SN65LVEL11D [TI]
3.3 V ECL 1:2 Fanout Buffer; 3.3 V ECL 1 ： 2扇出缓冲器
| 型号： | SN65LVEL11D |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3 V ECL 1:2 Fanout Buffer |
| 文件： | 总12页 (文件大小：438K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN65LVEL11
www.ti.com ............................................................................................................................................................................................ SLLS927–DECEMBER 2008
3.3 V ECL 1:2 Fanout Buffer
1
FEATURES
DESCRIPTION
•
1:2 ECL Fanout Buffer
•
Operating Range
The SN65LVEL11 is a fully differential 1:2 ECL fanout
buffer. The device includes circuitry to maintain a
known logic level when inputs are in open condition.
The SN65LVEL11 is functionally equivalent to
SN65EL11 with improved performance. The
SN65LVEL11 is housed in an industry standard
SOIC-8 package and is also available in the
TSSOP-8 package option.
–
–
PECL VCC = 3.0 V to 3.8 V With
VEE = 0 V
NECL: VCC = 0 V with VEE = –3.0
to –3.8V
•
•
•
•
5 ps Skew Between Outputs
Support for Clock Frequencies > 2.0 GHz
265 ps Typical Propagation Delay
PINOUT ASSIGNMENT
Deterministic Output Value for Open Input
Conditions or When Inputs = VEE
Q
V
CC
1
2
8
7
0
0
•
•
Built-in Temperature Compensation
Drop in Compatible to MC10LVEL11,
MC100LVEL11
Q
D
•
Built-In Input Pull Down Resistors
Q
Q
D
V
3
4
6
5
1
APPLICATIONS
•
Data and Clock Transmission Over Backplane
1
EE
•
Signaling Level Conversion
Table 1. Pin Description
PIN
FUNCTION
D, D
PECL/ECL data inputs
PECL/ECL outputs
Positive supply
Q0, Q0, Q1, Q1
VCC
VEE
Negative supply
ORDERING INFORMATION(1)
PART NUMBER
SN65LVEL11D
PART MARKING
PACKAGE
LEAD FINISH
NiPdAu
SN65LVEL11
SN65LVEL11
SOIC
SN65LVEL11DGK
SOIC-TSSOP
NiPdAu
(1) Leaded device options not initially available. Contact TI sales representative for further details.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN65LVEL11
SLLS927–DECEMBER 2008............................................................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)
PARAMETER
CONDITION
VEE = 0 V
VALUE
UNIT
Absolute PECL mode supply voltage, VCC
Absolute NECL mode power supply, VEE
PECL mode input voltage
6
V
V
V
V
VCC = 0 V
–6
VEE = 0 V; VI ≤ VCC
VCC = 0 V; VI ≥ VEE
Continuous
6
–6
NECL mode input voltage
50
Output current
mA
Surge
100
Operating temperature range
Storage temperature range
–40 to 85
–65 to 150
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
POWER DISSIPATION RATINGS
POWER RATING THERMAL RESISTANCE,
DERATING FACTOR
TA > 25°C
POWER RATING
TA = 85°C
(mW)
CIRCUIT BOARD
MODEL
JUNCTION TO AMBIENT
PACKAGE
TA < 25°C
(mW)
NO AIRFLOW
(mW/°C)
SOIC
Low-K
High-K
Low-K
High-K
719
840
469
527
139
119
213
189
7
8
5
5
288
336
188
211
SOIC-TSSOP
THERMAL CHARACTERISTICS
PARAMETER
Junction-to Board Thermal Resistance
PACKAGE
SOIC
VALUE
UNIT
θJB
79
120
98
°C/W
SOIC-TSSOP
SOIC
θJC
Junction-to Case Thermal Resistance
°C/W
SOIC-TSSOP
74
KEY ATTRIBUTES
CHARACTERISTICS
VALUE
Internal input pull down resistor
Moisture sensitivity level
75 kΩ
Level 1
Flammability rating (Oxygen Index: 28 to 34)
ESD-HBM
UL 94 V-0 at 0.125 in
4 kV
ESD-machine model
200 V
ESD-charge device model
2 kV
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN65LVEL11
SN65LVEL11
www.ti.com ............................................................................................................................................................................................ SLLS927–DECEMBER 2008
LVPECL DC CHARACTERISTICS(1) (VCC = 3.3 V, VEE = 0.0 V(2)
–40°C
MIN TYP
20
25°C
MIN TYP
20
85°C
CHARACTERISTICS
UNIT
MAX
25
MAX
25
MIN TYP MAX
ICC
Power Supply Current
21
25
2420
1680
2420
1825
mA
mV
mV
mV
mV
V
(3)
VOH
VOL
VIH
VIL
Output HIGH Voltage
2215
2420
1680
2420
1825
2215 2286
1470 1584
2135
2420
1680
2420
1825
2215
1470
2135
1490
Output LOW Voltage(3)
1470
Input High Voltage (Single-Ended)
Input LOW Voltage (Single-Ended)
2135
1490
1490
VIHCMR Input HIGH voltage common mode range
(4)
(Differential)
Vpp < 500 mV
1.2
1.4
3.1
3.1
1.1
1.3
3.1
3.1
1.1
1.3
3.1
3.1
Vpp > 500 mV
IIH
IIL
Input HIGH Current
Input LOW current
150
150
150
µA
µA
D
D
0.5
0.5
0.5
–600
–600
–600
(1) Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
(2) Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V
(3) Outputs are terminated through a 50 Ω resistor to VCC – 2.0 V.
(4) VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the
differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies
between VPP min and 1 V.
(2)
LVPNECL DC CHARACTERISTICS(1) (VEE = –3.3 V; VCC = 0.0 V;)
–40°C
MIN TYP
20
25°C
85°C
TYP
21
CHARACTERISTICS
UNIT
MAX
25
MIN
TYP
MAX
25
MIN
MAX
25
IEE
Power supply current
20
–1013
–1722
mA
mV
mV
mV
mV
V
(3)
VOH
VOL
VIH
Output HIGH voltage
–1085
–880
–1620
–880
–1475
–1085
–1830
–1165
–1810
–880
–1620
–880
–1475
–1085
–1830
–1165
–1810
–880
–1620
–880
–1475
Output LOW voltage(3)
–1830
–1165
–1810
Input high voltage (Single-Ended)
Input LOW voltage (Single-Ended)
Input HIGH voltage common mode range
VIL
VIHCMR
(4)
(Differential)
Vpp < 500 mV
–2.1
–1.9
–0.2
–0.2
150
–2.2
–2.0
–0.2
–0.2
150
–2.2
–2.0
–0.2
–0.2
150
Vpp > 500 mV
IIH
IIL
Input HIGH current
Input LOW current
µA
µA
D
D
0.5
0.5
0.5
–600
–600
–600
(1) Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
(2) Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V.
(3) Outputs are terminated through a 50 Ω resistor to VCC – 2.0 V.
(4) VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the
differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies
between VPP min and 1 V.
Copyright © 2008, Texas Instruments Incorporated
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3
Product Folder Link(s): SN65LVEL11
SN65LVEL11
SLLS927–DECEMBER 2008............................................................................................................................................................................................ www.ti.com
AC CHARACTERISTICS (1)(VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = –3.3 V)(2)
–40°C
TYP MAX
25°C
MIN TYP MAX
2.7
85°C
TYP MAX
CHARACTERISTIC
UNIT
MIN
MIN
fMAX
Max switching frequency(3) See Figure 6
2.9
2.4
GHz
ps
tPLH/tPHL Propagation delay to output
Within device skew(4)
235
350
18
235
350
18
235
350
18
10
10
5
10
10
5
10
10
5
ps
tSKEW
Device to device skew(5)
Duty cycle skew(6)
25
25
25
ps
15
15
15
ps
tJITTER
VPP
Random clock jitter (RMS)
Input swing(7)
0.2
0.2
0.2
ps
200
150
1000
300
200
150
1000
300
200
150
1000
300
mV
ps
tr/tf
Output rise/fall times Q (20%–80%)
(1) Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
(2) VEE can vary ±0.3 V
(3) Maximum switching frequency measured at output amplitude of 300 mVpp.
(4) Within-device skew is defined as identical transitions on similar paths through a device.
(5) Device-Device Skew is defined as identical transitions at identical Vcc levels.
(6) Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
(7) VPP(min) is the minimum input swing for which AC parameters are assured.
Typical Termination for Output Driver
Z
O
= 50 W
P
P
Driver
Receiver
N
N
Z
O
= 50 W
50 W
50 W
V
TT
= V
V
- 2 V
CC
TT
Figure 1. Termination for Output Driver
D
D
Q
Q
t
t
PLH
PHL
Figure 2. Propagation Delay
4
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Product Folder Link(s): SN65LVEL11
SN65LVEL11
www.ti.com ............................................................................................................................................................................................ SLLS927–DECEMBER 2008
D
V
V
PP(min)
PP(max)
D
Figure 3. Input Voltage Swing
80%
20%
t
t
f
r
Figure 4. Output Rise and Fall Times
D
D
Q
Q
0
0
t
t
PLH0
PHL0
Q
1
Q
1
t
t
PHL1
PLH1
Device Skew =
- t
Higher [(t
), (t - t )]
PLH1 PLH0
PHL1 PHL0
Figure 5. Device Skew
Copyright © 2008, Texas Instruments Incorporated
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5
Product Folder Link(s): SN65LVEL11
SN65LVEL11
SLLS927–DECEMBER 2008............................................................................................................................................................................................ www.ti.com
1000
V
V
= 3.3 V,
= 0 V
CC
EE
900
800
700
600
T
= -40°C
500
400
300
200
100
0
A
T
= 25°C
A
T
= 85°C
A
0
500 1000 1500 2000 2500 3000 3500 4000 4500
f - Frequency - MHz
Figure 6. Output Amplitude vs Frequency
6
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Product Folder Link(s): SN65LVEL11
PACKAGE OPTION ADDENDUM
www.ti.com
15-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN65LVEL11D
ACTIVE
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65LVEL11DGK
SN65LVEL11DGKR
SN65LVEL11DR
PREVIEW
PREVIEW
ACTIVE
MSOP
MSOP
SOIC
DGK
DGK
D
8
8
8
80
TBD
TBD
Call TI
Call TI
Call TI
Call TI
2500
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Dec-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN65LVEL11DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Dec-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 29.0
SN65LVEL11DR
D
8
2500
Pack Materials-Page 2
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