SN74AC04DBE4 [TI]
IC AC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SSOP-14, Gate;
| 型号： | SN74AC04DBE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | IC AC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SSOP-14, Gate 栅 输入元件 光电二极管 逻辑集成电路 |
| 文件： | 总20页 (文件大小：1156K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
D
D
D
2-V to 6-V V Operation
CC
Inputs Accept Voltages to 6 V
Max t of 7 ns at 5 V
pd
SN54AC04 . . . J OR W PACKAGE
SN74AC04 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54AC04 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
1A
1Y
2A
2Y
3A
VCC
6A
6Y
5A
5Y
4A
4Y
3
2
1
20 19
18
2A
NC
2Y
NC
3A
6Y
NC
5A
NC
5Y
4
5
6
7
8
17
16
15
14
3Y
GND
8
9 10 11 12 13
NC − No internal connection
description/ordering information
The ‘AC04 devices contain six independent inverters. The devices perform the Boolean function Y = A.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
PDIP − N
SOIC − D
Tube
SN74AC04N
SN74AC04N
Tube
SN74AC04D
AC04
Tape and reel
Tape and reel
Tape and reel
Tube
SN74AC04DR
SN74AC04NSR
SN74AC04DBR
SN74AC04PW
SN74AC04PWR
SNJ54AC04J
SNJ54AC04W
SNJ54AC04FK
SOP − NS
AC04
AC04
−40°C to 85°C
SSOP − DB
TSSOP − PW
AC04
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC04J
SNJ54AC04W
SNJ54AC04FK
Tube
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
logic diagram, each inverter (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
I
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
O
CC
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O
O
CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
O
O
CC
Continuous current through V or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
CC
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54AC04
SN74AC04
UNIT
MIN
2
MAX
MIN
2
MAX
V
V
Supply voltage
6
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
2.1
2.1
= 4.5 V
= 5.5 V
= 3 V
3.15
3.85
3.15
3.85
High-level input voltage
V
V
IH
0.9
1.35
1.65
0.9
1.35
1.65
= 4.5 V
= 5.5 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
CC
V
CC
0
0
V
CC
V
CC
V
V
I
Output voltage
O
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
−12
−24
−24
12
−12
−24
−24
12
= 4.5 V
= 5.5 V
= 3 V
I
High-level output current
Low-level output current
mA
mA
OH
= 4.5 V
= 5.5 V
24
24
I
OL
24
24
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
8
8
ns/V
T
A
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T = 25°C
SN54AC04
SN74AC04
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
2.9
TYP
2.99
4.49
5.49
MAX
MIN
2.9
4.4
5.4
2.4
3.7
4.7
3.85
MAX
MIN
2.9
MAX
3 V
4.5 V
5.5 V
3 V
4.4
4.4
I
= −50 μA
OH
5.4
5.4
I
I
= −12 mA
= −24 mA
2.56
3.86
4.86
2.46
3.76
4.76
OH
V
OH
V
4.5 V
5.5 V
5.5 V
5.5 V
3 V
OH
†
†
I
I
= −50 mA
= −75 mA
OH
3.85
OH
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
4.5 V
5.5 V
3 V
I
OL
= 50 μA
0.1
0.1
0.1
I
I
=12 mA
= 24 mA
0.36
0.36
0.36
0.5
0.44
0.44
0.44
OL
V
OL
V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
0.5
OL
0.5
†
I
I
= 50 mA
1.65
OL
†
= 75 mA
1.65
1
OL
I
I
V = V or GND
0.1
2
1
μA
μA
pF
I
CC
I
V = V or GND,
I = 0
O
40
20
CC
I
CC
C
V = V or GND
2.8
i
I
CC
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
4.5
SN54AC04
SN74AC04
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.5
MAX
9
MIN
1
MAX
MIN
1
MAX
t
t
11
10
10
PLH
A
Y
ns
1.5
4.5
8.5
1
1
9.5
PHL
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
4
SN54AC04
SN74AC04
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.5
MAX
7
MIN
1
MAX
MIN
1
MAX
t
t
8.5
7.5
7.5
7
PLH
A
Y
ns
1.5
3.5
6.5
1
1
PHL
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
C = 50 pF, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
45
pF
pd
L
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
TEST
/t
S1
Open
Input
(see Note B)
50% V
50% V
CC
CC
t
PLH PHL
0 V
t
t
t
PLH
PHL
PHL
2 × V
CC
V
OH
In-Phase
Output
50% V
S1
50% V
CC
CC
500 Ω
Open
From Output
Under Test
V
OL
t
PLH
C = 50 pF
L
500 Ω
V
OH
OL
(see Note A)
Out-of-Phase
Output
50% V
50% V
CC
CC
V
LOAD CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-87609012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
87609012A
SNJ54AC
04FK
5962-8760901CA
5962-8760901DA
SN74AC04D
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-40 to 85
5962-8760901CA
SNJ54AC04J
W
D
5962-8760901DA
SNJ54AC04W
SOIC
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
AC04
SN74AC04DBLE
SN74AC04DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AC04
SN74AC04DBRE4
SN74AC04DBRG4
SN74AC04DE4
SN74AC04DG4
SN74AC04DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
14
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AC04
Green (RoHS
& no Sb/Br)
AC04
Green (RoHS
& no Sb/Br)
AC04
D
50
Green (RoHS
& no Sb/Br)
AC04
D
2500
2500
2500
25
Green (RoHS
& no Sb/Br)
AC04
SN74AC04DRE4
SN74AC04DRG4
SN74AC04N
D
Green (RoHS
& no Sb/Br)
AC04
D
Green (RoHS
& no Sb/Br)
AC04
N
Pb-Free
(RoHS)
SN74AC04N
SN74AC04N
AC04
SN74AC04NE4
SN74AC04NSR
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
NS
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74AC04NSRE4
SN74AC04NSRG4
SN74AC04PW
ACTIVE
SO
NS
14
14
14
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
AC04
AC04
AC04
AC04
AC04
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
PW
PW
PW
2000
90
Green (RoHS
& no Sb/Br)
-40 to 85
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
-40 to 85
SN74AC04PWE4
SN74AC04PWG4
90
Green (RoHS
& no Sb/Br)
-40 to 85
90
Green (RoHS
& no Sb/Br)
-40 to 85
SN74AC04PWLE
SN74AC04PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AC04
AC04
AC04
5962-
SN74AC04PWRE4
SN74AC04PWRG4
SNJ54AC04FK
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
LCCC
PW
PW
FK
14
14
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-55 to 125
Green (RoHS
& no Sb/Br)
TBD
87609012A
SNJ54AC
04FK
SNJ54AC04J
SNJ54AC04W
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8760901CA
SNJ54AC04J
W
5962-8760901DA
SNJ54AC04W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC04, SN74AC04 :
Catalog: SN74AC04
•
Automotive: SN74AC04-Q1, SN74AC04-Q1
•
Enhanced Product: SN74AC04-EP, SN74AC04-EP
•
Military: SN54AC04
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AC04DBR
SN74AC04DR
SN74AC04PWR
SSOP
SOIC
DB
D
14
14
14
2000
2500
2000
330.0
330.0
330.0
16.4
16.4
12.4
8.2
6.5
6.9
6.6
9.0
5.6
2.5
2.1
1.6
12.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
TSSOP
PW
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AC04DBR
SN74AC04DR
SN74AC04PWR
SSOP
SOIC
DB
D
14
14
14
2000
2500
2000
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
35.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
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applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
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other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
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