SN54HC367FK-00 [TI]
HC/UH SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20;
| 型号： | SN54HC367FK-00 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, 6-BIT DRIVER, TRUE OUTPUT, CQCC20 驱动 输出元件 逻辑集成电路 |
| 文件： | 总20页 (文件大小：931K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
SN54HC367 . . . J OR W PACKAGE
SN74HC367 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Drive Bus
Lines, Buffer Memory Address Registers,
or Drive Up To 15 LSTTL Loads
1OE
1A1
1Y1
1A2
1Y2
1A3
1Y3
GND
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
2OE
2A2
2Y2
D
D
D
D
D
True Outputs
Low Power Consumption, 80-µA Max I
CC
Typical t = 10 ns
pd
6-mA Output Drive at 5 V
12 2A1
11
10
9
2Y1
1A4
1Y4
Low Input Current of 1 µA Max
description/ordering information
SN54HC367 . . . FK PACKAGE
(TOP VIEW)
These hex buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The ’HC367 devices are organized
as dual 4-line and 2-line buffers/drivers with
active-low output-enable (1OE and 2OE) inputs.
When OE is low, the device passes noninverted
data from the A inputs to the Y outputs. When OE
is high, the outputs are in the high-impedance
state.
3
2
1
20 19
18
2A2
2Y2
NC
1Y1
1A2
NC
4
5
6
7
8
17
16
15 2A1
14
9 10 11 12 13
1Y2
1A3
2Y1
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Reel of 2000
Tube of 90
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC367N
SN74HC367N
SN74HC367D
SN74HC367DR
SN74HC367DT
SN74HC367NSR
SN74HC367PW
SN74HC367PWR
SN74HC367PWT
SNJ54HC367J
SNJ54HC367W
SNJ54HC367FK
SOIC − D
SOP − NS
HC367
HC367
−40°C to 85°C
TSSOP − PW
HC367
CDIP − J
CFP − W
LCCC − FK
SNJ54HC367J
SNJ54HC367W
SNJ54HC367FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢄ ꢊꢋ ꢌ ꢍꢎ ꢎ ꢊ ꢏꢀ ꢐꢁ ꢑ ꢒꢓ ꢁ ꢊ ꢑꢏ ꢓ ꢔꢊ ꢏꢀ
ꢕꢓ ꢖ ꢄ ꢆ ꢗꢀꢖꢐꢖ ꢊ ꢘꢍꢖ ꢙ ꢍꢖꢀ
SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
X
H
L
H
L
L
Z
H
L
logic diagram (positive logic)
1
15
1OE
2OE
2A1
2
3
12
11
1A1
1Y1
2Y1
To Three Other Channels
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
To One Other Channel
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 3)
SN54HC367
MIN NOM
SN74HC367
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC367
SN74HC367
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V = V or V
IH
V
OH
OL
I
IL
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V
V = V or V
V
I
IH
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
I
or 0
6 V
1000
10
nA
µA
µA
pF
I
CC
V
O
= V
or 0
6 V
0.01
OZ
CC
CC
V = V
I
or 0,
I
O
= 0
6 V
160
10
80
CC
C
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢈ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢄ ꢊꢋ ꢌ ꢍꢎ ꢎ ꢊ ꢏꢀ ꢐꢁ ꢑ ꢒꢓ ꢁ ꢊ ꢑꢏ ꢓ ꢔꢊ ꢏꢀ
ꢕꢓ ꢖ ꢄ ꢆ ꢗꢀꢖꢐꢖ ꢊ ꢘꢍꢖ ꢙ ꢍꢖꢀ
SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
50
SN54HC367
SN74HC367
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
95
MIN
MAX
145
29
MIN
MAX
120
24
2 V
4.5 V
6 V
12
19
t
t
t
t
A
Y
Y
ns
pd
en
dis
t
10
16
25
20
2 V
100
26
190
38
285
57
238
48
4.5 V
6 V
OE
OE
ns
ns
ns
21
32
48
41
2 V
50
175
35
265
53
240
48
4.5 V
6 V
21
Y
19
30
45
41
2 V
28
60
90
75
Any
4.5 V
6 V
8
12
18
15
6
10
15
13
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
70
SN54HC367
SN74HC367
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
120
24
MIN
MAX
180
36
MIN
MAX
150
30
2 V
4.5 V
6 V
17
t
t
t
A
Y
Y
ns
pd
en
t
14
20
31
25
2 V
140
30
230
46
345
69
285
57
4.5 V
6 V
OE
ns
ns
28
39
59
48
2 V
45
210
42
315
63
265
53
Any
4.5 V
6 V
17
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
No load
35
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢕ ꢓꢖ ꢄ ꢆ ꢗꢀꢖꢐꢖ ꢊ ꢘ ꢍꢖ ꢙꢍ ꢖ
SCLS309D − JANUARY 1996 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
t
S1
S2
Open
Closed
Closed
Open
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
L
t
t
t
From Output
Under Test
PZL
PHZ
PLZ
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PLH
PHL
90%
V
V
OH
In-Phase
Output
90%
50%
10%
50%
10%
OL
t
Output
Control
(Low-Level
Enabling)
t
r
f
f
V
CC
t
t
PLH
PHL
90%
50%
50%
V
V
OH
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
≈V
CC
r
Output
Waveform 1
(See Note B)
50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
V
OL
OH
t
t
PZH
PHZ
V
CC
V
Output
Waveform 2
(See Note B)
90%
t
90%
90%
Input
50%
10%
50%
10%
50%
0 V
≈0 V
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
pd
PLH
PLZ
PZL
PHL
PHZ
PZH
are the same as t
are the same as t .
.
dis
en
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
85002012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85002012A
SNJ54HC
367FK
8500201EA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
J
J
16
16
16
16
16
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
8500201EA
SNJ54HC367J
JM38510/65708BEA
JM38510/65708BFA
M38510/65708BEA
M38510/65708BFA
JM38510/
65708BEA
W
J
JM38510/
65708BFA
CDIP
CFP
JM38510/
65708BEA
W
JM38510/
65708BFA
SN54HC367J
SN74HC367D
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC367J
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC367
SN74HC367DE4
SN74HC367DG4
SN74HC367DR
SN74HC367DRE4
SN74HC367DRG4
SN74HC367DT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
D
D
D
D
D
D
D
D
N
16
16
16
16
16
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HC367
Green (RoHS
& no Sb/Br)
HC367
2500
2500
2500
250
250
250
25
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
SN74HC367DTE4
SN74HC367DTG4
SN74HC367N
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Pb-Free
(RoHS)
SN74HC367N
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC367NE4
SN74HC367NSR
SN74HC367NSRE4
SN74HC367NSRG4
SN74HC367PW
ACTIVE
PDIP
SO
N
16
16
16
16
16
16
16
16
16
16
16
16
16
20
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
SN74HC367N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NS
NS
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
SO
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
PW
PW
PW
PW
PW
PW
PW
PW
FK
Green (RoHS
& no Sb/Br)
SN74HC367PWE4
SN74HC367PWG4
SN74HC367PWR
SN74HC367PWRE4
SN74HC367PWRG4
SN74HC367PWT
SN74HC367PWTE4
SN74HC367PWTG4
SNJ54HC367FK
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
85002012A
SNJ54HC
367FK
SNJ54HC367J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8500201EA
SNJ54HC367J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC367, SN74HC367 :
Catalog: SN74HC367
•
Military: SN54HC367
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC367DR
SN74HC367NSR
SN74HC367PWR
SN74HC367PWT
SOIC
SO
D
16
16
16
16
2500
2000
2000
250
330.0
330.0
330.0
330.0
16.4
16.4
12.4
12.4
6.5
8.2
6.9
6.9
10.3
10.5
5.6
2.1
2.5
1.6
1.6
8.0
12.0
8.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
NS
PW
PW
TSSOP
TSSOP
5.6
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC367DR
SN74HC367NSR
SN74HC367PWR
SN74HC367PWT
SOIC
SO
D
16
16
16
16
2500
2000
2000
250
333.2
367.0
367.0
367.0
345.9
367.0
367.0
367.0
28.6
38.0
35.0
35.0
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
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