SN54HCT139_06 [TI]
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS; 双路2号线至4线解码器/多路解复用器
| 型号： | SN54HCT139_06 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS |
| 文件： | 总11页 (文件大小：299K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢊ ꢀꢁ ꢋꢃ ꢄꢅ ꢆꢇ ꢈꢉ
ꢌꢍꢎ ꢏ ꢐ ꢑꢏ ꢒꢁꢓ ꢆ ꢔ ꢃ ꢑꢏ ꢒꢁꢓ ꢌꢓꢅ ꢔꢌ ꢓꢕꢀꢖ ꢌꢓꢗ ꢍꢏꢆ ꢒ ꢘꢏ ꢓꢙ ꢓ ꢕꢀ
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
SN54HCT139 . . . J OR W PACKAGE
SN74HCT139 . . . D, DB, N, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
D
Operating Voltage Range of 4.5 V to 5.5 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-µA Max I
CC
1G
1A
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
Typical t = 10 ns
pd
4-mA Output Drive at 5 V
2G
2A
2B
1B
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
1Y0
1Y1
1Y2
1Y3
GND
12 2Y0
Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
11
10
9
2Y1
2Y2
2Y3
D
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
SN54HCT139 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
The ’HCT139 devices are designed for
high-performance memory-decoding or
3
2
1
20 19
18
2A
2B
NC
1B
1Y0
NC
4
5
6
7
8
data-routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can minimize
the effects of system decoding. When employed
with high-speed memories utilizing a fast enable
circuit, the delay time of these decoders and the
enable time of the memory usually are less than
the typical access time of the memory. This means
that the effective system delay introduced by the
decoders is negligible.
17
16
15 2Y0
14
9 10 11 12 13
1Y1
1Y2
2Y1
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HCT139N
SN74HCT139N
SN74HCT139D
SN74HCT139DR
SN74HCT139DT
SN74HCT139DBR
SN74HCT139PWR
SN74HCT139PWT
SNJ54HCT139J
SNJ54HCT139W
SNJ54HCT139FK
HCT139
−40°C to 85°C
SSOP − DB
HT139
HT139
TSSOP − PW
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT139J
SNJ54HCT139W
−55°C to 125°C
SNJ54HCT139FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
ꢍ ꢁ ꢏꢓꢀꢀ ꢔ ꢆꢄ ꢓꢕꢚ ꢒꢀ ꢓ ꢁ ꢔꢆꢓꢌ ꢛꢜ ꢝꢞ ꢟꢠꢡ ꢢꢣꢤ ꢥꢛ ꢡꢠ ꢥꢛꢦ ꢝꢥꢞ ꢘꢕ ꢔ ꢌ ꢍ ꢅꢆ ꢒꢔ ꢁ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢊ ꢀꢁꢋ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ
ꢌ ꢍꢎꢏ ꢐ ꢑꢏ ꢒ ꢁꢓ ꢆꢔ ꢃ ꢑꢏꢒ ꢁ ꢓ ꢌꢓ ꢅꢔ ꢌꢓ ꢕꢀ ꢖ ꢌꢓ ꢗ ꢍꢏꢆ ꢒꢘ ꢏꢓ ꢙꢓꢕꢀ
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
The ’HCT139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low
enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers
feature fully buffered inputs, each of which represents only one normalized load to its driving circuit.
FUNCTION TABLE
INPUTS
OUTPUTS
SELECT
G
B
X
L
A
X
L
Y0
H
L
Y1
H
H
L
Y2
H
H
H
L
Y3
H
H
H
H
L
H
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
H
logic diagram (positive logic)
4
5
1Y0
1Y1
1Y2
1Y3
1
1G
6
2
1A
7
3
1B
12
11
10
9
2Y0
2Y1
15
2G
2Y2
2Y3
14
2A
13
2B
Pin numbers shown are for the D, DB, J, N, PW, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ ꢊ ꢀꢁ ꢋꢃ ꢄꢅ ꢆꢇ ꢈꢉ
ꢌꢍꢎ ꢏ ꢐ ꢑꢏ ꢒꢁꢓ ꢆ ꢔ ꢃ ꢑꢏ ꢒꢁꢓ ꢌꢓꢅ ꢔꢌ ꢓꢕꢀꢖ ꢌꢓꢗ ꢍꢏꢆ ꢒ ꢘꢏ ꢓꢙ ꢓ ꢕꢀ
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT139
MIN NOM MAX
SN74HCT139
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
t
Input transition (rise and fall) time
Operating free-air temperature
500
125
500
85
ns
°C
t
T
−55
−40
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT139 SN74HCT139
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −4 mA
= 20 µA
= 4 mA
4.4 4.499
OH
OH
OL
OL
V
V
V = V or V
IH
4.5 V
4.5 V
OH
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
8
0.1
0.4
0.1
0.33
1000
80
V = V or V
V
OL
I
IH
IL
I
I
V = V
I
or 0
5.5 V
5.5 V
1000
160
nA
I
CC
V = V
I
or 0,
I
O
= 0
µA
CC
CC
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
‡
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
‡
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
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3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢊ ꢀꢁꢋ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉ
ꢌ ꢍꢎꢏ ꢐ ꢑꢏ ꢒ ꢁꢓ ꢆꢔ ꢃ ꢑꢏꢒ ꢁ ꢓ ꢌꢓ ꢅꢔ ꢌꢓ ꢕꢀ ꢖ ꢌꢓ ꢗ ꢍꢏꢆ ꢒꢘ ꢏꢓ ꢙꢓꢕꢀ
SCLS066D − MARCH 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
14
SN54HCT139 SN74HCT139
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
34
MIN
MAX
51
MIN
MAX
43
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
A or B
G
Y
Y
Y
12
30
50
40
t
t
pd
11
34
51
43
10
30
50
40
8
15
22
19
ns
t
6
14
21
17
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per decoder
No load
25
pF
pd
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
From Output
Under Test
Test
Point
Input
1.3 V
1.3 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
1.3 V
10%
1.3 V
LOAD CIRCUIT
10%
t
OL
r
f
f
t
t
PLH
PHL
90%
3 V
0 V
V
V
OH
2.7 V
2.7 V
Input
1.3 V
0.3 V
1.3 V
0.3 V
90%
t
Out-of-Phase
Output
1.3 V
10%
1.3 V
10%
OL
t
t
t
r
f
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D.
t
and t
PHL
are the same as t .
pd
PLH
Figure 1. Load Circuit and Voltage Waveforms
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4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74HCT139D
ACTIVE
SOIC
D
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT139DBLE
SN74HCT139DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT139DBRE4
SN74HCT139DE4
SN74HCT139DR
SN74HCT139DRE4
SN74HCT139DT
SN74HCT139DTE4
SN74HCT139N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DB
D
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT139NE4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT139PWLE
SN74HCT139PWR
OBSOLETE TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT139PWRE4
SN74HCT139PWT
PW
PW
PW
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT139PWTE4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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