SN74AHCT08MDREP [TI]

具有 TTL 兼容型 CMOS 输入的增强型产品 4 通道、2 输入、4.5V 至 5.5V 与门 | D | 14 | -55 to 125;
SN74AHCT08MDREP
型号: SN74AHCT08MDREP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 TTL 兼容型 CMOS 输入的增强型产品 4 通道、2 输入、4.5V 至 5.5V 与门 | D | 14 | -55 to 125

栅 光电二极管 逻辑集成电路 触发器 栅极
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SN74AHCT08-EP  
QUADRUPLE 2-INPUT POSITIVE-AND GATE  
SCLS490 – JUNE 2003  
D OR PW PACKAGE  
(TOP VIEW)  
Controlled Baseline  
– One Assembly/Test Site, One Fabrication  
Site  
1A  
1B  
V
CC  
1
2
3
4
5
6
7
14  
13  
12  
11  
Extended Temperature Performance of  
–55°C to 125°C  
4B  
4A  
4Y  
1Y  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
2A  
2B  
10 3B  
Enhanced Product-Change Notification  
9
8
2Y  
3A  
3Y  
Qualification Pedigree  
GND  
EPIC (Enhanced-Performance Implanted  
CMOS) Process  
Inputs Are TTL-Voltage Compatible  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetalliclife,andmoldcompoundlife.Suchqualificationtesting  
should not be viewed as justifying use of this component beyond  
specified performance and environmental limits.  
description/ordering information  
The SN74AHCT08 is a quadruple 2-input positive-AND gate. This device performs the Boolean function  
A B or Y B in positive logic.  
Y
A
ORDERING INFORMATION  
ORDERABLE  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PART NUMBER  
SN74AHCT08MDREP  
SN74AHCT08MPWREP  
SOIC – D  
Tape and reel  
Tape and reel  
AHCT08MEP  
AHT08EP  
–55°C to 125°C  
TSSOP – PW  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
FUNCTION TABLE  
(each gate)  
INPUTS  
OUTPUT  
Y
A
B
H
X
L
H
L
H
L
L
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC is a trademark of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHCT08-EP  
QUADRUPLE 2-INPUT POSITIVE-AND GATE  
SCLS490 JUNE 2003  
logic symbol  
1
1A  
2
&
3
6
1Y  
2Y  
3Y  
4Y  
1B  
4
2A  
5
2B  
9
3A  
10  
3B  
12  
4A  
13  
4B  
8
11  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
logic diagram, each gate (positive logic)  
A
B
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
IK  
I
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
JA  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
MIN  
MAX  
UNIT  
V
V
V
V
V
V
Supply voltage  
4.5  
2
5.5  
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
V
0.8  
5.5  
V
0
0
V
I
Output voltage  
V
V
O
CC  
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
8  
mA  
mA  
ns/V  
°C  
OH  
OL  
I
8
t/v  
20  
T
55  
125  
A
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHCT08-EP  
QUADRUPLE 2-INPUT POSITIVE-AND GATE  
SCLS490 JUNE 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
TYP  
PARAMETER  
TEST CONDITIONS  
V
MIN  
MAX  
UNIT  
V
CC  
MIN  
4.4  
MAX  
I
I
I
I
= 50  
A
4.5  
4.4  
3.8  
OH  
OH  
OL  
OL  
V
4.5 V  
4.5 V  
OH  
OL  
= 8 mA  
= 50  
= 8 mA  
3.94  
A
0.1  
0.36  
±0.1  
2
0.1  
0.44  
±1  
V
V
I
I
V = 5.5 V or GND  
0 V to 5.5 V  
5.5 V  
A
A
I
I
V = V  
or GND,  
I = 0  
O
20  
CC  
I
CC  
One input at 3.4 V, Other inputs at V  
or GND  
5.5 V  
1.35  
10  
1.5  
mA  
pF  
I  
CC  
CC  
C
V = V or GND  
I CC  
5 V  
4
i
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or V  
CC  
.
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
5
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
MIN  
MAX  
6.9  
t
t
t
t
1
1
1
1
8
8
9
9
PLH  
PHL  
PLH  
PHL  
A or B  
A or B  
Y
Y
C
C
= 15 pF  
= 50 pF  
L
L
5
6.9  
5.5  
5.5  
7.9  
ns  
7.9  
noise characteristics, V  
= 5 V, C = 50 pF, T = 25°C (see Note 4)  
CC  
L
A
PARAMETER  
MIN  
TYP  
0.4  
MAX  
0.8  
UNIT  
V
V
V
V
V
Quiet output, maximum dynamic V  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
Quiet output, minimum dynamic V  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
0.4  
0.8  
OL  
4.4  
2
OH  
0.8  
NOTE 4: Characteristics are for surface-mount packages only.  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
Power dissipation capacitance  
TEST CONDITIONS  
No load, f = 1 MHz  
TYP  
UNIT  
C
18  
pF  
pd  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74AHCT08-EP  
QUADRUPLE 2-INPUT POSITIVE-AND GATE  
SCLS490 JUNE 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
3 V  
1.5 V  
Timing Input  
0 V  
t
w
t
h
3 V  
t
su  
3 V  
0 V  
1.5 V  
1.5 V  
Input  
Input  
1.5 V  
1.5 V  
Data Input  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
t
t
t
t
t
PZL  
PLZ  
PLH  
PHL  
Output  
Waveform 1  
V
V  
OH  
CC  
In-Phase  
Output  
50% V  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
(see Note B)  
CC  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
Out-of-Phase  
Output  
0.3 V  
OH  
50% V  
50% V  
CC  
CC  
CC  
V
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
SN74AHCT08MDREP  
SN74AHCT08MPWREP  
V62/03654-01XE  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/03654-01YE  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74AHCT08-EP :  
Catalog: SN74AHCT08  
Military: SN54AHCT08  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74AHCT08MDREP  
SOIC  
D
14  
14  
2500  
2000  
330.0  
330.0  
16.4  
12.4  
6.5  
6.9  
9.0  
5.6  
2.1  
1.6  
8.0  
8.0  
16.0  
12.0  
Q1  
Q1  
SN74AHCT08MPWREP TSSOP  
PW  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74AHCT08MDREP  
SN74AHCT08MPWREP  
SOIC  
D
14  
14  
2500  
2000  
333.2  
367.0  
345.9  
367.0  
28.6  
35.0  
TSSOP  
PW  
Pack Materials-Page 2  
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IC-SM-4:1 MUX SWITCH

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