SN74ACT374PWLE [TI]

OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS; 八D型边沿触发触发器具有三态输出
SN74ACT374PWLE
型号: SN74ACT374PWLE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS
八D型边沿触发触发器具有三态输出

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管 输出元件
文件: 总18页 (文件大小:719K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54ACT374, SN74ACT374  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002  
SN54ACT374 . . . J OR W PACKAGE  
SN74ACT374 . . . DB, DW, N, NS, OR PW PACKAGE  
(TOP VIEW)  
4.5-V to 5.5-V V  
Operation  
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 10 ns at 5 V  
pd  
Inputs Are TTL-Voltage Compatible  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
1Q  
1D  
2D  
2Q  
3Q  
3D  
4D  
4Q  
V
CC  
8Q  
8D  
7D  
7Q  
6Q  
6D  
5D  
5Q  
CLK  
description/ordering information  
These 8-bit flip-flops feature 3-state outputs  
designed specifically for driving highly capacitive  
or relatively low-impedance loads. The devices  
are particularly suitable for implementing buffer  
registers, I/O ports, bidirectional bus drivers, and  
working registers.  
GND  
The eight flip-flops of the ’ACT374 devices are  
D-type edge-triggered flip-flops. On the positive  
transition of the clock (CLK) input, the Q outputs  
are set to the logic levels set up at the data (D)  
inputs.  
SN54ACT374 . . . FK PACKAGE  
(TOP VIEW)  
A buffered output-enable (OE) input can be used  
to place the eight outputs in either a normal logic  
state (high or low logic levels) or the  
high-impedance state. In the high-impedance  
state, the outputs neither load nor drive the bus  
lines significantly. The high-impedance state and  
the increased drive provide the capability to drive  
bus lines in bus-organized systems without need  
for interface or pullup components.  
3
2 1 20 19  
18  
2D  
2Q  
3Q  
3D  
4D  
8D  
7D  
7Q  
6Q  
4
5
6
7
8
17  
16  
15  
14 6D  
9 10 11 12 13  
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while  
the outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP – N  
Tube  
SN74ACT374N  
SN74ACT374N  
Tube  
SN74ACT374DW  
SN74ACT374DWR  
SN74ACT374NSR  
SN74ACT374DBR  
SN74ACT374PWR  
SNJ54ACT374J  
SOIC – DW  
ACT374  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
–40°C to 85°C  
SOP – NS  
SSOP – DB  
TSSOP – PW  
CDIP – J  
ACT374  
AD374  
AD374  
SNJ54ACT374J  
SNJ54ACT374W  
SNJ54ACT374FK  
–55°C to 125°C  
CFP – W  
Tube  
SNJ54ACT374W  
SNJ54ACT374FK  
LCCC – FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2002, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT374, SN74ACT374  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS539F OCTOBER 1995 REVISED NOVEMBER 2002  
FUNCTION TABLE  
(each flip-flop)  
INPUTS  
CLK  
OUTPUT  
Q
OE  
L
D
H
L
H
L
L
L
H or L  
X
X
X
Q
0
H
Z
logic diagram (positive logic)  
1
OE  
11  
CLK  
C1  
1D  
2
1Q  
3
1D  
To Seven Other Channels  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
+ 0.5 V  
I
CC  
CC  
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
O
Input clamp current, I (V < 0 or V > V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
I
CC)  
O
Output clamp current, I  
(V < 0 or V > V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
CC)  
OK  
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT374, SN74ACT374  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS539F OCTOBER 1995 REVISED NOVEMBER 2002  
recommended operating conditions (see Note 3)  
SN54ACT374 SN74ACT374  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
0.8  
V
0
0
V
V
0
0
V
V
V
I
CC  
CC  
Output voltage  
V
O
CC  
CC  
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
24  
24  
24  
24  
8
mA  
mA  
ns/V  
°C  
OH  
OL  
I
t/v  
8
T
55  
125  
40  
85  
A
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
TYP  
SN54ACT374 SN74ACT374  
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
4.49  
I
I
= 50 µA  
OH  
5.4  
5.49  
5.4  
5.4  
3.86  
4.86  
3.7  
3.76  
4.76  
V
OH  
= 24 mA  
V
OH  
4.7  
I
I
= 50 mA  
= 75 mA  
3.85  
OH  
3.85  
OH  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
= 50 µA  
OL  
OL  
0.36  
0.36  
0.44  
0.5  
0.44  
0.44  
V
OL  
I
= 24 mA  
V
I
I
= 50 mA  
1.65  
OL  
= 75 mA  
1.65  
±2.5  
±1  
OL  
I
I
I
V
= V or GND  
CC  
±0.25  
±0.1  
4
±5  
±1  
80  
µA  
µA  
µA  
OZ  
O
V = V  
or GND  
or GND,  
I
I
CC  
CC  
V = V  
I = 0  
O
40  
CC  
I
One input at 3.4 V,  
Other inputs at GND or V  
5.5 V  
0.6  
4.5  
1.6  
1.5  
mA  
pF  
I  
CC  
CC  
C
V = V  
or GND  
CC  
5 V  
i
I
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.  
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V  
.
CC  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT374, SN74ACT374  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS539F OCTOBER 1995 REVISED NOVEMBER 2002  
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V ± 0.5 V  
CC  
T
= 25°C  
SN54ACT374 SN74ACT374  
A
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
f
t
t
t
Clock frequency  
100  
70  
90  
MHz  
ns  
clock  
Pulse duration, CLK high or low  
Setup time, data before CLK↑  
Hold time, data after CLK↑  
5
5
5
5.5  
1.5  
5
5.5  
1.5  
w
ns  
su  
h
1.5  
ns  
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
160  
8.5  
8
SN54ACT374 SN74ACT374  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
100  
2
MAX  
MIN  
70  
MAX  
MIN  
90  
2
MAX  
f
t
t
t
t
t
t
max  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
10  
9.5  
9.5  
9
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
12  
11.5  
11.5  
11.5  
13  
11.5  
11  
CLK  
Q
Q
Q
2
1.5  
1.5  
1.5  
1
2
8
10.5  
10.5  
12.5  
10  
ns  
ns  
OE  
OE  
1.5  
1.5  
1.5  
8
8.5  
7
11.5  
8.5  
11  
1
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 1 MHz  
TYP  
UNIT  
C
Power dissipation capacitance  
C
40  
pF  
pd  
L
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT374, SN74ACT374  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS539F OCTOBER 1995 REVISED NOVEMBER 2002  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CC  
Open  
TEST  
S1  
S1  
500 Ω  
t
t
/t  
Open  
PLH PHL  
/t  
From Output  
Under Test  
t
2 × V  
CC  
Open  
PLZ PZL  
/t  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
3 V  
0 V  
1.5 V  
Timing Input  
Data Input  
LOAD CIRCUIT  
t
h
t
su  
3 V  
0 V  
1.5 V  
1.5 V  
t
w
3 V  
VOLTAGE WAVEFORMS  
1.5 V  
1.5 V  
Input  
Output  
Control  
(low-level  
enabling)  
0 V  
3 V  
0 V  
VOLTAGE WAVEFORMS  
1.5 V  
1.5 V  
t
t
PZL  
PLZ  
Output  
Waveform 1  
V  
3 V  
CC  
Input  
50% V  
1.5 V  
1.5 V  
CC  
CC  
S1 at 2 × V  
(see Note B)  
CC  
V
V
+ 0.3 V  
OL  
V
OL  
0 V  
t
t
t
t
PZH  
PHZ  
PLH  
PHL  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
OH  
Output  
0.3 V  
OH  
50% V  
50% V  
50% V  
CC  
VOLTAGE WAVEFORMS  
includes probe and jig capacitance.  
CC  
V
0 V  
OL  
VOLTAGE WAVEFORMS  
NOTES: A.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CFP  
Drawing  
5962-87631012A  
5962-8763101RA  
5962-8763101SA  
5962-8763101VRA  
5962-8763101VSA  
SN74ACT374DBLE  
SN74ACT374DBR  
ACTIVE  
ACTIVE  
FK  
J
20  
20  
20  
20  
20  
20  
20  
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
ACTIVE  
W
J
ACTIVE  
CDIP  
CFP  
A42 SNPB  
Call TI  
ACTIVE  
W
DB  
DB  
OBSOLETE  
ACTIVE  
SSOP  
SSOP  
Call TI  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT374DBRE4  
SN74ACT374DBRG4  
SN74ACT374DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
DB  
DB  
DW  
DW  
DW  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT374DWE4  
SN74ACT374DWG4  
SN74ACT374DWR  
SN74ACT374DWRE4  
SN74ACT374DWRG4  
SN74ACT374N  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74ACT374NE4  
SN74ACT374NSR  
SN74ACT374NSRE4  
SN74ACT374NSRG4  
SN74ACT374PW  
N
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
NS  
NS  
NS  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT374PWE4  
SN74ACT374PWG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT374PWLE  
SN74ACT374PWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
LCCC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT374PWRE4  
SN74ACT374PWRG4  
SNJ54ACT374FK  
PW  
PW  
FK  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1
TBD  
POST-PLATE N / A for Pkg Type  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
SNJ54ACT374J  
SNJ54ACT374W  
ACTIVE  
ACTIVE  
J
20  
20  
1
1
TBD  
TBD  
A42 SNPB  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Aug-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
SN74ACT374DBR  
SN74ACT374DWR  
SN74ACT374NSR  
SN74ACT374PWR  
SSOP  
SOIC  
SO  
DB  
DW  
NS  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
16.4  
24.4  
24.4  
16.4  
8.2  
10.8  
8.2  
7.5  
13.0  
13.0  
7.1  
2.5  
2.7  
2.5  
1.6  
12.0  
12.0  
12.0  
8.0  
16.0  
24.0  
24.0  
16.0  
Q1  
Q1  
Q1  
Q1  
TSSOP  
PW  
6.95  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Aug-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74ACT374DBR  
SN74ACT374DWR  
SN74ACT374NSR  
SN74ACT374PWR  
SSOP  
SOIC  
SO  
DB  
DW  
NS  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
41.0  
41.0  
33.0  
TSSOP  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
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restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
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such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
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products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Amplifiers  
Data Converters  
DSP  
Clocks and Timers  
Interface  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/audio  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
Logic  
Military  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Optical Networking  
Security  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2008, Texas Instruments Incorporated  

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