SN74AHCT374DWE4 [TI]

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS; 八路边沿触发D型触发器具有​​三态输出
SN74AHCT374DWE4
型号: SN74AHCT374DWE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
八路边沿触发D型触发器具有​​三态输出

触发器 输出元件
文件: 总19页 (文件大小:703K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54AHCT374, SN74AHCT374  
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS241L – OCTOBER 1995 – REVISED JULY 2003  
Inputs Are TTL-Voltage Compatible  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
– 1000-V Charged-Device Model (C101)  
SN54AHCT374 . . . J OR W PACKAGE  
SN74AHCT374 . . . DB, DGV, DW, N, NS, OR PW PACKAGE  
(TOP VIEW)  
SN54AHCT374 . . . FK PACKAGE  
(TOP VIEW)  
OE  
1Q  
1D  
2D  
2Q  
3Q  
3D  
4D  
4Q  
V
CC  
8Q  
8D  
1
2
3
4
5
6
7
8
9
20  
19  
18  
3
2
1
20 19  
18  
8D  
7D  
7Q  
2D  
2Q  
3Q  
3D  
4D  
4
5
6
7
8
17  
16  
17 7D  
16 7Q  
15 6Q  
14 6D  
13 5D  
12 5Q  
11 CLK  
15 6Q  
14  
9 10 11 12 13  
6D  
GND 10  
description/ordering information  
The ’AHCT374 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed  
specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable  
for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.  
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels of the data (D) inputs.  
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high  
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive  
the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus  
lines without interface or pullup components.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP – N  
Tube  
SN74AHCT374N  
SN74AHCT374N  
Tube  
SN74AHCT374DW  
SN74AHCT374DWR  
SN74AHCT374NSR  
SN74AHCT374DBR  
SN74AHCT374PW  
SN74AHCT374PWR  
SOIC – DW  
AHCT374  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
SOP – NS  
AHCT374  
HB374  
–40°C to 85°C  
SSOP – DB  
TSSOP – PW  
HB374  
Tape and reel  
Tape and reel  
Tube  
TVSOP – DGV  
CDIP – J  
SN74AHCT374DGVR HB374  
SNJ54AHCT374J  
SNJ54AHCT374W  
SNJ54AHCT374FK  
SNJ54AHCT374J  
–55°C to 125°C  
CFP – W  
Tube  
SNJ54AHCT374W  
SNJ54AHCT374FK  
LCCC – FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHCT374, SN74AHCT374  
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS241L OCTOBER 1995 REVISED JULY 2003  
description/ordering information (continued)  
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while  
the outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
FUNCTION TABLE  
(each flip-flop)  
INPUTS  
OUTPUT  
Q
OE  
L
CLK  
D
H
L
H
L
L
L
H or L  
X
X
X
Q
0
H
Z
logic diagram (positive logic)  
1
OE  
11  
CLK  
C1  
1D  
2
1Q  
3
1D  
To Seven Other Channels  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
IK  
I
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA  
Continuous current through V  
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
O
O
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA  
CC  
JA  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHCT374, SN74AHCT374  
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS241L OCTOBER 1995 REVISED JULY 2003  
recommended operating conditions (see Note 3)  
SN54AHCT374 SN74AHCT374  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
5.5  
0.8  
5.5  
V
0
0
0
0
V
I
Output voltage  
V
CC  
V
CC  
V
O
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Operating free-air temperature  
8  
8  
mA  
mA  
ns/V  
°C  
OH  
OL  
I
8
8
20  
85  
t/v  
20  
T
55  
125  
40  
A
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
TYP MAX  
4.5  
SN54AHCT374 SN74AHCT374  
A
PARAMETER  
TEST CONDITIONS  
= 50  
V
UNIT  
V
CC  
MIN  
MIN  
4.4  
MAX  
MIN  
4.4  
MAX  
I
I
I
I
A
4.4  
OH  
OH  
OL  
OL  
V
4.5 V  
4.5 V  
OH  
OL  
= 8 mA  
= 50  
= 8 mA  
3.94  
3.8  
3.8  
A
0.1  
0.36  
±0.1  
±0.25  
4
0.1  
0.44  
±1*  
0.1  
0.44  
±1  
V
V
I
I
I
V = 5.5 V or GND  
0 V to 5.5 V  
5.5 V  
A
A
A
I
I
V
= V  
or GND, V = V or V  
±2.5  
40  
±2.5  
40  
OZ  
CC  
O
CC  
or GND,  
I
IH  
IL  
V = V  
I
O
= 0  
5.5 V  
I
CC  
One input at 3.4 V,  
Other inputs at V  
5.5 V  
1.35  
1.5  
1.5  
10  
mA  
I  
CC  
or GND  
CC  
or GND  
C
C
V = V  
5 V  
5 V  
4
9
10  
pF  
pF  
i
I
CC  
= V or GND  
CC  
V
o
O
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V  
CC  
= 0 V.  
This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or V  
CC  
.
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V ± 0.5 V  
CC  
T
= 25°C  
SN54AHCT374 SN74AHCT374  
A
UNIT  
MIN  
6.5  
2.5  
2.5  
MAX  
MIN  
6.5  
2.5  
2.5  
MAX  
MIN  
6.5  
2.5  
2.5  
MAX  
t
w
t
su  
t
h
Pulse duration, CLK high or low  
Setup time, data before CLK↑  
Hold time, data after CLK↑  
ns  
ns  
ns  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHCT374, SN74AHCT374  
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS241L OCTOBER 1995 REVISED JULY 2003  
switching characteristics over recommended free-air temperature operating range,  
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
CC  
T = 25°C  
A
SN54AHCT374 SN74AHCT374  
FROM  
(INPUT)  
TO  
LOAD  
PARAMETER  
UNIT  
MHz  
ns  
(OUTPUT) CAPACITANCE  
MIN  
TYP  
MAX  
MIN  
80**  
75  
MAX  
MIN  
80  
75  
1
MAX  
C
C
= 15 pF  
= 50 pF  
90** 140**  
L
L
f
max  
85  
130  
5.6**  
5.6**  
t
t
t
t
t
t
9.4**  
9.4**  
1** 10.5**  
1** 10.5**  
1** 11.5**  
1** 11.5**  
10.5  
10.5  
11.5  
11.5  
11  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
CLK  
Q
Q
Q
Q
Q
Q
C
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 50 pF  
= 50 pF  
L
L
L
L
L
1
6.5** 10.2**  
6.5** 10.2**  
6.2** 10.2**  
6.2** 10.2**  
1
ns  
OE  
OE  
1
1**  
1**  
11**  
11**  
1
ns  
1
11  
t
t
t
t
t
t
t
6.4  
6.4  
7.3  
7.3  
7
10.4  
10.4  
11.2  
11.2  
11.2  
11.2  
1***  
1
1
1
1
1
1
11.5  
11.5  
12.5  
12.5  
12  
1
1
1
1
1
1
11.5  
11.5  
12.5  
12.5  
12  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
sk(o)  
CLK  
OE  
ns  
ns  
C
C
= 50 pF  
= 50 pF  
ns  
ns  
OE  
L
L
7
12  
12  
1
** On products compliant to MIL-PRF-38535, this parameter is not production tested.  
*** On products compliant to MIL-PRF-38535, this parameter does not apply.  
noise characteristics, V  
= 5 V, C = 50 pF, T = 25°C (see Note 4)  
CC  
L
A
SN74AHCT374  
PARAMETER  
UNIT  
MIN  
TYP  
0.8  
MAX  
V
V
V
V
V
Quiet output, maximum dynamic V  
1.2  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
Quiet output, minimum dynamic V  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
0.8  
1.2  
OL  
3.8  
2
OH  
0.8  
NOTE 4: Characteristics are for surface-mount packages only.  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
Power dissipation capacitance  
TEST CONDITIONS  
No load, f = 1 MHz  
TYP  
UNIT  
C
27  
pF  
pd  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHCT374, SN74AHCT374  
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS241L OCTOBER 1995 REVISED JULY 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
3 V  
1.5 V  
Timing Input  
0 V  
t
w
t
h
3 V  
t
su  
3 V  
0 V  
1.5 V  
1.5 V  
Input  
Input  
1.5 V  
1.5 V  
Data Input  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
t
t
t
t
t
PZL  
PLZ  
PLH  
PHL  
Output  
Waveform 1  
V
V  
OH  
CC  
In-Phase  
Output  
50% V  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
(see Note B)  
CC  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
Out-of-Phase  
Output  
0.3 V  
OH  
50% V  
50% V  
CC  
CC  
CC  
V
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
E. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CFP  
Drawing  
5962-9686501Q2A  
5962-9686501QRA  
5962-9686501QSA  
SN74AHCT374DBLE  
SN74AHCT374DBR  
ACTIVE  
ACTIVE  
FK  
J
20  
20  
20  
20  
20  
1
1
1
TBD  
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
ACTIVE  
W
OBSOLETE  
ACTIVE  
SSOP  
SSOP  
DB  
DB  
Call TI  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHCT374DBRE4  
SN74AHCT374DBRG4  
SN74AHCT374DGVR  
SN74AHCT374DGVRE4  
SN74AHCT374DGVRG4  
SN74AHCT374DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
TVSOP  
TVSOP  
TVSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DB  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGV  
DGV  
DGV  
DW  
DW  
DW  
DW  
DW  
DW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHCT374DWE4  
SN74AHCT374DWG4  
SN74AHCT374DWR  
SN74AHCT374DWRE4  
SN74AHCT374DWRG4  
SN74AHCT374N  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74AHCT374NE4  
PDIP  
N
20  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74AHCT374NSR  
SN74AHCT374NSRE4  
SN74AHCT374NSRG4  
SN74AHCT374PW  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHCT374PWE4  
SN74AHCT374PWG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHCT374PWLE  
SN74AHCT374PWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
ACTIVE  
TSSOP  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHCT374PWRE4  
ACTIVE  
TSSOP  
PW  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74AHCT374PWRG4  
ACTIVE  
TSSOP  
PW  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54AHCT374FK  
SNJ54AHCT374J  
SNJ54AHCT374W  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
20  
20  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
330  
(mm)  
16  
SN74AHCT374DBR  
SN74AHCT374DGVR  
SN74AHCT374DWR  
SN74AHCT374NSR  
SN74AHCT374PWR  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
8.2  
7.0  
7.5  
5.6  
2.5  
1.6  
2.7  
2.5  
1.6  
12  
8
16  
12  
24  
24  
16  
Q1  
Q1  
Q1  
Q1  
Q1  
12  
24  
10.8  
8.2  
13.0  
13.0  
7.1  
12  
12  
8
24  
PW  
16  
6.95  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74AHCT374DBR  
SN74AHCT374DGVR  
SN74AHCT374DWR  
SN74AHCT374NSR  
SN74AHCT374PWR  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
SITE 41  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
29.0  
41.0  
41.0  
33.0  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties  
may be subject to additional restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

相关型号:

SN74AHCT374DWG4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374DWR

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374DWRE4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374DWRG4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374N

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374NE4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374NSR

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374NSRE4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374NSRG4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374PW

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374PWE4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI

SN74AHCT374PWG4

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
TI