SN74ABT16541DGG [TI]

ABT SERIES, DUAL 8-BIT DRIVER, TRUE OUTPUT, PDSO48;
SN74ABT16541DGG
型号: SN74ABT16541DGG
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

ABT SERIES, DUAL 8-BIT DRIVER, TRUE OUTPUT, PDSO48

驱动器 输出元件
文件: 总10页 (文件大小:196K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54ABT16541, SN74ABT16541A  
16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS118C – FEBRUARY 1991 – REVISED JANUARY 1997  
SN54ABT16541 . . . WD PACKAGE  
SN74ABT16541A . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
Members of the Texas Instruments  
Widebus Family  
State-of-the-Art EPIC-ΙΙB BiCMOS Design  
Significantly Reduces Power Dissipation  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1OE1  
1Y1  
1Y2  
GND  
1Y3  
1Y4  
1OE2  
1A1  
1A2  
GND  
1A3  
1A4  
Latch-Up Performance Exceeds 500 mA Per  
JEDEC Standard JESD-17  
2
3
Typical V  
< 0.8 V at V  
(Output Ground Bounce)  
4
OLP  
= 5 V, T = 25°C  
5
CC  
A
6
Distributed V  
Minimizes High-Speed Switching Noise  
and GND Pin Configuration  
CC  
7
V
V
CC  
CC  
8
1Y5  
1Y6  
GND  
1Y7  
1Y8  
2Y1  
2Y2  
GND  
2Y3  
2Y4  
1A5  
1A6  
GND  
1A7  
1A8  
2A1  
2A2  
GND  
2A3  
2A4  
Flow-Through Architecture Optimizes PCB  
Layout  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
High-Drive Outputs (–32-mA I , 64-mA I  
OH  
)
OL  
Package Options Include Plastic 300-mil  
Shrink Small-Outline (DL), Thin Shrink  
Small-Outline (DGG), Thin Very  
Small-Outline (DGV) Packages and 380-mil  
Fine-Pitch Ceramic Flat (WD) Packages  
Using 25-mil Center-to-Center Spacings  
V
V
CC  
CC  
description  
2Y5  
2Y6  
GND  
2Y7  
2Y8  
2A5  
2A6  
GND  
2A7  
2A8  
The SN54ABT16541 and SN74ABT16541A are  
noninverting 16-bit buffers composed of two 8-bit  
sections with separate output-enable signals. For  
either 8-bit buffer section, the two output-enable  
(1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must  
both be low for the corresponding Y outputs to be  
active. If either output-enable input is high, the  
outputs of that 8-bit buffer section are in the  
high-impedance state.  
2OE1  
2OE2  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
The SN54ABT16541 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74ABT16541A is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
(each 8-bit section)  
INPUTS  
OUTPUT  
Y
A
L
OE1  
L
OE2  
L
L
H
Z
Z
L
L
H
X
X
H
X
X
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16541, SN74ABT16541A  
16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS118C – FEBRUARY 1991 – REVISED JANUARY 1997  
logic symbol  
1
1OE1  
&
&
EN1  
EN2  
48  
1OE2  
24  
2OE1  
25  
2OE2  
47  
1A1  
46  
2
3
1
1
1Y1  
1Y2  
1Y3  
1Y4  
1Y5  
1Y6  
1Y7  
1Y8  
2Y1  
2Y2  
2Y3  
2Y4  
2Y5  
2Y6  
2Y7  
2Y8  
1A2  
44  
5
1A3  
43  
6
1A4  
41  
8
1A5  
40  
9
1A6  
38  
11  
12  
13  
14  
16  
17  
19  
20  
22  
23  
1A7  
37  
1A8  
36  
2A1  
35  
1
2
2A2  
33  
2A3  
32  
2A4  
30  
2A5  
29  
2A6  
27  
2A7  
26  
2A8  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
logic diagram (positive logic)  
24  
25  
1
1OE1  
2OE1  
2OE2  
48  
1OE2  
47  
2
36  
13  
1A1  
1Y1  
2Y1  
2A1  
To Seven Other Channels  
To Seven Other Channels  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16541, SN74ABT16541A  
16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS118C – FEBRUARY 1991 – REVISED JANUARY 1997  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
I
Voltage range applied to any output in the high or power-off state, V  
. . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V  
O
Current into any output in the low state, I : SN54ABT16541 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA  
O
SN74ABT16541A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA  
O
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89°C/W  
JA  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93°C/W  
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.  
recommended operating conditions (see Note 3)  
SN54ABT16541 SN74ABT16541A  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
IH  
0.8  
0.8  
V
IL  
0
V
0
V
CC  
V
I
CC  
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
–24  
48  
–32  
64  
mA  
mA  
ns/V  
°C  
OH  
OL  
t/v  
Outputs enabled  
10  
10  
T
–55  
125  
–40  
85  
A
NOTE 3: Unused inputs must be held high or low to prevent them from floating.  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16541, SN74ABT16541A  
16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS118C – FEBRUARY 1991 – REVISED JANUARY 1997  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54ABT16541 SN74ABT16541A  
A
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
V
V
V
V
V
= 4.5 V,  
= 4.5 V,  
= 5 V,  
I = –18 mA  
–1.2  
–1.2  
–1.2  
V
IK  
CC  
CC  
CC  
I
I
I
I
I
I
I
= –3 mA  
= –3 mA  
= –24 mA  
= –32 mA  
= 48 mA  
= 64 mA  
2.5  
3
2.5  
3
2.5  
3
OH  
OH  
OH  
OH  
OL  
OL  
V
OH  
2
2
V
= 4.5 V  
= 4.5 V  
CC  
CC  
2*  
2
0.55  
0.55  
V
V
V
V
OL  
0.55*  
0.55  
100  
mV  
µA  
µA  
µA  
µA  
hys  
I
I
I
I
V
V
V
V
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 0,  
V = V or GND  
I CC  
±1  
10  
±1  
50  
±1  
10  
I
CC  
CC  
CC  
CC  
CC  
V
O
V
O
= 2.7 V  
= 0.5 V  
OZH  
OZL  
off  
–10  
±100  
–50  
–10  
±100  
V or V 4.5 V  
I
O
V
V
= 5.5 V,  
= 5.5 V  
I
Outputs high  
= 2.5 V  
50  
50  
50  
µA  
CEX  
O
I
O
V
CC  
= 5.5 V,  
V
O
–50  
–100  
–180  
3
–50  
–180  
2
–50  
–180  
3
mA  
Outputs high  
Outputs low  
V
I
= 5.5 V,  
= 0,  
CC  
O
I
34  
3
32  
2
34  
3
mA  
mA  
CC  
V = V  
I
or GND  
CC  
Outputs disabled  
V
CC  
= 5.5 V,  
Outputs enabled  
Outputs disabled  
1
0.05  
1.5  
1.5  
0.05  
1.5  
1
0.05  
1.5  
Data  
inputs  
One input at 3.4 V,  
Other inputs at  
§
I  
CC  
V
CC  
or GND  
Control  
inputs  
V
CC  
= 5.5 V, One input at 3.4 V,  
or GND  
Other inputs at V  
CC  
V = 2.5 V or 0.5 V  
C
C
3.5  
3.5  
pF  
pF  
i
I
V
O
= 2.5 V or 0.5 V  
o
* On products compliant to MIL-PRF-38535, this parameter does not apply.  
§
All typical values are at V  
= 5 V.  
CC  
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V or GND.  
CC  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)  
L
V
T
= 5 V,  
= 25°C  
CC  
A
SN54ABT16541 SN74ABT16541A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1
TYP  
2.1  
2.5  
3.2  
3.8  
4.1  
3.3  
MAX  
3
MIN  
1
MAX  
3.5  
4.3  
5.3  
6.2  
5.4  
4.3  
MIN  
1
MAX  
3.4  
4.2  
5.2  
6
t
t
t
t
t
t
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
ns  
ns  
ns  
1
3.6  
4.3  
4.7  
4.8  
4
1
1
1.3  
1.6  
1.3  
1
1.3  
1.6  
1.3  
1
1.3  
1.6  
1.3  
1
OE  
OE  
5.4  
4.3  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16541, SN74ABT16541A  
16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS118C – FEBRUARY 1991 – REVISED JANUARY 1997  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
TEST  
/t  
S1  
S1  
500 Ω  
From Output  
Under Test  
t
Open  
7 V  
PLH PHL  
GND  
t
/t  
PLZ PZL  
C
= 50 pF  
t
/t  
Open  
L
PHZ PZH  
500 Ω  
(see Note A)  
3 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
3 V  
0 V  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
PZL  
t
t
t
PHL  
PLH  
PHL  
t
PLZ  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
V
V
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
PHZ  
t
PLH  
t
PZH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
V
OH  
– 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
74ABT16541ADGGRE4  
74ABT16541ADGVRE4  
SN74ABT16541ADGGR  
SN74ABT16541ADGVR  
SN74ABT16541ADL  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
48  
48  
48  
48  
48  
48  
48  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TVSOP  
TSSOP  
TVSOP  
SSOP  
DGV  
DGG  
DGV  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ABT16541ADLR  
SN74ABT16541ADLRG4  
SSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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