SN74ABT16600DGGR [TI]

ABT SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, GREEN, TSSOP-56;
SN74ABT16600DGGR
型号: SN74ABT16600DGGR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

ABT SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, GREEN, TSSOP-56

信息通信管理 光电二极管 输出元件 逻辑集成电路 触发器
文件: 总9页 (文件大小:147K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
SN54ABT16600 . . . WD PACKAGE  
SN74ABT16600 . . . DGG OR DL PACKAGE  
(TOP VIEW)  
Members of the Texas Instruments  
Widebus Family  
State-of-the-Art EPIC-ΙΙB BiCMOS Design  
Significantly Reduces Power Dissipation  
OEAB  
LEAB  
A1  
GND  
A2  
1
56 CLKENAB  
55 CLKAB  
54 B1  
UBT (Universal Bus Transceiver)  
2
Combines D-Type Latches and D-Type  
Flip-Flops for Operation in Transparent,  
Latched, Clocked, or Clock-Enabled Mode  
3
4
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
GND  
B2  
B3  
5
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015  
6
A3  
7
V
V
CC  
A4  
CC  
8
B4  
B5  
B6  
GND  
B7  
Latch-Up Performance Exceeds 500 mA Per  
JEDEC Standard JESD-17  
9
A5  
A6  
GND  
A7  
A8  
A9  
A10  
A11  
A12  
GND  
A13  
A14  
A15  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Typical V  
< 0.8 V at V  
(Output Ground Bounce)  
OLP  
= 5 V, T = 25°C  
CC  
A
Flow-Through Architecture Optimizes PCB  
Layout  
B8  
B9  
Package Options Include Plastic 300-mil  
Shrink Small-Outline (DL) and Thin Shrink  
Small-Outline (DGG) Packages and 380-mil  
Fine-Pitch Ceramic Flat (WD) Package  
Using 25-mil Center-to-Center Spacings  
B10  
B11  
B12  
GND  
B13  
B14  
B15  
description  
V
V
CC  
CC  
These 18-bit universal bus transceivers combine  
D-type latches and D-type flip-flops to allow data  
flow in transparent, latched, clocked, and  
clock-enabled modes.  
A16  
A17  
GND  
A18  
OEBA  
LEBA  
B16  
B17  
GND  
B18  
CLKBA  
CLKENBA  
Data flow in each direction is controlled by  
output-enable (OEAB and OEBA), latch-enable  
(LEAB and LEBA), and clock (CLKAB and  
CLKBA) inputs. The clock can be controlled by the  
clock-enable (CLKENAB and CLKENBA) inputs.  
For A-to-B data flow, the device operates in the  
transparent mode when LEAB is high. When  
LEAB is low, the A data is latched if CLKAB is held  
at a high or low logic level. If LEAB is low, the  
A-bus data is stored in the latch/flip-flop on the  
high-to-low transition of CLKAB. Output enable  
OEAB is active low. When OEAB is low, the  
outputs are active. When OEAB is high, the  
outputs are in the high-impedance state.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus, EPIC-ΙΙB, and UBT are trademarks of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
description (continued)  
Data flow for B to A is similar to that of A to B, but uses OEBA, LEBA, CLKBA, and CLKENBA.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
The SN54ABT16600 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74ABT16600 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
B
LEAB  
A
X
L
CLKENAB OEAB  
CLKAB  
X
X
X
H
H
L
H
L
L
L
L
L
L
L
L
X
H
H
L
L
L
L
L
L
X
X
X
X
X
Z
L
H
X
X
L
H
B
0
B
0
L
L
H
X
X
H
§
L
H
L
B
0
0
L
B
§
A-to-B data flow is shown: B-to-A flow is similar but uses OEBA,  
LEBA, CLKBA, and CLKENBA.  
Output level before the indicated steady-state input conditions were  
established  
Output level before the indicated steady-state input conditions were  
established, provided that CLKAB was low before LEAB went low  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
logic diagram (positive logic)  
1
OEAB  
56  
CLKENAB  
55  
CLKAB  
2
LEAB  
28  
LEBA  
30  
CLKBA  
29  
CLKENBA  
27  
OEBA  
CE  
3
A1  
54  
1D  
C1  
B1  
CLK  
CE  
1D  
C1  
CLK  
To 17 Other Channels  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
CC  
Input voltage range, V (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
I
Voltage range applied to any output in the high or power-off state, V  
. . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V  
O
Current into any output in the low state, I : SN54ABT16600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA  
O
SN74ABT16600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA  
O
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W  
JA  
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
recommended operating conditions (see Note 3)  
SN54ABT16600 SN74ABT16600  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
IH  
0.8  
0.8  
V
IL  
0
V
0
V
CC  
V
I
CC  
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
–24  
48  
–32  
64  
mA  
mA  
ns/V  
°C  
OH  
OL  
t/v  
Outputs enabled  
10  
10  
T
–55  
125  
–40  
85  
A
NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54ABT16600 SN74ABT16600  
A
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
V
V
V
V
V
= 4.5 V,  
= 4.5 V,  
= 5 V,  
I = –18 mA  
–1.2  
–1.2  
–1.2  
V
IK  
CC  
CC  
CC  
I
I
I
I
I
I
I
= –3 mA  
= –3 mA  
= –24 mA  
= –32 mA  
= 48 mA  
= 64 mA  
2.5  
3
2.5  
3
2.5  
3
OH  
OH  
OH  
OH  
OL  
OL  
V
OH  
2
2
V
= 4.5 V  
= 4.5 V  
CC  
CC  
2*  
2
0.55  
0.55  
V
V
V
V
OL  
0.55*  
0.55  
100  
mV  
µA  
hys  
Control inputs  
A or B ports  
±1  
±20  
±1  
±1  
±20  
I
I
V
V
= 5.5 V,  
V = V  
I
or GND  
CC  
CC  
±20  
I
off  
= 0,  
V or V 4.5 V  
±100  
±100  
µA  
µA  
CC  
CC  
I
O
V
V
= 5.5 V,  
= 5.5 V  
I
Outputs high  
50  
50  
50  
CEX  
O
I
I
I
V
V
V
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
V
V
V
= 2.5 V  
= 2.7 V  
= 0.5 V  
–50  
–100  
–180  
10  
–10  
3
–50  
–180  
10  
–10  
3
–50  
–180  
10  
–10  
3
mA  
µA  
µA  
O
CC  
CC  
CC  
O
O
O
§
OZH  
§
OZL  
Outputs high  
Outputs low  
V
I
= 5.5 V,  
= 0,  
CC  
O
I
A or B ports  
36  
3
36  
3
36  
3
mA  
CC  
V = V  
or GND  
CC  
I
Outputs disabled  
V
= 5.5 V, One input at 3.4 V,  
CC  
Other inputs at V  
50  
50  
50  
µA  
I  
CC  
or GND  
CC  
Control inputs V = 2.5 V or 0.5 V  
C
C
3
9
pF  
pF  
i
I
A or B ports  
V
O
= 2.5 V or 0.5 V  
io  
* On products compliant to MIL-PRF-38535, this parameter does not apply.  
§
All typical values are at V  
= 5 V.  
CC  
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
The parameters I and I include the input leakage current.  
OZH  
OZL  
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V  
or GND.  
CC  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Figure 1)  
SN54ABT16600 SN74ABT16600  
UNIT  
MIN  
MAX  
MIN  
MAX  
f
t
Clock frequency  
Pulse duration  
0
150  
0
150  
MHz  
ns  
clock  
LEAB or LEBA high  
2.5  
3
2.5  
3
w
CLKAB or CLKBA high or low  
A before CLKABor B before CLKBA↓  
A before LEABor B before LEBA↓  
CLKEN before CLK↓  
3
3
t
Setup time  
Hold time  
2.5  
2.5  
0
2.5  
2.5  
0
ns  
ns  
su  
h
A after CLKABor B after CLKBA↓  
A after LEABor B after LEBA↓  
CLKEN after CLK↓  
t
2
2
1
1
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)  
L
V
T
= 5 V,  
= 25°C  
CC  
A
SN54ABT16600 SN74ABT16600  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
150  
1.5  
1.5  
2
TYP  
MAX  
MIN  
150  
1.5  
1.5  
2
MAX  
MIN  
150  
1.5  
1.5  
2
MAX  
f
t
t
t
t
t
t
t
t
t
t
MHz  
ns  
max  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
2.5  
3.2  
3.2  
3.4  
3.5  
3.5  
3.4  
3.8  
4.5  
3.4  
3.6  
4.5  
4.5  
4.5  
4.7  
4.3  
4.6  
4.7  
5.4  
4.7  
4.2  
5.1  
5.6  
5.4  
5.4  
5.2  
5.3  
5.6  
6.6  
5.8  
4
4.9  
5
A or B  
B or A  
B or A  
B or A  
B or A  
B or A  
LEAB or LEBA  
ns  
ns  
ns  
ns  
2
2
2
5
2
2
2
5.3  
5
CLKAB or CLKBA  
OEAB or OEBA  
OEAB or OEBA  
2
2
2
1.5  
2
1.5  
2
1.5  
2
5.1  
5.4  
6.2  
5.4  
2
2
2
1.5  
1.5  
1.5  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ABT16600, SN74ABT16600  
18-BIT UNIVERSAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS209B – JUNE 1992 – REVISED JANUARY 1997  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
TEST  
/t  
S1  
S1  
500 Ω  
From Output  
Under Test  
t
Open  
7 V  
PLH PHL  
GND  
t
/t  
PLZ PZL  
C
= 50 pF  
t
/t  
Open  
L
PHZ PZH  
500 Ω  
(see Note A)  
3 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
3 V  
0 V  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
PZL  
t
t
t
PHL  
PLH  
PHL  
t
PLZ  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
V
V
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
PHZ  
t
PLH  
t
PZH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
V
OH  
– 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Aug-2014  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN74ABT16600DL  
OBSOLETE  
OBSOLETE  
SSOP  
SSOP  
DL  
56  
56  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
SN74ABT16600DLG4  
DL  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Aug-2014  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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