SN55LBC173TDA2 [TI]
四路低功耗差分接收器 | TD | 0 | 25 to 25;
| 型号： | SN55LBC173TDA2 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 四路低功耗差分接收器 | TD | 0 | 25 to 25 信息通信管理 接口集成电路 |
| 文件： | 总6页 (文件大小：339K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN55LBC173-DIE
www.ti.com.cn
ZHCSB71 –JUNE 2013
四路低功耗差动接收器
查询样品: SN55LBC173-DIE
1
特性
2
•
符合 EIA 标准 RS-422-A，RS-423-A，
RS-485 和 CCITT V.11
•
•
低功耗
开电路故障安全设计
•
•
被设计成支持脉冲时长运行
针对嘈杂环境中的长距离总线线路上的多点总线传
输
说明
SN55LBC173-DIE 是一款具有 3 态输出的单片四路差动线路接收器，此接收器被设计成符合 EIA 标准 RS-422-
A，RS-423-A，RS-485 和 CCITT V.11。 这个器件在数据速率方面针对均衡多点总线传输进行了优化。 4 个接收
器共用 2 个进行或操作的使能输入，一个在高电平时有效，一个在低电平时有效。 每个接收器特有用来增加抗扰
度的高输入阻抗、输入滞后。 故障安全设计确保了在输入为开电路时，输出一直为高电平。 SN55LBC173-DIE 使
用德州仪器 (TI) 已获专利的 LinBiCMOSE™ 技术进行设计，这个技术提供了低功耗、高开关速度和稳健耐用性。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN55LBC173TDA1
SN55LBC173TDA2
100
10
SN55LBC173
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
LinBiCMOSE is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SGLS413
SN55LBC173-DIE
ZHCSB71 –JUNE 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AlSi(1%)Cu(0.5%)TiW
1850 nm
2
Copyright © 2013, Texas Instruments Incorporated
SN55LBC173-DIE
www.ti.com.cn
ZHCSB71 –JUNE 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
626.5
Y MIN
1695
1690.7
1432.1
614.1
392.1
132
X MAX
740.5
323
Y MAX
1809.5
1791.3
1539
1B
1A
1Y
G
1
2
222.5
3
167.9
274.8
278.3
273.5
379.7
805.3
1066.7
1337.7
1727.2
1865.6
1865.4
1857
4
171.4
721
2Y
2A
2B
GND
3B
3A
3Y
G
5
166.6
499
6
279.2
232.6
232.6
232.6
232.6
232.6
510.6
855.9
1515.3
1799
7
704.8
132
8
966.2
132
9
1237.2
1626.7
1758.7
1758.5
1750.1
1702.2
1296.7
1024.2
132
10
11
12
13
14
15
16
132
403.7
749
4Y
4A
4B
VCC
1408.4
1698.4
1698.4
1671.9
1802.7
1397.2
1124.7
1799
1772.5
Copyright © 2013, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN55LBC173TDA1
SN55LBC173TDA2
ACTIVE
ACTIVE
0
0
100
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
25 to 25
25 to 25
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2022
Addendum-Page 2
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
©2020 ICPDF网 联系我们和版权申明