SN54S140J-00 [TI]

IC S SERIES, DUAL 4-INPUT NAND GATE, CDIP14, Gate;
SN54S140J-00
型号: SN54S140J-00
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

IC S SERIES, DUAL 4-INPUT NAND GATE, CDIP14, Gate

栅 CD 输入元件 逻辑集成电路
文件: 总16页 (文件大小:859K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢀ ꢄ ꢃ ꢅꢆ ꢀ ꢁꢇ ꢃꢀ ꢄꢃ ꢅ  
ꢈꢉꢊ ꢋ ꢃ ꢌꢍꢁ ꢎꢉꢏ ꢎꢐ ꢀꢍ ꢏ ꢍꢑꢒ ꢌꢁꢊꢁꢈ ꢂ ꢅ ꢌꢐ ꢓꢔ ꢋ ꢍꢁꢒ ꢈ ꢕꢍ ꢑ ꢒꢕ ꢀ  
SDLS210 − DECEMBER 1983 − REVISED MARCH 1988  
ꢏꢢ  
Copyright 1988, Texas Instruments Incorporated  
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢀꢄ ꢃ ꢅ ꢆ ꢀꢁ ꢇ ꢃ ꢀꢄ ꢃ ꢅ  
ꢈꢉ ꢊ ꢋ ꢃ ꢌꢍ ꢁꢎ ꢉꢏ ꢎꢐ ꢀꢍ ꢏ ꢍ ꢑꢒ ꢌꢁ ꢊꢁꢈ ꢂ ꢅ ꢌꢐꢓ ꢔ ꢋ ꢍꢁꢒ ꢈꢕꢍ ꢑꢒ ꢕꢀ  
SDLS210 − DECEMBER 1983 − REVISED MARCH 1988  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢀ ꢄ ꢃ ꢅꢆ ꢀ ꢁꢇ ꢃꢀ ꢄꢃ ꢅ  
ꢈꢉꢊ ꢋ ꢃ ꢌꢍꢁ ꢎꢉꢏ ꢎꢐ ꢀꢍ ꢏ ꢍꢑꢒ ꢌꢁꢊꢁꢈ ꢂ ꢅ ꢌꢐ ꢓꢔ ꢋ ꢍꢁꢒ ꢈ ꢕꢍ ꢑ ꢒꢕ ꢀ  
SDLS210 − DECEMBER 1983 − REVISED MARCH 1988  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
JM38510/08101BCA  
JM38510/08101BDA  
JM38510/08101BDA  
M38510/08101BCA  
M38510/08101BCA  
M38510/08101BDA  
M38510/08101BDA  
SN54S140J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
W
W
J
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
A42  
A42  
A42  
A42  
A42  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CFP  
1
CDIP  
CDIP  
CFP  
1
J
1
W
W
J
1
CFP  
1
CDIP  
CDIP  
SOIC  
1
SN54S140J  
J
1
SN74S140D  
D
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
SN74S140D  
SN74S140DE4  
SN74S140DE4  
SN74S140DG4  
SN74S140DG4  
SN74S140DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
50  
50  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
50  
Green (RoHS  
& no Sb/Br)  
50  
Green (RoHS  
& no Sb/Br)  
50  
Green (RoHS  
& no Sb/Br)  
2500  
2500  
2500  
2500  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
SN74S140DR  
Green (RoHS  
& no Sb/Br)  
SN74S140DRE4  
SN74S140DRE4  
SN74S140DRG4  
SN74S140DRG4  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
SN74S140N  
SN74S140N  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
SO  
N
N
14  
14  
14  
14  
14  
14  
14  
25  
25  
Pb-Free (RoHS)  
Pb-Free (RoHS)  
TBD  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
SN74S140N3  
SN74S140N3  
SN74S140NE4  
SN74S140NE4  
SN74S140NSR  
OBSOLETE  
OBSOLETE  
ACTIVE  
N
Call TI  
Call TI  
Call TI  
Call TI  
N
TBD  
N
25  
25  
Pb-Free (RoHS)  
Pb-Free (RoHS)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU Level-1-260C-UNLIM  
ACTIVE  
N
ACTIVE  
NS  
2000  
Green (RoHS  
& no Sb/Br)  
SN74S140NSR  
SN74S140NSRE4  
SN74S140NSRE4  
SN74S140NSRG4  
SN74S140NSRG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
SO  
SO  
SO  
NS  
NS  
NS  
NS  
NS  
14  
14  
14  
14  
14  
2000  
2000  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SNJ54S140FK  
SNJ54S140FK  
SNJ54S140J  
SNJ54S140J  
SNJ54S140W  
SNJ54S140W  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
FK  
FK  
J
20  
20  
14  
14  
14  
14  
1
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
CFP  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54S140, SN74S140 :  
Catalog: SN74S140  
Military: SN54S140  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74S140DR  
SOIC  
SO  
D
14  
14  
2500  
2000  
330.0  
330.0  
16.4  
16.4  
6.5  
8.2  
9.0  
2.1  
2.5  
8.0  
16.0  
16.0  
Q1  
Q1  
SN74S140NSR  
NS  
10.5  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74S140DR  
SOIC  
SO  
D
14  
14  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
SN74S140NSR  
NS  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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