SN74AHC245QWRKSRQ1 [TI]
汽车类具有三态输出的八路总线收发器 | RKS | 20 | -40 to 125;
| 型号： | SN74AHC245QWRKSRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类具有三态输出的八路总线收发器 | RKS | 20 | -40 to 125 总线收发器 |
| 文件： | 总11页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢃ ꢈꢉ ꢊ ꢋ
ꢌ ꢆꢍꢄꢎ ꢏꢐꢀ ꢍ ꢑꢄꢁ ꢀꢆ ꢒ ꢓꢔ ꢒ ꢑ
ꢕ ꢓꢍ ꢅ ꢖ ꢉꢀꢍꢄꢍ ꢒ ꢌ ꢐꢍ ꢗꢐ ꢍꢀ
SCLS527A − AUGUST 2003 − REVISED APRIL 2008
DW OR PW PACKAGE
(TOP VIEW)
D
D
Qualified for Automotive Applications
ESD Protection Exceeds 1000 V Per
MIL-STD-883, Method 3015; Exceeds 100 V
Using Machine Model (C = 200 pF, R = 0)
DIR
A1
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
OE
B1
B2
B3
B4
B5
B6
B7
B8
D
Operating Range 2-V to 5.5-V V
CC
A2
A3
description/ordering information
A4
A5
The SN74AHC245 octal bus transceiver is designed
for asynchronous two-way communication between
data buses. The control-function implementation
minimizes external timing requirements.
A6
A7
A8
GND
This device allows data transmission from the A bus
to the B bus or from the B bus to the A bus, depending
on the logic level at the direction-control (DIR) input.
The output-enable (OE) input can be used to disable
the device so that the buses effectively are isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
{
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOIC − DW
Tape and reel
SN74AHC245QDWRQ1
SN74AHC245QPWRQ1
AHC245Q1
AHC245Q1
−40°C to 125°C
TSSOP − PW Tape and reel
†
‡
For the most current package and ordering information, see the Package Option Addendum at the end of
this document, or see the TI web site at http://www.ti.com.
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each transceiver)
INPUTS
OPERATION
OE
L
DIR
L
B data to A bus
A data to B bus
Isolation
L
H
H
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢗ
ꢗ
ꢑ
ꢌ
ꢨ
ꢘ
ꢣ
ꢐ
ꢆ
ꢡ
ꢍ
ꢢ
ꢓ
ꢜ
ꢌ
ꢚ
ꢁ
ꢛ
ꢘ
ꢄ
ꢍ
ꢄ
ꢙ
ꢚ
ꢤ
ꢛ
ꢜ
ꢢ
ꢝ
ꢞ
ꢟ
ꢟ
ꢠ
ꢠ
ꢙ
ꢙ
ꢜ
ꢜ
ꢚ
ꢚ
ꢙ
ꢡ
ꢡ
ꢥ
ꢢ
ꢣ
ꢝ
ꢝ
ꢤ
ꢤ
ꢚ
ꢠ
ꢟ
ꢞ
ꢡ
ꢡ
ꢜ
ꢛ
ꢥ
ꢍꢤ
ꢣ
ꢦ
ꢡ
ꢧ
ꢙ
ꢢ
ꢟ
ꢡ
ꢠ
ꢙ
ꢠ
ꢜ
ꢝ
ꢚ
ꢣ
ꢨ
ꢟ
ꢚ
ꢠ
ꢠ
ꢤ
ꢡ
ꢩ
Copyright 2008, Texas Instruments Incorporated
ꢝ
ꢜ
ꢢ
ꢠ
ꢜ
ꢝ
ꢞ
ꢠ
ꢜ
ꢡ
ꢥ
ꢙ
ꢛ
ꢙ
ꢢ
ꢤ
ꢝ
ꢠ
ꢪ
ꢠ
ꢤ
ꢝ
ꢜ
ꢛ
ꢫ
ꢟ
ꢓ
ꢚ
ꢞ
ꢤ
ꢡ
ꢠ
ꢟ
ꢚ
ꢨ
ꢟ
ꢝ
ꢨ
ꢬ
ꢟ
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ
ꢝ
ꢝ
ꢟ
ꢚ
ꢠ
ꢭ
ꢩ
ꢗ
ꢝ
ꢜ
ꢨ
ꢣ
ꢢ
ꢠ
ꢙ
ꢜ
ꢚ
ꢥ
ꢝ
ꢜ
ꢢ
ꢤ
ꢡ
ꢡ
ꢙ
ꢚ
ꢮ
ꢨ
ꢜ
ꢤ
ꢡ
ꢚ
ꢜ
ꢠ
ꢚ
ꢤ
ꢢ
ꢤ
ꢡ
ꢡ
ꢟ
ꢝ
ꢙ
ꢧ
ꢭ
ꢙ
ꢚ
ꢢ
ꢧ
ꢣ
ꢨ
ꢤ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢃ ꢈꢉꢊ ꢋ
ꢌꢆ ꢍꢄ ꢎ ꢏ ꢐꢀ ꢍ ꢑ ꢄꢁ ꢀꢆ ꢒꢓ ꢔ ꢒ ꢑ
ꢕꢓ ꢍ ꢅ ꢖ ꢉꢀꢍꢄꢍ ꢒ ꢌꢐꢍ ꢗ ꢐꢍꢀ
SCLS527A − AUGUST 2003 − REVISED APRIL 2008
logic diagram (positive logic)
1
DIR
19
18
OE
B1
2
A1
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
I/O, output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0): Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
IK
I
I/O, output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 mA
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
JA
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Storage temperature range, T
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢃ ꢈꢉ ꢊ ꢋ
ꢌ ꢆꢍꢄꢎ ꢏꢐꢀ ꢍ ꢑꢄꢁꢀ ꢆꢒ ꢓ ꢔꢒ ꢑ
ꢕ ꢓꢍ ꢅ ꢖ ꢉꢀꢍꢄꢍ ꢒ ꢌ ꢐꢍ ꢗꢐ ꢍꢀ
SCLS527A − AUGUST 2003 − REVISED APRIL 2008
recommended operating conditions (see Note 3)
MIN
2
MAX
UNIT
V
Supply voltage
5.5
V
CC
IH
V
V
V
V
V
V
= 2 V
1.5
2.1
3.85
CC
CC
CC
CC
CC
CC
= 3 V
V
High-level input voltage
V
V
= 5.5 V
= 2 V
0.5
0.9
= 3 V
V
Low-level input voltage
IL
= 5.5 V
1.65
5.5
V
V
Input voltage
OE or DIR
A or B
0
0
V
V
I
Output voltage
V
CC
O
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
−50
−4
−8
50
4
mA
= 3.3 V 0.3 V
= 5 V 0.5 V
= 2 V
I
High-level output current
Low-level output current
OH
mA
mA
= 3.3 V 0.3 V
= 5 V 0.5 V
= 3.3 V 0.3 V
= 5 V 0.5 V
I
OL
mA
8
100
20
125
∆t/∆v Input transition rise or fall rate
ns/V
T
Operating free-air temperature
−40
°C
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
2
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
1.9
MAX
2 V
3 V
1.9
2.9
2.9
3
I
= −50 mA
OH
4.5 V
3 V
4.4
4.5
4.4
V
V
OH
OL
I
I
= −4 mA
= −8 mA
2.58
3.94
2.48
3.8
OH
4.5 V
2 V
OH
0.1
0.1
0.1
0.1
0.1
0.5
0.5
1
3 V
I
= 50 mA
OL
4.5 V
3 V
0.1
V
V
I
I
= 4 mA
= 8 mA
0.36
0.36
0.1
OL
4.5 V
5.5 V
0 V to 5.5 V
OL
A or B inputs
OE or DIR
I
I
V = 5.5 V or GND
mA
mA
I
0.1
1
V
= V or GND,
CC
O
I
†
5.5 V
0.25
2.5
40
I
I
OZ
V (OE) = V or V
IL IH
V = V
I
or GND,
or GND
or GND
I
O
= 0
5.5 V
5 V
4
mA
pF
pF
CC
CC
CC
CC
C
C
V = V
I
2.5
4
10
OE or DIR
i
A or B inputs
V = V
5 V
io
I
†
The parameter I
OZ
includes the input leakage current.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢃ ꢈꢉꢊ ꢋ
ꢌꢆ ꢍꢄ ꢎ ꢏ ꢐꢀ ꢍ ꢑ ꢄꢁ ꢀꢆ ꢒꢓ ꢔ ꢒ ꢑ
ꢕꢓ ꢍ ꢅ ꢖ ꢉꢀꢍꢄꢍ ꢒ ꢌꢐꢍ ꢗ ꢐꢍꢀ
SCLS527A − AUGUST 2003 − REVISED APRIL 2008
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
5.8
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
MIN
MAX
UNIT
ns
MIN
MAX
8.4
t
t
t
t
t
t
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
10
10
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A or B
OE
B or A
A or B
A or B
B or A
A or B
A or B
C
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
= 50 pF
L
L
L
L
L
L
5.8
8.4
8.5
13.2
13.2
12.5
12.5
11.9
11.9
16.7
16.7
15.8
15.8
15.5
15.5
15.5
15.5
13.5
13.5
19
ns
8.5
8.9
ns
OE
8.9
8.3
A or B
ns
8.3
11
ns
OE
OE
11
19
11.5
11.5
18
ns
18
switching characteristics over recommended operating free-air temperature range,
= 5 V 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
4
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
MIN
MAX
UNIT
ns
MIN
MAX
5.5
t
t
t
t
t
t
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
6.5
6.5
10
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A or B
B or A
A or B
A or B
B or A
A or B
A or B
C
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
= 50 pF
L
L
L
L
L
L
4
5.5
5.8
5.8
5.6
5.6
5.5
5.5
7.3
7.3
7
8.5
ns
OE
OE
8.5
10
7.8
9.2
9.2
8.5
8.5
12
ns
7.8
7.5
A or B
OE
ns
7.5
10.6
10.6
9.7
ns
12
11
ns
OE
7
9.7
11
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
PARAMETER
MIN
TYP
0.9
MAX
UNIT
V
V
V
V
V
Quiet output, maximum dynamic V
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
−0.9
4.3
OL
OH
3.5
1.5
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
14
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢃ ꢈꢉ ꢊ ꢋ
ꢌ ꢆꢍꢄꢎ ꢏꢐꢀ ꢍ ꢑꢄꢁꢀ ꢆꢒ ꢓ ꢔꢒ ꢑ
ꢕ ꢓꢍ ꢅ ꢖ ꢉꢀꢍꢄꢍ ꢒ ꢌ ꢐꢍ ꢗꢐ ꢍꢀ
SCLS527A − AUGUST 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
Open
PLH PHL
/t
C
C
L
t
V
CC
L
PLZ PZL
/t
(see Note A)
(see Note A)
GND
PHZ PZH
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
V
CC
50% V
CC
Timing Input
0 V
t
w
t
h
t
su
V
CC
V
CC
50% V
CC
50% V
CC
Input
50% V
CC
50% V
CC
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
50% V
CC
50% V
CC
50% V
CC
50% V
t
Input
CC
0 V
0 V
t
PZL
t
t
t
PLZ
PLH
PHL
Output
Waveform 1
V
OH
≈V
CC
In-Phase
Output
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
V
OL
+ 0.3 V
CC
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
V
OH
OH
Out-of-Phase
Output
V
OH
− 0.3 V
50% V
CC
50% V
50% V
CC
CC
V
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN74AHC245QDWRQ1
ACTIVE
ACTIVE
SOIC
DW
PW
20
20
TBD
Call TI
Call TI
SN74AHC245QPWRG4Q1
TSSOP
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AHC245QPWRQ1
ACTIVE
TSSOP
PW
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHC245-Q1 :
Catalog: SN74AHC245
•
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
Enhanced Product: SN74AHC245-EP
•
Military: SN54AHC245
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
SN74AHC257DBLE
AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, PLASTIC, SSOP-16
TI
SN74AHC257DBR
AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, PLASTIC, SSOP-16
TI
SN74AHC257DGVR
AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, PLASTIC, TVSOP-16
TI
©2020 ICPDF网 联系我们和版权申明