SN74AHC244Q [TI]

具有三态输出的 8 通道、2V 至 5.5V 缓冲器;
SN74AHC244Q
型号: SN74AHC244Q
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有三态输出的 8 通道、2V 至 5.5V 缓冲器

驱动 总线驱动器 总线收发器
文件: 总13页 (文件大小:607K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74AHC244Q  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
SGDS017 – FEBRUARY 2002  
DW OR PW PACKAGE  
(TOP VIEW)  
Q Devices Meet Automotive Performance  
Requirements  
Customer-Specific Configuration Control  
Can Be Supported Along With  
Major-Change Approval  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
EPIC (Enhanced-Performance Implanted  
CMOS) Process  
Operating Range 2-V to 5.5-V V  
CC  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
13 2A2  
12 1Y4  
description  
11  
2A1  
This octal buffer/driver is designed specifically to  
improve the performance and density of 3-state  
memory-address drivers, clock drivers, and  
bus-oriented receivers and transmitters.  
The SN74AHC244Q is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs.  
When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are  
in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
SOIC – D  
Tape and reel  
Tape and reel  
SN74AHC244QDWR  
SN74AHC244QPWR  
AHC244Q  
HA244Q  
–40°C to 125°C  
TSSOP – PW  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
FUNCTION TABLE  
(each 4-bit buffer/driver)  
INPUTS  
OUTPUT  
Y
OE  
A
H
L
L
L
H
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC is a trademark of Texas Instruments.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHC244Q  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
SGDS017 FEBRUARY 2002  
logic symbol  
1
19  
1OE  
EN  
EN  
2OE  
2
4
6
8
18  
16  
14  
12  
11  
13  
15  
17  
9
7
5
3
1A1  
1A2  
1A3  
1A4  
1Y1  
1Y2  
1Y3  
1Y4  
2A1  
2A2  
2A3  
2A4  
2Y1  
2Y2  
2Y3  
2Y4  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
logic diagram (positive logic)  
1
19  
11  
1OE  
2OE  
2A1  
2
18  
16  
14  
12  
9
7
5
3
1A1  
1Y1  
1Y2  
1Y3  
1Y4  
2Y1  
2Y2  
2Y3  
2Y4  
4
13  
15  
17  
1A2  
2A2  
2A3  
2A4  
6
1A3  
8
1A4  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
IK  
I
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
JA  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHC244Q  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
SGDS017 FEBRUARY 2002  
recommended operating conditions (see Note 3)  
MIN  
2
MAX  
UNIT  
V
Supply voltage  
5.5  
V
CC  
IH  
V
V
V
V
V
V
= 2 V  
1.5  
2.1  
3.85  
CC  
CC  
CC  
CC  
CC  
CC  
V
High-level input voltage  
= 3 V  
V
V
= 5.5 V  
= 2 V  
0.5  
0.9  
V
IL  
Low-level input voltage  
= 3 V  
= 5.5 V  
1.65  
5.5  
V
V
Input voltage  
0
0
V
V
A
I
Output voltage  
V
CC  
O
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
50  
4  
8  
50  
4
I
High-level output current  
Low-level output current  
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
= 2 V  
OH  
OL  
mA  
A
I
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
mA  
8
100  
20  
125  
t/∆v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
T
A
40  
°C  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
TYP  
2
PARAMETER  
TEST CONDITIONS  
V
MIN  
MAX  
UNIT  
CC  
MIN  
1.9  
MAX  
2 V  
3 V  
1.9  
2.9  
I
= 50  
A
2.9  
3
OH  
4.5 V  
3 V  
4.4  
4.5  
4.4  
V
V
OH  
OL  
2.58  
3.94  
2.48  
3.8  
I
I
= 4 mA  
= 8 mA  
OH  
4.5 V  
2 V  
OH  
0.1  
0.1  
0.1  
0.1  
0.1  
0.5  
0.5  
±1  
I
= 50  
A
3 V  
OL  
4.5 V  
3 V  
0.1  
V
V
0.36  
0.36  
±0.1  
±0.25  
4
I
I
= 4 mA  
= 8 mA  
OL  
4.5 V  
0 V to 5.5 V  
5.5 V  
5.5 V  
5 V  
OL  
I
I
I
V = 5.5 V or GND  
A
A
I
I
V
= V  
or GND,  
V (OE) = V or V  
±2.5  
40  
OZ  
CC  
O
CC  
I
IL  
IH  
V = V  
or GND,  
or GND  
I
O
= 0  
A
I
CC  
CC  
C
C
V = V  
2
10  
pF  
pF  
i
I
V
= V or GND  
CC  
5 V  
3.5  
o
O
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHC244Q  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
SGDS017 FEBRUARY 2002  
switching characteristics over recommended operating free-air temperature range,  
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
5.8  
5.8  
6.6  
6.6  
5
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
MIN  
MAX  
8.4  
t
t
t
t
t
t
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
10  
10  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
Y
Y
Y
C
C
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 50 pF  
= 50 pF  
= 50 pF  
L
L
L
L
L
L
8.4  
10.6  
10.6  
9.7  
12.5  
12.5  
11  
ns  
OE  
OE  
A
ns  
5
9.7  
11  
8.3  
8.3  
9.1  
9.1  
10.3  
10.3  
11.9  
11.9  
14.1  
14.1  
14  
13.5  
13.5  
16  
ns  
ns  
OE  
OE  
16  
16  
ns  
14  
16  
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
3.9  
3.9  
4.7  
4.7  
5
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
MIN  
MAX  
5.5  
5.5  
7.3  
7.3  
7.2  
7.2  
7.5  
7.5  
9.3  
9.3  
9.2  
9.2  
t
t
t
t
t
t
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
6.5  
6.5  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
Y
Y
Y
C
C
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 50 pF  
= 50 pF  
= 50 pF  
L
L
L
L
L
L
8.5  
ns  
OE  
OE  
A
8.5  
8.5  
ns  
5
8.5  
5.4  
5.4  
6.2  
6.2  
6.7  
6.7  
8.5  
ns  
8.5  
10.5  
10.5  
10.5  
10.5  
ns  
OE  
OE  
ns  
noise characteristics, V  
= 5 V, C = 50 pF, T = 25°C (see Note 4)  
CC  
L
A
PARAMETER  
MIN  
TYP  
0.5  
MAX  
UNIT  
V
V
V
V
V
Quiet output, maximum dynamic V  
Quiet output, minimum dynamic V  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
0.2  
4.8  
OL  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
OH  
3.5  
1.5  
NOTE 4: Characteristics are for surface-mount packages only.  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
No load, f = 1 MHz  
TYP  
UNIT  
C
Power dissipation capacitance  
8.6  
pF  
pd  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHC244Q  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
SGDS017 FEBRUARY 2002  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
50% V  
CC  
Timing Input  
0 V  
t
w
t
h
t
su  
V
CC  
V
CC  
50% V  
50% V  
CC  
Input  
CC  
50% V  
50% V  
CC  
Data Input  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
50% V  
50% V  
50% V  
t
Input  
CC  
CC  
CC  
CC  
0 V  
0 V  
t
t
t
t
PZL  
PLZ  
PLH  
PHL  
Output  
Waveform 1  
V
OH  
V  
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
(see Note B)  
V
OL  
+ 0.3 V  
CC  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
Out-of-Phase  
Output  
V
OH  
0.3 V  
50% V  
50% V  
50% V  
CC  
CC  
CC  
V
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
SN74AHC244QDWR  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
20  
20  
TBD  
Call TI  
Call TI  
SN74AHC244QDWRG4  
2000  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
SN74AHC244QDWRG4Q1  
SN74AHC244QPWR  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
DW  
PW  
PW  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
SN74AHC244QPWRG4  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74AHC244QPWR  
TSSOP  
PW  
20  
2000  
330.0  
16.4  
6.95  
7.1  
1.6  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 38.0  
SN74AHC244QPWR  
2000  
Pack Materials-Page 2  
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