SN74AHC367PWRG4
更新时间：2024-09-18 15:09:02
品牌：TI
描述：AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO16, GREEN, PLASTIC, TSSOP-16
概述
规格参数
数据手册SN74AHC367PWRG4 概述
AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO16, GREEN, PLASTIC, TSSOP-16 逻辑控制器 总线驱动器/收发器
SN74AHC367PWRG4 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Obsolete | 零件包装代码： | TSSOP |
| 包装说明： | TSSOP, TSSOP16,.25 | 针数： | 16 |
| Reach Compliance Code： | unknown | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.49 | Is Samacsys： | N |
| 其他特性： | ONE FUNCTION WITH TWO BITS | 控制类型： | ENABLE LOW |
| 系列： | AHC/VHC/H/U/V | JESD-30 代码： | R-PDSO-G16 |
| JESD-609代码： | e4 | 长度： | 5 mm |
| 负载电容（CL）： | 50 pF | 逻辑集成电路类型： | BUS DRIVER |
| 最大I（ol）： | 0.008 A | 湿度敏感等级： | 1 |
| 位数： | 4 | 功能数量： | 2 |
| 端口数量： | 2 | 端子数量： | 16 |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 输出特性： | 3-STATE | 输出极性： | TRUE |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | TSSOP |
| 封装等效代码： | TSSOP16,.25 | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法： | TAPE AND REEL |
| 峰值回流温度（摄氏度）： | 260 | 电源： | 2/5.5 V |
| 传播延迟（tpd）： | 13.5 ns | 认证状态： | Not Qualified |
| 座面最大高度： | 1.2 mm | 子类别： | Bus Driver/Transceivers |
| 最大供电电压 (Vsup)： | 5.5 V | 最小供电电压 (Vsup)： | 2 V |
| 标称供电电压 (Vsup)： | 3.3 V | 表面贴装： | YES |
| 技术： | CMOS | 温度等级： | INDUSTRIAL |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式： | GULL WING |
| 端子节距： | 0.65 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 4.4 mm |
| Base Number Matches： | 1 |
SN74AHC367PWRG4 数据手册
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PDF下载SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
SN54AHC367 . . . J OR W PACKAGE
SN74AHC367 . . . D, DB, DGV, N, OR PW PACKAGE
(TOP VIEW)
Operating Range 2-V to 5.5-V V
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1OE
1A1
1Y1
1A2
1Y2
1A3
1Y3
GND
V
CC
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
1
2
3
4
5
6
7
8
16
15
14
13
2OE
2A2
2Y2
– 1000-V Charged-Device Model (C101)
12 2A1
description
11
10
9
2Y1
1A4
1Y4
The ’AHC367 devices are hex buffers and line
drivers designed for 2-V to 5.5-V V operation.
CC
These devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters. The
’AHC367 devices are organized as dual 4-line
and 2-line buffers/drivers with active-low
output-enable (1OE and 2OE) inputs. When OE is
low, the device passes noninverted data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
SN54AHC367 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
2A2
2Y2
NC
1Y1
1A2
NC
4
5
6
7
8
17
16
15 2A1
14
9 10 11 12 13
1Y2
1A3
2Y1
To ensure the high-impedance state during power
up or power down, OE should be tied to V
CC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube
SN74AHC367N
SN74AHC367N
Tube
SN74AHC367D
AHC367
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tube
SN74AHC367DR
SN74AHC367DBR
SN74AHC367PWR
SN74AHC367DGVR
SNJ54AHC367J
SNJ54AHC367W
SNJ54AHC367FK
–40°C to 85°C
SSOP – DB
TSSOP – PW
TVSOP – DGV
CDIP – J
HA367
HA367
HA367
SNJ54AHC367J
SNJ54AHC367W
SNJ54AHC367FK
–55°C to 125°C
CFP – W
Tube
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
H
L
H
X
Z
logic diagram (positive logic)
1
15
1OE
2OE
2A1
2
3
12
11
1A1
1Y1
2Y1
To Three Other Channels
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
To One Other Channel
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
IK
I
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
recommended operating conditions (see Note 3)
SN54AHC367 SN74AHC367
UNIT
MIN
MAX
MIN
MAX
V
V
Supply voltage
2
5.5
2
5.5
V
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
1.5
2.1
3.85
1.5
2.1
3.85
High-level input voltage
= 3 V
IH
= 5.5 V
= 2 V
0.5
0.9
0.5
0.9
V
IL
Low-level input voltage
= 3 V
V
= 5.5 V
1.65
5.5
1.65
5.5
V
V
Input voltage
0
0
0
0
V
V
I
Output voltage
V
V
CC
O
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
–50
–4
–8
50
4
–50
–4
–8
50
4
A
I
High-level output current
Low-level output current
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
= 2 V
OH
OL
mA
A
I
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
= 3.3 V ± 0.3 V
= 5 V ± 0.5 V
mA
8
8
100
20
125
100
20
85
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
T
–55
–40
°C
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54AHC367 SN74AHC367
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP MAX
MIN
1.9
MAX
MIN
1.9
MAX
2 V
3 V
1.9
2.9
2
3
I
= –50
A
2.9
2.9
OH
4.5 V
3 V
4.4
4.5
4.4
4.4
V
V
V
OH
OL
2.58
3.94
2.48
3.8
2.48
3.8
I
I
= –4 mA
OH
4.5 V
2 V
= –8 mA
OH
0.1
0.1
0.1
0.1
0.1
0.5
0.5
±1*
0.1
0.1
I
= 50
A
3 V
OL
4.5 V
3 V
0.1
0.1
V
0.36
0.36
±0.1
0.44
0.44
±1
I
I
= 4 mA
= 8 mA
OL
4.5 V
0 V to 5.5 V
OL
I
I
I
V = 5.5 V or GND
A
A
I
I
V = V
OE = V
or GND, V = V
O
or GND,
CC
I
CC
5.5 V
±0.25
±2.5
±2.5
OZ
IH
CC
CC
V = V
or GND,
or GND
I
O
= 0
5.5 V
5 V
4
40
40
10
A
pF
pF
CC
I
C
C
V = V
3
10
i
I
V
= V or GND
CC
5 V
5.1
o
O
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V
= 0 V.
CC
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
SN54AHC367 SN74AHC367
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
ns
MIN
MAX
8.3*
MIN
1*
MAX
10*
MIN
1
MAX
10
t
t
t
t
t
t
t
t
t
t
t
t
4.7*
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
C
C
C
= 15 pF
= 15 pF
= 15 pF
L
L
L
4.7*
8..3*
1*
10*
1
10
5.1* 10.5*
5.1* 10.5*
4* 10.5*
1* 12.5*
1* 12.5*
1* 12.5*
1* 12.5*
1
12.5
12.5
12.5
12.5
13.5
13.5
16
ns
OE
OE
A
1
1
ns
4.9* 10.5*
1
6.1
6.2
6.4
6.8
6.2
7.3
11.8
11.8
14
1
1
1
1
1
1
13.5
13.5
16
1
Y
Y
Y
C
C
C
= 50 pF
= 50 pF
= 50 pF
ns
ns
ns
L
L
L
1
1
OE
OE
14
16
1
16
13.6
13.6
15.5
15.5
1
15.5
15.5
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
3.4*
3.6*
3.6*
3.8*
2.6*
2.6*
4.3
SN54AHC367 SN74AHC367
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
PARAMETER
UNIT
ns
MIN
MAX
5.9*
5.9*
7.2*
7.2*
7.2*
7.2*
7.9
MIN
1*
1*
1*
1*
0*
0*
1
MAX
7*
MIN
1
MAX
7
t
t
t
t
t
t
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
C
C
C
= 15 pF
= 15 pF
= 15 pF
L
L
L
7*
1
7
8.5*
8.5*
8.5*
8.5*
9
1
8.5
8.5
8.5
8.5
9
ns
OE
OE
A
1
0
ns
0
1
Y
Y
Y
C
C
C
= 50 pF
= 50 pF
= 50 pF
ns
ns
ns
L
L
L
4.5
7.9
1
9
1
9
4.6
9.2
1
10.5
10.5
10.5
10.5
1
10.5
10.5
10.5
10.5
OE
OE
4.9
9.2
1
1
3.4
9.2
0
0
4.5
9.2
0
0
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74AHC367
PARAMETER
UNIT
MIN
TYP
0.9
MAX
V
V
V
V
V
Quiet output, maximum dynamic V
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
–0.8
4.2
OL
OH
3.5
1.5
NOTE 4: Characteristics are for surface-mount packages only.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
Outputs enabled
No load,
f = 1 MHz
22.4
pF
pd
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
PLH PHL
Open
C
C
L
t
/t
V
CC
L
PLZ PZL
(see Note A)
(see Note A)
/t
PHZ PZH
GND
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
V
CC
50% V
CC
Timing Input
0 V
t
w
t
h
t
su
V
CC
V
CC
50% V
50% V
CC
Input
Input
CC
50% V
50% V
CC
Data Input
CC
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
CC
V
CC
Output
Control
50% V
50% V
50% V
50% V
CC
CC
CC
CC
0 V
0 V
t
t
PLZ
t
t
t
PZL
PLH
PHL
Output
Waveform 1
V
≈ V
OH
CC
In-Phase
Output
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
CC
V
OL
+ 0.3 V
V
OL
OL
t
t
t
PZH
PHZ
PHL
PLH
Output
Waveform 2
S1 at GND
V
V
OH
OH
Out-of-Phase
Output
V
OH
– 0.3 V
50% V
50% V
50% V
CC
CC
CC
V
≈ 0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
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of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
SN74AHC367D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AHC367DE4
SN74AHC367DG4
SN74AHC367DR
SOIC
SOIC
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AHC367DRE4
SN74AHC367DRG4
SN74AHC367N
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AHC367NE4
SN74AHC367PWR
SN74AHC367PWRE4
SN74AHC367PWRG4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHC367DR
SOIC
D
16
16
2500
2000
330.0
330.0
16.4
12.4
6.5
7.0
10.3
5.6
2.1
1.6
8.0
8.0
16.0
12.0
Q1
Q1
SN74AHC367PWR
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHC367DR
SOIC
D
16
16
2500
2000
333.2
346.0
345.9
346.0
28.6
29.0
SN74AHC367PWR
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
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Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
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responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
SN74AHC367PWRG4 CAD模型
引脚图
封装焊盘图
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