SN74ACT574NSRG4 [TI]

OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS; 八D型边沿触发触发器具有三态输出
SN74ACT574NSRG4
型号: SN74ACT574NSRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS
八D型边沿触发触发器具有三态输出

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管 输出元件
文件: 总15页 (文件大小:526K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54ACT574, SN74ACT574  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS537D – OCTOBER 1995 – REVISED NOVEMBER 2002  
SN54ACT574 . . . J OR W PACKAGE  
SN74ACT574 . . . DB, DW, N, NS, OR PW PACKAGE  
(TOP VIEW)  
4.5-V to 5.5-V V  
Operation  
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 9 ns at 5 V  
pd  
Inputs Are TTL-Voltage Compatible  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
1D  
2D  
3D  
4D  
5D  
6D  
7D  
8D  
V
CC  
1Q  
2Q  
3Q  
4Q  
5Q  
6Q  
7Q  
8Q  
CLK  
description/ordering information  
These 8-bit flip-flops feature 3-state outputs  
designed specifically for driving highly capacitive  
or relatively low-impedance loads. The devices  
are particularly suitable for implementing buffer  
registers, I/O ports, bidirectional bus drivers, and  
working registers.  
GND  
The eight flip-flops of the ’ACT574 devices are  
D-type edge-triggered flip-flops. On the positive  
transition of the clock (CLK) input, the Q outputs  
are set to the logic levels set up at the data (D)  
inputs.  
SN54ACT574 . . . FK PACKAGE  
(TOP VIEW)  
A buffered output-enable (OE) input can be used  
to place the eight outputs in either a normal logic  
state (high or low logic levels) or the  
high-impedance state. In the high-impedance  
state, the outputs neither load nor drive the bus  
lines significantly. The high-impedance state and  
the increased drive provide the capability to drive  
bus lines in a bus-organized system without need  
for interface or pullup components.  
3
2
1
20 19  
18  
4
5
6
7
8
3D  
4D  
5D  
6D  
7D  
2Q  
3Q  
4Q  
5Q  
6Q  
17  
16  
15  
14  
9 10 11 12 13  
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while  
the outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP – N  
Tube  
SN74ACT574N  
SN74ACT574N  
Tube  
SN74ACT574DW  
SN74ACT574DWR  
SN74ACT574NSR  
SN74ACT574DBR  
SN74ACT574PWR  
SNJ54ACT574J  
SOIC – DW  
ACT574  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
–40°C to 85°C  
SOP – NS  
SSOP – DB  
TSSOP – PW  
CDIP – J  
ACT574  
AD574  
AD574  
SNJ54ACT574J  
SNJ54ACT574W  
SNJ54ACT574FK  
–55°C to 125°C  
CFP – W  
Tube  
SNJ54ACT574W  
SNJ54ACT574FK  
LCCC – FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2002, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT574, SN74ACT574  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS537D OCTOBER 1995 REVISED NOVEMBER 2002  
FUNCTION TABLE  
(each flip-flop)  
INPUTS  
CLK  
OUTPUT  
Q
OE  
L
D
H
L
H
L
L
L
H or L  
X
X
X
Q
0
H
Z
logic diagram (positive logic)  
1
OE  
11  
CLK  
C1  
1D  
19  
1Q  
2
1D  
To Seven Other Channels  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
+ 0.5 V  
I
CC  
CC  
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
O
Input clamp current, I (V < 0 or V > V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
I
CC)  
O
Output clamp current, I  
(V < 0 or V > V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
CC)  
OK  
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT574, SN74ACT574  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS537D OCTOBER 1995 REVISED NOVEMBER 2002  
recommended operating conditions (see Note 3)  
SN54ACT574 SN74ACT574  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
0.8  
V
0
0
V
V
0
0
V
V
V
I
CC  
CC  
Output voltage  
V
O
CC  
CC  
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
24  
24  
24  
24  
8
mA  
mA  
ns/V  
°C  
OH  
OL  
I
t/v  
8
T
55  
125  
40  
85  
A
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
TYP  
SN54ACT574 SN74ACT574  
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
4.5 V  
5.5 V  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
4.49  
I
I
= 50 µA  
OH  
5.4  
5.49  
5.4  
5.4  
3.86  
4.86  
3.7  
3.76  
4.76  
V
OH  
= 24 mA  
V
OH  
4.7  
I
I
= 50 mA  
= 75 mA  
3.85  
OH  
3.85  
OH  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
= 50 µA  
OL  
OL  
0.36  
0.36  
0.44  
0.44  
1.65  
0.44  
0.44  
V
OL  
I
= 24 mA  
V
I
I
= 50 mA  
OL  
= 75 mA  
1.65  
±2.5  
±1  
OL  
I
I
I
V
= V or GND  
CC  
±0.25  
±0.1  
4
±5  
±1  
80  
µA  
µA  
µA  
OZ  
O
V = V  
or GND  
or GND,  
I
I
CC  
CC  
V = V  
I = 0  
O
40  
CC  
I
One input at 3.4 V,  
Other inputs at GND or V  
I  
CC  
5.5 V  
0.6  
4.5  
1.5  
1.5  
mA  
pF  
CC  
C
V = V  
or GND  
CC  
5 V  
i
I
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.  
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V  
.
CC  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT574, SN74ACT574  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS537D OCTOBER 1995 REVISED NOVEMBER 2002  
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V ± 0.5 V  
CC  
T
= 25°C  
SN54ACT574 SN74ACT574  
A
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
f
t
t
t
Clock frequency  
100  
70  
85  
MHz  
ns  
clock  
Pulse duration, CLK high or low  
Setup time, data before CLK↑  
Hold time, data after CLK↑  
3
2.5  
1
5
3.5  
2
4
2.5  
1
w
ns  
su  
h
ns  
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
110  
7
SN54ACT574 SN74ACT574  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
100  
2.5  
2
MAX  
MIN  
70  
MAX  
MIN  
85  
MAX  
f
t
t
t
t
t
t
max  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
11  
10  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
13.5  
12.5  
11  
2
12  
11  
CLK  
Q
Q
Q
6.5  
6.4  
6
1.5  
1.5  
1.5  
1.5  
1.5  
2
9.5  
9
10  
ns  
ns  
OE  
OE  
2
11  
10  
2
7
10.5  
8.5  
12  
11.5  
9
2
5.5  
10  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 1 MHz  
TYP  
UNIT  
C
Power dissipation capacitance  
C
40  
pF  
pd  
L
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54ACT574, SN74ACT574  
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCAS537D OCTOBER 1995 REVISED NOVEMBER 2002  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CC  
Open  
TEST  
S1  
S1  
500 Ω  
t
t
/t  
Open  
PLH PHL  
/t  
From Output  
Under Test  
t
2 × V  
CC  
Open  
PLZ PZL  
/t  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
3 V  
0 V  
1.5 V  
Timing Input  
Data Input  
LOAD CIRCUIT  
t
h
t
su  
3 V  
0 V  
1.5 V  
1.5 V  
t
w
3 V  
VOLTAGE WAVEFORMS  
1.5 V  
1.5 V  
Input  
Output  
Control  
(low-level  
enabling)  
0 V  
3 V  
0 V  
VOLTAGE WAVEFORMS  
1.5 V  
1.5 V  
t
t
PZL  
PLZ  
Output  
Waveform 1  
V  
3 V  
CC  
Input  
50% V  
1.5 V  
1.5 V  
CC  
CC  
S1 at 2 × V  
(see Note B)  
CC  
V
V
+ 0.3 V  
OL  
V
OL  
0 V  
t
t
t
t
PZH  
PHZ  
PLH  
PHL  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
OH  
Output  
0.3 V  
OH  
50% V  
50% V  
50% V  
CC  
VOLTAGE WAVEFORMS  
includes probe and jig capacitance.  
CC  
V
0 V  
OL  
VOLTAGE WAVEFORMS  
NOTES: A.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SSOP  
SSOP  
Drawing  
SN74ACT574DBLE  
SN74ACT574DBR  
OBSOLETE  
ACTIVE  
DB  
20  
20  
TBD  
Call TI  
Call TI  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT574DBRE4  
SN74ACT574DBRG4  
SN74ACT574DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
DB  
DB  
DW  
DW  
DW  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT574DWE4  
SN74ACT574DWG4  
SN74ACT574DWR  
SN74ACT574DWRE4  
SN74ACT574DWRG4  
SN74ACT574N  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74ACT574NE4  
SN74ACT574NSR  
SN74ACT574NSRE4  
SN74ACT574NSRG4  
SN74ACT574PW  
N
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
NS  
NS  
NS  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT574PWE4  
SN74ACT574PWG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT574PWLE  
SN74ACT574PWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ACT574PWRE4  
SN74ACT574PWRG4  
PW  
PW  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
(mm)  
16  
SN74ACT574DBR  
SN74ACT574DWR  
SN74ACT574NSR  
SN74ACT574PWR  
DB  
DW  
NS  
20  
20  
20  
20  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
8.2  
10.8  
8.2  
7.5  
13.0  
13.0  
7.1  
2.5  
2.7  
2.5  
1.6  
12  
12  
12  
8
16  
24  
24  
16  
Q1  
Q1  
Q1  
Q1  
24  
24  
PW  
16  
6.95  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74ACT574DBR  
SN74ACT574DWR  
SN74ACT574NSR  
SN74ACT574PWR  
DB  
DW  
NS  
20  
20  
20  
20  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
41.0  
41.0  
33.0  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
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specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
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Data Converters  
DSP  
Applications  
Audio  
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dataconverter.ti.com  
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Military  
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www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
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logic.ti.com  
Logic  
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Microcontrollers  
RFID  
power.ti.com  
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Security  
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www.ti.com/security  
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Wireless  
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Copyright © 2007, Texas Instruments Incorporated  

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