SN74AHC00QPWRG4Q1 [TI]
汽车类 4 通道、2 输入、2V 至 5.5V 与非门 | PW | 14 | -40 to 125;
| 型号： | SN74AHC00QPWRG4Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类 4 通道、2 输入、2V 至 5.5V 与非门 | PW | 14 | -40 to 125 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总22页 (文件大小：1743K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
SN74AHC00-Q1 汽车类四路双输入正与非门
1 特性
2 说明
• 符合汽车应用要求
• 工作电压范围为2V 至5.5V VCC
• 闩锁性能超过250mA，符合JESD 17 规范的要求
SN74AHC00 器件以正逻辑执行布尔函数 Y = A •B 或
Y = A + B。
封装信息
封装(1)
封装尺寸2
器件型号
D（SOIC，14）
8.65 mm x 6 mm
SN74AHC00-Q1
PW（TSSOP，14） 5.00 mm x 6.4 mm
BQA（WQFN，14） 3mm x 2.5mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 封装尺寸（长x 宽）为标称值，并包括引脚（如适用）。
图2-1. 逻辑图，每个逻辑门（正逻辑）
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SGDS013
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
www.ti.com.cn
Table of Contents
5.9 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................7
7 Detailed Description........................................................8
7.1 Functional Block Diagram...........................................8
7.2 Device Functional Modes............................................8
8 Device and Documentation Support..............................9
8.1 Documentation Support.............................................. 9
8.2 接收文档更新通知....................................................... 9
8.3 支持资源......................................................................9
8.4 Trademarks.................................................................9
8.5 静电放电警告.............................................................. 9
8.6 术语表......................................................................... 9
9 Mechanical, Packaging, and Orderable Information..10
1 特性................................................................................... 1
2 说明................................................................................... 1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 ESD Ratings............................................................... 4
5.3 Recommended Operating Conditions.........................4
5.4 Thermal Information....................................................5
5.5 Electrical Characteristics.............................................5
5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V...........5
5.7 Switching Characteristics, VCC = 5 V ± 0.5 V..............5
5.8 Noise Characteristics..................................................6
3 Revision History
Changes from Revision B (April 2008) to Revision C (June 2023)
Page
• 添加了封装信息表、引脚功能表、ESD 等级表、热信息表、器件功能模式、器件和文档支持部分以及机
械、封装和可订购信息 部分............................................................................................................................... 1
• 向封装信息 表中添加了 BQA 封装......................................................................................................................1
• Updated thermal values for PW package from RθJA = 113 to 147.7, all values in °C/W..................................5
• Added thermal value for RθJA: BQA = 88.3, all values in °C/W....................................................................... 5
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SGDS013
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4 Pin Configuration and Functions
图4-1. D or PW Package (Top View)
PIN
TYPE1
DESCRIPTION
NO.
1
NAME
1A
I
I
1A Input
1B Input
1Y Output
2A Input
2B Input
2Y Output
GND
2
1B
3
1Y
O
I
4
2A
5
2B
I
6
2Y
O
7
GND
3Y
–
O
I
8
3Y Output
3A Input
3B Input
4Y Output
4A Input
4B Input
Power Pin
9
3A
10
11
12
13
14
3B
I
4Y
O
I
4A
4B
I
VCC
—
1. Signal Types: I = Input, O = Output, I/O = Input or Output.
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English Data Sheet: SGDS013
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
−0.5
−0.5
−0.5
MAX
UNIT
V
VCC
Supply voltage range
7
7
1
VI
Input voltage range
V
1
VO
IIK
Output voltage range
VCC + 0.5
V
Input clamp current
(VI < 0)
mA
mA
mA
mA
°C
−20
±20
±25
±50
150
IOK
IO
Output clamp current
(VO < 0 or VO > VCC)
Continuous output current
Continuous current through VCC or GND
Storage temperature range
(VO = 0 to VCC)
Tstg
−65
(1) Stresses beyond those listed under “absolute maximum ratings”may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions”is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human body model (HBM), per AEC Q100-0021
Charged device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
5.3 Recommended Operating Conditions
over recommended operating free-air temperature range (unless otherwise noted)1
MIN MAX UNIT
VCC
Supply voltage
2
1.5
5.5
V
VCC = 2 V
VCC = 3 V
VCC = 5.5 V
VCC = 2 V
VCC = 3 V
VCC = 5.5 V
VIH
High-level input voltage
2.1
V
3.85
0.5
0.9
1.65
5.5
VCC
−50
−4
VIL
Low-level input voltage
V
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 2 V
μΑ
IOH
High-level output current
Low-level output current
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
VCC = 2 V
mA
−8
50
μΑ
IOL
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
Q-suffix devices
I-suffix devices
4
mA
8
100
20
Input transition rise or fall rate
Operating free-air temperature
ns/V
°C
Δt/Δv
125
85
−40
−40
TA
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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English Data Sheet: SGDS013
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5.4 Thermal Information
SN74AHC00-Q1
THERMAL METRIC1
D (SOIC)
14 PINS
86
PW (TSSOP)
14 PINS
147.7
BQA (WQFN)
14 PINS
88.3
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
5.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
TA = −40 °C to TA = −40 °C to
125°C 85°C
TA = 25 °C
PARAMETER
TEST CONDITIONS
VCC
UNIT
MIN TYP MAX
MIN MAX MIN
MAX
2 V
3 V
1.9
2.9
2
3
1.9
2.9
1.9
2.9
IOH = −50 μΑ
4.5 V
3 V
4.4
4.5
4.4
4.4
VOH
V
V
2.58
3.94
2.48
3.8
2.48
3.8
IOH = −4 mA
IOH = −8 mA
4.5 V
2 V
0.1
0.1
0.1
0.36
0.36
±0.1
2
0.1
0.1
0.1
0.5
0.5
±1
0.1
0.1
0.1
0.44
0.44
±1
3 V
IOL = 50 μΑ
VOL
4.5 V
3 V
IOL = 4 mA
IOL = 8 mA
4.5 V
0 V to 5.5 V
5.5 V
5 V
II
Vl = 5.5 V or GND
Vl = VCC or GND,
Vl = VCC or GND
μΑ
μA
pF
ICC
Ci
IO = 0
20
20
2
10
10
5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Load Circuit and
Voltage Waveforms)
TA = −40 °C to TA = −40 °C to
TA = 25 °C
LOAD
CAPACITANCE
125°C
85°C
PARAMETER FROM (INPUT) TO (OUTPUT)
UNIT
MIN TYP MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
5.5
5.5
8
7.9
7.9
1
1
1
1
9.5
9.5
13
1
1
1
1
9.5
9.5
13
A or B
A or B
Y
Y
CL = 15 pF
CL = 50 pF
ns
ns
11.4
11.4
8
13
13
5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Load Circuit and
Voltage Waveforms)
TA = −40 °C to TA = −40 °C to
TA = 25 °C
LOAD
CAPACITANCE
125°C
85°C
PARAMETER FROM (INPUT) TO (OUTPUT)
UNIT
MIN TYP MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
3.7
3.7
5.2
5.2
5.5
5.5
7.5
7.5
1
1
1
1
6.5
6.5
8.5
8.5
1
1
1
1
6.5
6.5
8.5
8.5
A or B
A or B
Y
Y
CL = 15 pF
CL = 50 pF
ns
ns
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English Data Sheet: SGDS013
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
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MAX UNIT
5.8 Noise Characteristics
VCC = 5 V, CL = 50 pF, TA = 25°C 1
PARAMETER
MIN
TYP
0.3
VOL(P)
VOL(V)
VOH(V)
VIH(D)
VIL(D)
Quiet output, maximum dynamic VOL
0.8
V
V
V
V
V
Quiet output, minimum dynamic VOL
Quiet output, minimum dynamic VOH
High-level dynamic input voltage
Low-level dynamic input voltage
−0.3
4.61
−0.8
3.5
1.5
1. Characteristics are for surface-mount packages only.
5.9 Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP UNIT
9.5 pF
Cpd
Power dissipation capacitance
No load, f = 1 MHz
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6 Parameter Measurement Information
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
图6-1. Load Circuit and Voltage Waveforms
TEST
tPLH/tPHL
tPLZ/tPZL
S1
Open
VCC
tPHZ/tPZH
Open Drain
GND
VCC
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English Data Sheet: SGDS013
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
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7 Detailed Description
7.1 Functional Block Diagram
图7-1. Logic Diagram, Each Gate (Positive Logic)
7.2 Device Functional Modes
表7-1. Function Table (Each Gate)
INPUTS
OUTPUT Y
B
A
H
L
H
X
L
L
H
H
X
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ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
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8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
8.1 Documentation Support
8.1.1 Related Documentation
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
表8-1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
SN74AHC00-Q1
Click here
Click here
Click here
Click here
Click here
8.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
8.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
8.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
8.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
8.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2023 Texas Instruments Incorporated
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English Data Sheet: SGDS013
SN74AHC00-Q1
ZHCSSE9C –FEBRUARY 2002 –REVISED JUNE 2023
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9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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5-Jul-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74AHC00QDRG4Q1
SN74AHC00QDRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
14
2500 RoHS & Green
2500 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
AHC00Q
Samples
Samples
Samples
Samples
Samples
NIPDAU
NIPDAU
NIPDAU
NIPDAU
AHC00Q
HA00Q
SN74AHC00QPWRG4Q1
SN74AHC00QPWRQ1
SN74AHC00QWBQARQ1
TSSOP
TSSOP
WQFN
PW
PW
BQA
HA00Q
AHC00Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jul-2023
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHC00-Q1 :
Catalog : SN74AHC00
•
Enhanced Product : SN74AHC00-EP
•
Military : SN54AHC00
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Jul-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHC00QPWRG4Q1 TSSOP
SN74AHC00QPWRQ1 TSSOP
SN74AHC00QWBQARQ1 WQFN
PW
PW
14
14
14
2000
2000
3000
330.0
330.0
180.0
12.4
12.4
12.4
6.9
6.9
2.8
5.6
5.6
3.3
1.6
1.6
1.1
8.0
8.0
4.0
12.0
12.0
12.0
Q1
Q1
Q1
BQA
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Jul-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHC00QPWRG4Q1
SN74AHC00QPWRQ1
SN74AHC00QWBQARQ1
TSSOP
TSSOP
WQFN
PW
PW
14
14
14
2000
2000
3000
356.0
356.0
210.0
356.0
356.0
185.0
35.0
35.0
35.0
BQA
Pack Materials-Page 2
GENERIC PACKAGE VIEW
BQA 14
2.5 x 3, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4227145/A
www.ti.com
PACKAGE OUTLINE
BQA0014B
WQFN - 0.8 mm max height
S
C
A
L
E
4
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
3.1
2.9
0.1 MIN
(0.13)
A
-
A
3
5
.
0
0
0
SECTION A-A
TYPICAL
0.8
0.6
C
SEATING PLANE
0.08 C
0.05
0.00
1
0.1
2X 0.5
(0.2) TYP
SYMM
7
8
EXPOSED
THERMAL PAD
6
9
(0.16)
TYP
SYMM
15
A
A
1.5 0.1
2X 2
8X 0.5
13
2
0.3
0.2
14X
PIN 1 ID
1
14
0.1
C A B
0.5
0.3
0.05
14X
4227062/B 09/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
BQA0014B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1)
SYMM
SEE SOLDER MASK
DETAIL
14
1
14X (0.6)
2
14X (0.25)
13
10X (0.5)
(0.5)
15
SYMM
(2.8)
(1.5)
6
9
(R0.05) TYP
(
0.2) TYP
VIA
7
8
(2.3)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4227062/B 09/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
BQA0014B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.95)
14
1
14X (0.6)
14X (0.25)
2
13
(2.8)
10X (0.5)
15
SYMM
(1.38)
(R0.05) TYP
6
9
7
8
SYMM
(2.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 15
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4227062/B 09/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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