SN7406DG4 [TI]
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS; 六反相缓冲器/带集电极开路高压输出驱动程序
| 型号： | SN7406DG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS |
| 文件： | 总15页 (文件大小：613K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
SN5406, SN5416 . . . J OR W PACKAGE
Convert TTL Voltage Levels to MOS Levels
SN7406 . . . D, N, OR NS PACKAGE
SN7416 . . . D OR N PACKAGE
(TOP VIEW)
High Sink-Current Capability
Input Clamping Diodes Simplify System
Design
1A
1Y
2A
2Y
3A
V
CC
1
2
3
4
5
6
7
14
13
12
11
10
9
Open-Collector Drivers for Indicator Lamps
and Relays
6A
6Y
5A
5Y
4A
4Y
Inputs Fully Compatible With Most TTL
Circuits
3Y
GND
description
8
These TTL hex inverter buffers/drivers feature
high-voltageopen-collectoroutputsforinterfacing
with high-level circuits (such as MOS) or for
driving high-current loads (such as lamps or
relays), and also are characterized for use as
inverter buffers for driving TTL inputs. The
SN5406 and SN7406 have minimum breakdown
voltages of 30 V. The SN5416 and SN7416 have
minimum breakdown voltages of 15 V. The
maximum sink current is 30 mA for the SN5406
and SN5416, and 40 mA for the SN7406 and
SN7416.
SN5406 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
6Y
NC
5A
NC
5Y
2A
NC
2Y
4
5
6
7
8
17
16
15
14
NC
3A
9 10 11 12 13
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN7406D
7406
Tape and reel
Tube
SN7406DR
SN7416D
SOIC – D
7416
0°C to 70°C
Tape and reel
SN7416DR
SN7406N
SN7406N
SN7416N
SN7406
PDIP – N
SOP – NS
CDIP – J
Tube
SN7416N
Tape and reel
Tube
SN7406NSR
SNJ5406J
SNJ5416J
SNJ5406W
SNJ5416W
SNJ5406FK
SNJ5406J
SNJ5416J
SNJ5406W
SNJ5416W
SNJ5406FK
Tube
–55°C to 125°C
Tube
CDIP – W
Tube
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
logic diagram (positive logic)
2
1
3
1A
2A
3A
4A
5A
1Y
2Y
3Y
4Y
5Y
6Y
4
6
5
9
8
10
12
11
13
6A
Y = A
schematic (each buffer/driver)
’06, ’16
V
CC
6 kΩ
1.4 kΩ
2 kΩ
1.6 kΩ
Output Y
Input A
100 Ω
1 kΩ
GND
Resistor values shown are nominal.
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Input voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
I
Output voltage, V (see Notes 1 and 2): SN5406, SN7406 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
O
SN5416, SN7416 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θ (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. This is the maximum voltage which should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
recommended operating conditions
SN5406
SN5416
SN7406
SN7416
UNIT
MIN NOM
MAX
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.75
2
5
5.25
V
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
0.8
30
0.8
30
15
40
70
’06
’16
V
OH
High-level output voltage
V
15
I
Low-level output current
30
mA
OL
T
A
Operating free-air temperature
–55
125
0
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN5406
SN5416
SN7406
SN7416
†
PARAMETER
UNIT
TEST CONDITIONS
‡
‡
MIN TYP
MAX
–1.5
0.25
0.4
0.7
1
MIN TYP
MAX
–1.5
0.25
0.4
0.7
1
V
V
V
= MIN,
= MIN,
I = –12 mA
V
IK
CC
I
I
V
IL
= 0.8 V,
= 2 V
V = §
OH
mA
OH
CC
I
= 16 mA
OL
OL
V
OL
V
CC
= MIN,
V
IH
V
I
= ¶
I
I
I
I
I
V
CC
V
CC
V
CC
V
CC
V
CC
= MAX,
= MAX,
= MAX,
= MAX
= MAX
V = 5.5 V
mA
µA
I
I
V
= 2.4 V
= 0.4 V
40
40
IH
IH
IL
V
–1.6
48
–1.6
48
mA
mA
mA
IL
30
32
30
32
CCH
CCL
51
51
†
‡
§
¶
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
All typical values are at V = 5 V, T = 25°C.
CC
= 30 V for ’06 and 15 V for ’16.
A
V
OH
= 30 mA for SN54’ and 40 mA for SN74’.
I
OL
switching characteristics, V
= 5 V, T = 25°C (see Figure 1)
CC
A
FROM
PARAMETER
TO
(OUTPUT)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
(INPUT)
t
t
10
15
15
23
PLH
A
ns
Y
R
= 110 Ω,
C = 15 pF
L
L
PHL
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN5406, SN5416, SN7406, SN7416
HEX INVERTER BUFFERS/DRIVERS
WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001
PARAMETER MEASUREMENT INFORMATION
V
CC
R
L
From Output
Under Test
Test Point
C
L
(see Note A)
LOAD CIRCUIT
3 V
0 V
1.5 V
1.5 V
Input
t
t
t
PHL
PLH
PHL
V
V
OH
In-Phase
Output
High-Level
Pulse
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
1.5 V
OL
t
t
PLH
w
V
V
OH
Low-Level
Pulse
Out-of-Phase
Output
1.5 V
OL
VOLTAGE WAVEFORMS
PULSE WIDTHS
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A.
B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 7 ns, t ≤ 7 ns.
C includes probe and jig capacitance.
L
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
JM38510/00801BCA
JM38510/00801BDA
SN5406J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
W
J
14
14
14
14
14
1
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
CDIP
CDIP
SOIC
SN5416J
J
SN7406D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7406DE4
SN7406DG4
SN7406DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7406DRE4
SN7406DRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7406J
SN7406N
OBSOLETE
ACTIVE
CDIP
PDIP
J
14
14
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN7406N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
14
14
TBD
Call TI
Call TI
SN7406NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN7406NSR
SN7406NSRE4
SN7406NSRG4
SN7416D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
NS
D
14
14
14
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7416DE4
SN7416DG4
SN7416DR
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7416DRE4
SN7416DRG4
SN7416N
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN7416N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
14
14
TBD
Call TI
Call TI
SN7416NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN7416NSR
ACTIVE
ACTIVE
SO
SO
NS
NS
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN7416NSRE4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN7416NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ5406FK
SNJ5406J
SNJ5406W
SNJ5416J
SNJ5416W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
14
14
14
14
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
W
J
CDIP
CFP
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN7406DR
SN7406DR
SN7406NSR
SN7416DR
SN7416NSR
SOIC
SOIC
SO
D
D
14
14
14
14
14
2500
2500
2000
2500
2000
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
6.5
6.5
8.2
6.5
8.2
9.0
9.0
2.1
2.1
2.5
2.1
2.5
8.0
8.0
16.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
NS
D
10.5
9.0
12.0
8.0
SOIC
SO
NS
10.5
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN7406DR
SN7406DR
SN7406NSR
SN7416DR
SN7416NSR
SOIC
SOIC
SO
D
D
14
14
14
14
14
2500
2500
2000
2500
2000
333.2
346.0
346.0
346.0
346.0
345.9
346.0
346.0
346.0
346.0
28.6
33.0
33.0
33.0
33.0
NS
D
SOIC
SO
NS
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Applications
Audio
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amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
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