SN65HVD251DRG4 [TI]

CAN TRANSCEIVER; CAN收发器
SN65HVD251DRG4
型号: SN65HVD251DRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CAN TRANSCEIVER
CAN收发器

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中文:  中文翻译
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SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
CAN TRANSCEIVER  
Designed for operation in harsh environments, the  
device features cross-wire, over-voltage and loss of  
ground protection to ±36 V. Also featured are  
over-temperature protection as well as -7 V to 12 V  
common-mode range, and tolerance to transients of  
±200 V. The transceiver interfaces the single-ended  
CAN controller with the differential CAN bus found in  
industrial, building automation, and automotive appli-  
cations.  
FEATURES  
Drop-In Improved Replacement for the  
PCA82C250 and PCA82C251  
Bus-Fault Protection of ±36 V  
Meets or Exceeds ISO 11898  
Signaling Rates(1) Up to 1 Mbps  
High Input Impedance Allows up to 120  
SN65HVD251 Nodes on a Bus  
Bus Pin ESD Protection Exceeds 14 kV HBM  
Unpowered Node Does Not Disturb the Bus  
Low-Current Standby Mode — 200 µA Typical  
Thermal Shutdown Protection  
Glitch-Free Power-Up and Power-Down Bus  
Protection For Hot-Plugging  
Rs, pin 8, selects one of three different modes of  
operation: high-speed, slope control, or low-power  
mode. The high-speed mode of operation is selected  
by connecting pin 8 to ground, allowing the transmit-  
ter output transistors to switch as fast as possible  
with no limitation on the rise and fall slope. The rise  
and fall slope can be adjusted by connecting a  
resistor to ground at pin 8; the slope is proportional to  
the pin's output current. Slope control with an external  
resistor value of 10 kgives ~ 15 V/us slew rate; 100  
kgives ~ 2 V/us slew rate.  
(1)  
DeviceNet Vendor ID # 806  
The signaling rate of a line is the number of voltage transitions  
that are made per second expressed in bps (bits per second).  
If a high logic level is applied to the Rs pin 8, the  
device enters a low-current standby mode where the  
driver is switched off and the receiver remains active.  
The local protocol controller returns the device to the  
normal mode when it transmits to the bus.  
APPLICATIONS  
CAN Data Buses  
Industrial Automation  
– DeviceNet™ Data Buses  
– Smart Distributed Systems (SDS™)  
SAE J1939 Standard Data Bus Interface  
NMEA 2000 Standard Data Bus Interface  
ISO 11783 Standard Data Bus Interface  
The SN65HVD251 may be used in CAN,  
DeviceNet™ or SDS™ applications with the Texas  
Instruments' TMS320F241 and TMS320F243 DSPs  
with CAN 2.0B controllers.  
function diagram  
(positive logic)  
DESCRIPTION  
3
5
The SN65HVD251 is intended for use in applications  
employing the Controller Area Network (CAN) serial  
communication physical layer in accordance with the  
ISO 11898 Standard. The SN65HVD251 provides  
differential transmit capability to the bus and differen-  
tial receive capability to a CAN controller at speeds  
up to 1 megabits per second (Mbps).  
V
V
1
2
ref  
8
7
Rs  
D
CC  
GND  
CANH  
CANL  
Vref  
1
8
D
Vcc  
R
3
4
6
5
R
S
7
6
CANH  
CANL  
4
R
ORDERING INFORMATION  
PART NUMBER  
SN65HVD251D  
SN65HVD251DR  
SN65HVD251P  
PACKAGE  
8-pin SOIC (Tube)  
8-pin SOIC (Tape & Reel)  
8-pin DIP  
MARKED AS  
VP251  
VP251  
65HVD251  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
DeviceNet is a trademark of Allen-Bradley.  
SDS is a trademark of Honeywell.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
These devices have limited built-in ESD protection. The leads should be shorted together or the device  
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range unless otherwise noted(1)(2)  
SN65HVD251  
Supply voltage range, VCC  
-0.3 V to 7 V  
-36 V to 36 V  
±200 V  
Voltage range at any bus terminal (CANH or CANL)  
Transient voltage per ISO 7637, pulse 1, 2, 3a, 3b  
Input voltage range, VI (D, Rs, or R)  
Receiver output current, IO  
CANH, CANL  
-0.3 V to VCC + 0.5  
–10 mA to 10 mA  
14 kV  
CANH, CANL and GND  
All pins  
(3)  
Human Body Model  
Electrostatic discharge  
6 kV  
(4)  
Charged-Device Model  
All pins  
1 kV  
Continuous total power dissipation  
(see Dissipation Rating  
Table)  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.  
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.  
(4) Tested in accordance with JEDEC Standard 22, Test Method C101.  
ABSOLUTE MAXIMUM POWER DISSIPATION RATINGS  
(1)  
CIRCUIT BOARD  
MODEL  
TA = 25°C  
POWER RATING  
DERATING FACTOR  
ABOVE TA = 25°C  
TA = 85°C POWER  
RATING  
TA = 125°C POWER  
RATING  
PACKAGE  
Low-K(2)  
High-K(3)  
Low-K(2)  
High-K(3)  
576 mW  
924 mW  
888 mW  
1212 mW  
4.8 mW/°C  
7.7 mW/°C  
7.4 mW/°C  
10.1 mW/°C  
288 mW  
462 mW  
444 mW  
606 mW  
96 mW  
154 mW  
148 mW  
202 mW  
SOIC (D)  
PDIP (P)  
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.  
(2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.  
(3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.  
THERMAL CHARACTERISTICS  
PARAMETER  
TEST CONDITIONS  
VALUE  
TYP  
78.7  
UNITS  
MIN  
MAX  
D
P
D
P
Θ
Θ
Junction-to-board thermal resistance  
Junction-to-case thermal resistance  
°C/W  
JB  
JC  
48.9  
44.6  
66.6  
°C/W  
mW  
VCC = 5 V, Tj = 27 °C, RL = 60,  
RS at 0 V, Input to D a 500-kHz  
50% duty cycle square wave  
97.7  
142  
PD  
Device power dissipation  
VCC = 5.5 V, Tj = 130°C, RL = 60,  
RS at 0 V, Input to D a 500-kHz 50%  
duty cycle square wave  
mW  
°C  
TSD  
Thermal shutdown junction temperature  
165  
2
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
RECOMMENDED OPERATING CONDITIONS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
Supply voltage, VCC  
MIN  
NOM  
MAX  
UNIT  
V
4.5  
-7(1)  
5.5  
12  
Voltage at any bus terminal (separately or common mode) VI or VIC  
V
High-level input voltage, VIH  
Low-level input voltage, VIL  
Differential input voltage, VID  
Input voltage to Rs, VI(Rs)  
D input  
D input  
0.7 VCC  
V
0.3 VCC  
6
V
-6  
V
0
VCC  
VCC  
100  
V
Input voltage at Rs for standby, VI(Rs)  
Rs wave-shaping resistance  
0.75 VCC  
V
0
-50  
-4  
kΩ  
Driver  
High-level output current, IOH  
mA  
Receiver  
Driver  
50  
4
Low-level output current, IOL  
Operating free-air temperature, TA  
Junction temperature, Tj  
mA  
°C  
Receiver  
-40  
125  
145  
145  
PDIP Package  
SOIC Package  
°C  
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.  
DRIVER ELECTRICAL CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN TYP( MAX UNIT  
1)  
CANH  
CANL  
CANH  
CANL  
2.75  
0.5  
2
3.5  
4.5  
2
Bus output voltage  
(Dominant)  
Figure 1 & Figure 2 ,  
D at 0 V Rs at 0 V  
VO(D)  
V
2.5  
2.5  
2
3
Bus output voltage  
(Recessive)  
VO(R)  
Figure 1 & Figure 2 , D at 0.7VCC , Rs at 0 V  
2
3
VOD(D)  
VOD(D)  
VOD(R)  
VOD(R)  
Differential output voltage (Dominant)  
Differential output voltage (Dominant)  
Differential output voltage (Recessive)  
Differential output voltage (Recessive)  
Figure 1 , D at 0 V, Rs at 0 V  
Figure 2 & Figure 3 , D at 0 V, Rs at 0 V  
Figure 1 & Figure 2 , D at 0.7 VCC  
D at 0.7 VCC, no load  
1.5  
1.2  
-120  
-0.5  
3
V
V
2
3.1  
12 mV  
0.05  
V
VOC(pp) Peak-to-peak common-mode output voltage  
Figure 9, Rs at 0 V  
600  
mV  
µA  
µA  
IIH  
IIL  
High-level input current, D Input  
Low-level input current, D Input  
D at 0.7 VCC  
-40  
-60  
0
0
D at 0.3 VCC  
Figure 11, VCANH at -7 V, CANL Open  
Figure 11, VCANH at 12 V, CANL Open  
Figure 11, VCANL at -7 V, CANH Open  
Figure 11, VCANL at 12 V, CANH Open  
See receiver input capacitance  
See receiver input current  
Rs at 0.75 VCC  
-200  
2.5  
IOS(SS)  
Short-circuit steady-state output current  
mA  
-2  
200  
CO  
Output capacitance  
IOZ  
High-impedance output current  
Rs input current for standby  
Rs input current for full speed operation  
Standby  
IIRs(s)  
IIRs(f)  
-10  
µA  
µA  
Rs at 0 V  
-550  
0
Rs at VCC, D at VCC  
275 µA  
ICC  
Supply current  
Dominant  
Recessive  
D at 0 V, 60load, Rs at 0 V  
D at VCC, no load, Rs at 0 V  
65  
mA  
14  
(1) All typical values are at 25°C and with a 5-V supply.  
3
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
DRIVER SWITCHING CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
40  
MAX UNIT  
Figure 4, Rs at 0 V  
70  
125  
800  
125  
260  
1450  
85  
tpLH  
tpHL  
tsk(p)  
Propagation delay time, low-to-high-level output  
Figure 4, Rs with 10 kto ground  
Figure 4, Rs with 100 kto ground  
Figure 4, Rs at 0 V  
90  
500  
85  
Propagation delay time, high-to-low-level output  
Pulse skew (|tpHL - tpLH|)  
Figure 4, Rs with 10 kto ground  
Figure 4, Rs with 100 kto ground  
Figure 4, Rs at 0 V  
200  
1150  
45  
Figure 4, Rs with 10 kto ground  
Figure 4, Rs with 100 kto ground  
110  
650  
180  
900  
100  
100  
250  
250  
1550  
1550  
0.5  
ns  
tr  
Differential output signal rise time  
Differential output signal fall time  
Differential output signal rise time  
Differential output signal fall time  
Differential output signal rise time  
Differential output signal fall time  
Enable time from standby to dominant  
35  
35  
Figure 4, Rs at 0 V  
tf  
tr  
100  
100  
600  
600  
Figure 4, Rs with 10 kto ground  
tf  
tr  
Figure 4, Rs with 100 kto ground  
tf  
ten  
Figure 8  
µs  
RECEIVER ELECTRICAL CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN TYP MAX UNIT  
VIT+ Positive-going input threshold voltage  
750 900  
VIT-  
Negative-going input threshold voltage  
Rs at 0 V, (See Table 1)  
500 650  
100  
mV  
Vhys Hysteresis voltage (VIT+ - VIT-  
)
VOH High-level output voltage  
Figure 6, IO = -4mA  
Figure 6, IO = 4mA  
CANH or CANL at 12 V  
0.8  
Vcc  
V
V
VOL Low-level output voltage  
0.2  
Vcc  
600  
Other bus  
pin at 0 V,  
Rs at 0 V,  
D at 0.7  
VCC  
CANH or CANL at 12 V,  
VCC at 0 V  
715  
II  
Bus input current  
µA  
CANH or CANL at -7 V  
-460  
-340  
CANH or CANL at -7 V,  
VCC at 0 V  
Pin-to-ground, VI = 0.4 sin (4E6πt) +  
0.5 V, D at 0.7 VCC  
pF  
pF  
CI  
Input capacitance, (CANH or CANL)  
Differential input capacitance  
20  
10  
Pin-to-pin, VI = 0.4 sin (4E6πt) + 0.5  
V, D at 0.7 VCC  
CID  
RID  
RIN  
Differential input resistance  
D at 0.7 VCC, Rs at 0 V  
D at 0.7 VCC, Rs at 0 V  
Rs at VCC, D at VCC  
40  
20  
100 kΩ  
50 kΩ  
275 µA  
Input resistance, (CANH or CANL)  
Standby  
ICC  
Supply current  
Dominant  
Recessive  
D at 0 V, 60Load, Rs at 0 V  
D at VCC, No Load, Rs at 0 V  
65  
mA  
14  
4
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
RECEIVER SWITCHING CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
35  
MAX  
50  
50  
20  
4
UNIT  
tpLH  
tpHL  
tsk(p)  
tr  
Propagation delay time, low-to-high-level output  
Propagation delay time, high-to-low-level output  
Pulse skew (|tpHL - tpLH|)  
35  
Figure 6  
ns  
Output signal rise time  
2
2
tf  
Output signal fall time  
4
tp(sb)  
Propagation delay time in standby  
Figure 12, Rs at VCC  
500  
VREF-PIN CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN  
0.45 VCC  
0.4 VCC  
TYP  
MAX  
0.55 VCC  
0.6 VCC  
UNIT  
-5 µA < IO < 5 µA  
VO  
Reference output voltage  
V
-50 µA < IO < 50 µA  
DEVICE SWITCHING CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
100  
150  
800  
150  
290  
1450  
145  
UNIT  
Figure 10, Rs at 0 V  
60  
100  
440  
115  
235  
1070  
105  
Total loop delay, driver input to receiver  
output, recessive to dominant  
tloop1  
Figure 10, Rs with 10 kto ground  
Figure 10, Rs with 100 kto ground  
Figure 10, Rs at 0 V  
ns  
Total loop delay, driver input to receiver  
output, dominant to recessive  
tloop2  
Figure 10, Rs with 10 kto ground  
Figure 10, Rs with 100 kto ground  
ns  
ns  
tloop2  
Total loop delay, driver input to receiver  
output, dominant to recessive  
Figure 10, Rs at 0 V, VCC from 4.5 V to 5.1  
V,  
PARAMETER MEASUREMENT INFORMATION  
I
O(CANH)  
V
O(CANH)  
D
V
OD  
I
I
60 W + 1%  
V
+ V  
2
O(CANH)  
O(CANL)  
I
Rs  
V
OC  
IRs  
V
I
+
I
O(CANL)  
V
I(Rs)  
_
V
O(CANL)  
Figure 1. Driver Voltage, Current, and Test Definition  
5
SN65HVD251  
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SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
PARAMETER MEASUREMENT INFORMATION (continued)  
Dominant  
V
O(CANH)  
9 3.5 V  
9 2.5 V  
9 1.5 V  
Recessive  
V
O(CANL)  
Figure 2. Bus Logic State Voltage Definitions  
330 W + 1%  
CANH  
D
60 W + 1%  
V
OD  
V
I
+
–7 V 3 V  
3 12 V  
_
TEST  
R
S
CANL  
330 W + 1%  
Figure 3. Driver VOD  
CANH  
D
R
=
C
=
L
L
V
O
60 W + 1%  
50 pF + 20%  
(see Note B)  
V
I
+
Rs  
(see Note A)  
V
I(Rs)  
_
CANH  
V
CC  
V
CC/2  
V
CC/2  
V
I
0 V  
t
t
PHL  
PLH  
V
O(D)  
O(R)  
90%  
10%  
0.9V  
V
O
0.5V  
V
t
r
t
f
Figure 4. Driver Test Circuit and Voltage Waveforms  
CANH  
R
V
I
O
I(CANH)  
V
ID  
V
V
I(CANH) + I(CANL)  
2
V
IC  
=
V
O
CANL  
V
I(CANL)  
Figure 5. Receiver Voltage and Current Definitions  
6
SN65HVD251  
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SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
PARAMETER MEASUREMENT INFORMATION (continued)  
CANH  
R
I
O
V
I
CANL  
C = 15 pF  
L
+ 20% (see Note B)  
V
O
(see Note A)  
1.5 V  
3.5 V  
1.5 V  
2.4 V  
V
I
2 V  
t
t
PLH  
PHL  
V
OH  
90%  
0.7 V  
CC  
V
O
0.3 V  
CC  
10%  
10%  
V
OL  
t
r
t
f
A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr≤  
6ns, tf6ns, ZO = 50.  
B. CL includes instrumentation and fixture capacitance within ±20%.  
Figure 6. Receiver Test Circuit and Voltage Waveforms  
CANH  
R
CANL  
100 W  
Pulse Generator  
15 ms Duration  
D at 0 V  
or V  
CC  
1% Duty Cycle  
t , t 3 100 ns  
r
r
R
S
at 0 V or V  
CC  
A. This test is conducted to test survivability only. Data stability at the R output is not specified.  
Figure 7. Test Circuit, Transient Over-Voltage Test  
Table 1. Receiver Characteristics Over Common Mode Voltage  
INPUT  
MEASURED  
|VID  
OUTPUT  
R
VCANH  
12 V  
-6.1 V  
-1 V  
VCANL  
11.1 V  
-7 V  
|
900 mV  
900 mV  
6 V  
L
L
VOL  
-7 V  
L
12 V  
-6.5 V  
12 V  
-7 V  
6 V  
6 V  
L
-7 V  
500 mV  
500 mV  
6 V  
H
H
H
H
H
11.5 V  
-1 V  
VOH  
6 V  
12 V  
open  
6 V  
open  
X
7
SN65HVD251  
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SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
DUT  
CANH  
CANL  
D
0 V  
60 W + 1%  
Rs  
V
I
R
+
V
15 pF + 20%  
O
_
V
CC  
0.7 V  
CC  
V
I
0 V  
V
OH  
0.3 V  
0.3 V  
CC  
V
O
CC  
V
OL  
t
en  
Figure 8. ten Test Circuit and Voltage Waveforms  
27 W + 1%  
CANH  
D
V
I
CANL  
27 W + 1%  
50 pF +20%  
V
OC  
R
S
V
OC(PP)  
V
OC  
A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr≤  
6ns, tf6ns, ZO = 50.  
Figure 9. Peak-to-Peak Common Mode Output Voltage  
8
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SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
DUT  
CANH  
D
60 W + 1%  
CANL  
V
I
10 kW or 100 kW + 5%  
R
S
_
V
Rs  
+
R
+
15 pF + 20%  
V
O
_
V
CC  
50%  
D Input  
0 V  
t
t
Loop1  
Loop2  
V
OH  
0.7 Vcc  
R Output  
0.3 Vcc  
V
OL  
Figure 10. tLOOP Test Circuit and Voltage Waveforms  
I
OS  
CANH  
D
0 V or V  
CC  
CANL  
V
–7 V or 12 V  
Rs  
in  
JI  
J
OS(SS)  
JI  
OS(P)  
J
15 s  
0 V  
12 V  
V
in  
0 V  
0 V  
10 ms  
or  
V
in  
–7 V  
Figure 11. Driver Short-Circuit Test  
9
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CANH  
CANL  
R
V
I
C = 15 pF  
L
(see Note A)  
V
1.5 V  
O
(see Note B)  
3.5 V  
1.5 V  
2.4 V  
V
I
t
p(sb)  
V
V
OH  
V
O
0.3 V  
CC  
OL  
A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr≤  
6ns, tf6ns, ZO = 50.  
B. CL includes instrumentation and fixture capacitance within ±20%.  
Figure 12. Receiver Propagation Delay in Standby Test Circuit and Waveform  
DEVICE INFORMATION  
5 V  
R2+ 1%  
R1+ 1%  
CANH  
+
R
V
ID  
CANL  
Vac  
R1+ 1%  
V
I
R2+ 1%  
V
ID  
R1  
R2  
50 W  
50 W  
450 W  
500 mV  
900 mV  
227 W  
12 V  
V
I
–7 V  
A. All input pulses are supplied by a generator having the following characteristics: f < 1.5 MHz, TA = 25oC, VCC = 5.0 V.  
Figure 13. Common-Mode Input Voltage Rejection Test  
10  
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www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
DEVICE INFORMATION (continued)  
FUNCTION TABLES  
Table 2. DRIVER  
INPUTS  
OUTPUTS  
Voltage at Rs, VRs  
D
BUS STATE  
CANH  
CANL  
L
H
VRs < 1.2 V  
VRs < 1.2 V  
X
H
Z
Z
Z
L
Z
Z
Z
Dominant  
Recessive  
Recessive  
Recessive  
Open  
X
VRs > 0.75 VCC  
Table 3. RECEIVER  
DIFFERENTIAL INPUTS [VID = V(CANH) - V(CANL)]  
ID0.9 V  
0.5V < VID < 0.9 V  
OUTPUT R(1)  
V
L
?
V
ID 0.5 V  
H
H
Open  
(1) H = high level; L = low level; X = irrelevant; ? = indeterminate; Z = high impedance  
11  
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
D Input  
R Output  
Vcc  
Vcc  
100 kW  
1 kW  
15 W  
Input  
Output  
9 V  
9 V  
CANH Input  
CANL Input  
Vcc  
Vcc  
110 kW  
9 kW  
110 kW  
45 kW  
9 kW  
45 kW  
Input  
Input  
9 kW  
9 kW  
40 V  
40 V  
CANH and CANL Outputs  
Vcc  
Rs Input  
Vcc  
Output  
40 V  
+
Input  
Figure 14. Equivalent Input and Output Schematic Diagrams  
12  
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
TYPICAL CHARACTERISTICS  
tLOOP1-LOOP TIME  
tLOOP2-LOOP TIME  
vs  
FREE-AIR TEMPERATURE  
SUPPLY CURRENT (RMS)  
vs  
vs  
FREE-AIR TEMPERATURE  
SIGNALING RATE  
150  
145  
140  
135  
130  
33  
32  
31  
30  
29  
28  
27  
R
S
= 0 V  
R
S
= 0 V  
V
= 5 V,  
CC  
74  
72  
70  
68  
66  
T
= 25°C,  
= 0 V,  
A
R
R
C
S
L
L
V
= 5.5 V  
CC  
V
= 4.5 V  
CC  
= 60 ,  
= 50 pF  
V
= 5 V  
CC  
V
= 5 V  
CC  
V
= 4.5 V  
CC  
V
= 5.5 V  
CC  
125  
120  
64  
62  
26  
25  
–40 –25 –10  
5
20  
65 80 95 110 125  
35 50  
–40 –25 –10  
5
20 35 50 65 80 95 110 125  
0
250 500 750 1000 1250 1500 1750 2000  
T
A
– Free-Air Temperature – 5C  
T
A
– Free-Air Temperature – 5C  
Signaling Rate – kbps  
Figure 15.  
Figure 16.  
Figure 17.  
DRIVER LOW-LEVEL OUTPUT CUR-  
DRIVER HIGH-LEVEL OUTPUT CUR-  
DOMINANT DIFFERENTIAL  
OUTPUT VOLTAGE  
vs  
RENT  
RENT  
vs  
vs  
LOW-LEVEL OUTPUT VOLTAGE  
HIGH-LEVEL OUTPUT VOLTAGE  
FREE-AIR TEMPERATURE  
140  
120  
100  
80  
80  
V
T
R
= 5 V,  
= 25°C,  
= 0 V,  
3
CC  
V
= 5 V,  
= 25°C,  
= 0 V,  
CC  
V
= 5.5 V  
A
70  
60  
50  
40  
30  
20  
CC  
T
A
S
R
S
2.5  
D at 0V  
D at 0V  
2
V
= 4.5 V  
CC  
V
= 5 V  
CC  
60  
1.5  
1
40  
R
= 0 V,  
S
20  
0.5  
D at 0V,  
= 60  
10  
0
R
L
0
0
1
2
3
4
5
0
1
2
3
4
5
0
–55 –40  
0
25  
70  
85  
125  
V
CANH – High-Level Output Voltage – V  
V
CANL – Low-Level Output Voltage – V  
O
O
T
A
– Free-Air Temperature – 5 C  
Figure 18.  
Figure 19.  
Figure 20.  
DRIVER OUTPUT CURRENT  
vs  
DIFFERENTIAL OUTPUT  
FALL TIME  
INPUT RESISTANCE MATCHING  
vs  
SUPPLY VOLTAGE  
vs  
FREE-AIR TEMPERATURE  
SLOPE RESISTANCE (Rs)  
0
−0.50  
−1  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
60  
50  
40  
30  
20  
T
A
= 25°C  
V
= 5.5 V  
CC  
T
R
= 25°C,  
= 0 V,  
A
S
V
= 5.5 V  
CC  
V
= 5 V  
D at 0V,  
R
CC  
= 60  
L
V
= 4.5 V  
CC  
−1.50  
−2  
V
= 5 V  
CC  
V
= 4.5 V  
CC  
−2.50  
−3  
10  
0
0
10 20 30 40 50 60 70 80 90 100  
−50  
0
50  
100  
150  
1
2
3
4
5
6
T
A
− Free-Air Temperature − °C  
R
S
- Slope Resistance - kW  
V
– Supply Voltage – V  
CC  
Figure 21.  
Figure 22.  
Figure 23.  
13  
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
APPLICATION INFORMATION  
lators in a system must also be accounted for with  
adjustments in signaling rate and stub & bus length.  
Table 4 lists the maximum signaling rates achieved  
with the SN65HVD251 in high-speed mode with  
several bus lengths of category-5, shielded  
twisted-pair (CAT 5 STP) cable.  
The basics of bus arbitration require that the receiver  
at the sending node designate the first bit as domi-  
nant or recessive after the initial wave of the first bit  
of a message travels to the most remote node on a  
network and back again. Typically, this sample is  
made at 75% of the bit width, and within this  
limitation, the maximum allowable signal distortion in  
a CAN network is determined by network electrical  
parameters.  
Table 4. Maximum Signaling Rates for Various  
Cable Lengths  
BUS LENGTH (m)  
SIGNALING RATE (kbps)  
Factors to be considered in network design include  
the 5 ns/m propagation delay of typical twisted-pair  
bus cable; signal amplitude loss due to the loss  
mechanisms of the cable; and the number, length,  
and spacing of drop-lines (stubs) on a network. Under  
strict analysis, variations among the different oscil-  
30  
100  
250  
500  
1000  
1000  
500  
250  
125  
62.5  
The ISO 11898 standard specifies a maximum bus length of 40 m and maximum stub length of 0.3 m with a  
maximum of 30 nodes. However, with careful design, users can have longer cables, longer stub lengths, and  
many more nodes on a bus. (Note: Non-standard application may come with a trade-off in signaling rate.) A bus  
with a large number of nodes requires a transceiver with high input impedance such as the HVD251.  
The Standard specifies the interconnect to be a single twisted-pair cable (shielded or unshielded) with 120-Ω  
characteristic impedance (Zo). Resistors equal to the characteristic impedance of the line terminate both ends of  
the cable to prevent signal reflections. Unterminated drop-lines connect nodes to the bus and should be kept as  
short as possible to minimize signal reflections.  
Connectors, while not specified by the ISO 11898 standard, should have as little effect as possible on standard  
operating parameters such as capacitive loading. Although unshielded cable is used in many applications, data  
transmission circuits employing CAN transceivers are usually used in applications requiring a rugged  
interconnection with a wide common-mode voltage range. Therefore, shielded cable is recommended in these  
electronically harsh environments, and when coupled with the –2-V to 7-V common-mode range of tolerable  
ground noise specified in the standard, helps to ensure data integrity. The HVD251 extends data integrity beyond  
that of the standard with an extended –7-V to 12-V range of common-mode operation.  
NOISE MARGIN  
900 mV Threshold  
75% SAMPLE POINT  
NOISE MARGIN  
RECEIVER DETECTION WINDOW  
500 mV Threshold  
ALLOWABLE JITTER  
Figure 24. Typical CAN Differential Signal Eye-Pattern  
14  
 
 
SN65HVD251  
www.ti.com  
SLLS545CNOVEMBER 2002REVISED SEPTEMBER 2005  
An eye pattern is a useful tool for measuring overall signal quality. As displayed in Figure 24, the differential  
signal changes logic states in two places on the display, producing an eye. Instead of viewing only one logic  
crossing on the scope, an entire bit of data is brought into view. The resulting eye pattern includes all effects of  
systemic and random distortion, and displays the time during which a signal may be considered valid.  
The height of the eye above or below the receiver threshold voltage level at the sampling point is the noise  
margin of the system. Jitter is typically measured at the differential voltage zero-crossing during the logic state  
transition of a signal. Note that jitter present at the receiver threshold voltage level is considered by some to be a  
more effective representation of the jitter at the input of a receiver.  
As the sum of skew and noise increases, the eye closes and data is corrupted. Closing the width decreases the  
time available for accurate sampling, and lowering the height enters the 900 mV or 500 mV threshold of a  
receiver.  
Different sources induce noise onto a signal. The more obvious noise sources are the components of a  
transmission circuit themselves; the signal transmitter, traces & cables, connectors, and the receiver. Beyond  
that, there is a termination dependency, cross-talk from clock traces and other proximity effects, VCC & ground  
bounce, and electromagnetic interference from near-by electrical equipment.  
The balanced receiver inputs of the HVD251 mitigate most sources of signal corruption, and when used with a  
quality shielded twisted-pair cable, help ensure data integrity.  
Typical Application  
Bus Lines – 40 m max  
CANH  
120 W  
120 W  
Stub Lines –– 0.3 m max  
CANL  
5 V  
5 V  
3.3 V  
V
ref  
V
ref  
V
ref  
V
CC  
V
CC  
V
CC  
0.1 m F  
0.1 m F  
0.1 m F  
SN65HVD251  
SN65HVD251  
SN65HVD230  
R
S
R
S
R
S
GND  
GND  
GND  
D
R
D
R
D
R
CANTX CANRX  
TMS320F243  
CANTX CANRX  
TMS320F243  
CANTX CANRX  
TMS320LF2407A  
Sensor, Actuator, or  
Control Equipment  
Sensor, Actuator, or  
Control Equipment  
Sensor, Actuator, or  
Control Equipment  
Figure 25. Typical HVD251 Application  
15  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOIC  
SOIC  
SOIC  
Drawing  
SN65HVD251D  
SN65HVD251DR  
SN65HVD251DRG4  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
8
8
8
75  
TBD  
TBD  
CU NIPDAU Level-1-220C-UNLIM  
CU NIPDAU Level-1-220C-UNLIM  
2500  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN65HVD251P  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
P
P
8
8
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN65HVD251PE4  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDI001A – JANUARY 1995 – REVISED JUNE 1999  
P (R-PDIP-T8)  
PLASTIC DUAL-IN-LINE  
0.400 (10,60)  
0.355 (9,02)  
8
5
0.260 (6,60)  
0.240 (6,10)  
1
4
0.070 (1,78) MAX  
0.325 (8,26)  
0.300 (7,62)  
0.020 (0,51) MIN  
0.015 (0,38)  
Gage Plane  
0.200 (5,08) MAX  
Seating Plane  
0.010 (0,25) NOM  
0.125 (3,18) MIN  
0.100 (2,54)  
0.021 (0,53)  
0.430 (10,92)  
MAX  
0.010 (0,25)  
M
0.015 (0,38)  
4040082/D 05/98  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-001  
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm  
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