAX
130
26
2 V
4.5 V
6 V
15
t
t
t
t
A or B
OE
B or A
A or B
A or B
A or B
ns
pd
12
18
27
22
2 V
125
23
230
46
340
68
290
58
4.5 V
6 V
ns
ns
ns
en
20
39
58
49
2 V
74
200
40
300
60
250
50
4.5 V
6 V
25
OE
dis
21
34
51
43
2 V
20
60
90
75
4.5 V
6 V
8
12
18
15
t
6
10
15
13
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
54
SN54HC245
SN74HC245
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
135
27
MIN
MAX
200
40
MIN
MAX
170
34
2 V
4.5 V
6 V
18
t
pd
t
en
t
t
A or B
OE
B or A
A or B
A or B
ns
15
23
34
29
2 V
150
31
270
54
405
81
335
67
4.5 V
6 V
ns
ns
25
46
69
56
2 V
45
210
42
315
63
265
53
4.5 V
6 V
17
13
36
53
45
operating characteristics, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per transceiver
No load
40
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
S1
S2
L
L
50 pF
or
150 pF
t
S1
S2
Open
Closed
Closed
Open
PZH
Test
Point
t
1 kΩ
1 kΩ
en
R
L
t
From Output
Under Test
PZL
t
Open
Closed
Open
PHZ
t
50 pF
C
dis
L
t
Closed
PLZ
(see Note A)
50 pF
or
t
or t
−−
Open
Open
pd
t
150 pF
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PHL
PLH
V
V
OH
In-Phase
Output
90%
90%
50%
10%
50%
10%
OL
t
Output
Control
t
r
f
V
CC
t
t
PLH
PHL
50%
50%
(Low-Level
Enabling)
V
V
OH
90%
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
f
r
≈V
50%
Output
Waveform 1
(See Note B)
CC
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
V
OL
t
t
PHZ
PZH
V
CC
V
Output
Waveform 2
(See Note B)
OH
90%
t
90%
90%
Input
50%
10%
50%
10%
50%
0 V
≈0 V
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
.
PLZ
PZL
PLH
PHZ
dis
are the same as t
PZH
en
are the same as t .
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-8408501VRA
ACTIVE
CDIP
CFP
J
20
20
20
1
TBD
TBD
TBD
A42
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
5962-8408501VR
A
SNV54HC245J
5962-8408501VSA
84085012A
ACTIVE
ACTIVE
W
1
1
-55 to 125
-55 to 125
5962-8408501VS
A
SNV54HC245W
LCCC
FK
POST-PLATE
84085012A
SNJ54HC
245FK
8408501RA
8408501SA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
J
20
20
20
20
20
20
20
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
A42
Call TI
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
8408501RA
SNJ54HC245J
8408501SA
SNJ54HC245W
JM38510/65503BRA
JM38510/65503BSA
M38510/65503BRA
M38510/65503BSA
SN54HC245J
CDIP
CFP
JM38510/
65503BRA
W
J
Call TI
A42
JM38510/
65503BSA
CDIP
CFP
JM38510/
65503BRA
W
J
Call TI
A42
JM38510/
65503BSA
CDIP
TBD
TBD
SN54HC245J
SN74HC245DBLE
SN74HC245DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
20
20
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC245
HC245
HC245
HC245
HC245
SN74HC245DBRE4
SN74HC245DBRG4
SN74HC245DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
DB
DB
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
DW
DW
Green (RoHS
& no Sb/Br)
SN74HC245DWE4
25
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC245DWG4
SN74HC245DWR
SN74HC245DWRE4
SN74HC245DWRG4
SN74HC245N
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
DW
20
20
20
20
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC245
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DW
DW
DW
N
2000
2000
2000
20
Green (RoHS
& no Sb/Br)
-40 to 85
HC245
Green (RoHS
& no Sb/Br)
-40 to 85
HC245
Green (RoHS
& no Sb/Br)
-40 to 85
HC245
Pb-Free
(RoHS)
-40 to 85
SN74HC245N
SN74HC245N3
SN74HC245NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
-40 to 85
-40 to 85
20
2000
2000
2000
70
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC245N
HC245
SN74HC245NSR
SN74HC245NSRE4
SN74HC245NSRG4
SN74HC245PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
20
20
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
HC245
SO
Green (RoHS
& no Sb/Br)
HC245
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
HC245
SN74HC245PWE4
SN74HC245PWG4
70
Green (RoHS
& no Sb/Br)
HC245
70
Green (RoHS
& no Sb/Br)
HC245
SN74HC245PWLE
SN74HC245PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC245
HC245
HC245
HC245
HC245
SN74HC245PWRE4
SN74HC245PWRG4
SN74HC245PWT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC245PWTE4
250
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC245PWTG4
SNJ54HC245FK
ACTIVE
TSSOP
LCCC
PW
20
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC245
ACTIVE
FK
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84085012A
SNJ54HC
245FK
SNJ54HC245J
SNJ54HC245W
ACTIVE
ACTIVE
CDIP
CFP
J
20
20
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8408501RA
SNJ54HC245J
W
Call TI
8408501SA
SNJ54HC245W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC245, SN54HC245-SP, SN74HC245 :
Catalog: SN74HC245, SN54HC245
•
Military: SN54HC245
•
Space: SN54HC245-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC245DBR
SN74HC245DWR
SN74HC245NSR
SN74HC245PWR
SN74HC245PWT
SSOP
SOIC
DB
DW
NS
20
20
20
20
20
2000
2000
2000
2000
250
330.0
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
16.4
8.2
10.8
8.2
7.5
13.3
13.0
7.1
2.5
2.7
2.5
1.6
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
SO
TSSOP
TSSOP
PW
PW
6.95
6.95
7.1
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC245DBR
SN74HC245DWR
SN74HC245NSR
SN74HC245PWR
SN74HC245PWT
SSOP
SOIC
DB
DW
NS
20
20
20
20
20
2000
2000
2000
2000
250
367.0
367.0
367.0
364.0
367.0
367.0
367.0
367.0
364.0
367.0
38.0
45.0
45.0
27.0
38.0
SO
TSSOP
TSSOP
PW
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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相关型号:
SN54HC253FKR
HC/UH SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20
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