SN74ALVCH373DGV [TI]

OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS; 八路透明D类锁存器与三态输出
SN74ALVCH373DGV
型号: SN74ALVCH373DGV
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS
八路透明D类锁存器与三态输出

锁存器 输出元件
文件: 总12页 (文件大小:213K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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ꢊ ꢇꢋꢄꢅ ꢋ ꢌꢄꢁꢀ ꢍꢄꢌꢎ ꢁꢋ ꢏꢐꢋ ꢑꢍ ꢎ ꢅꢄꢋꢇ ꢈ  
ꢒ ꢓꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊ ꢔꢋ ꢍꢔ ꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
DGV, DW, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
Operates From 1.65 V to 3.6 V  
Max t of 3.3 ns at 3.3 V  
pd  
24-mA Output Drive at 3.3 V  
OE  
1Q  
1D  
2D  
2Q  
3Q  
3D  
4D  
4Q  
V
CC  
1
2
3
4
5
6
7
8
9
20  
19 8Q  
18 8D  
17 7D  
16 7Q  
15 6Q  
14 6D  
13 5D  
12 5Q  
11 LE  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
D
D
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
GND 10  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This octal transparent D-type latch is designed for 1.65-V to 3.6-V V  
operation.  
CC  
The SN74ALVCH373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus  
drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs.  
When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.  
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high  
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive  
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus  
lines without interface or pullup components.  
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered  
while the outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors  
with the bus-hold circuitry is not recommended.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube  
SN74ALVCH373DW  
SN74ALVCH373DWR  
SN74ALVCH373PWR  
SN74ALVCH373DGVR  
SN74ALVCH373GQNR  
SN74ALVCH373ZQNR  
SOIC − DW  
ALVCH373  
Tape and reel  
Tape and reel  
Tape and reel  
TSSOP − PW  
TVSOP − DGV  
VB373  
VB373  
−40°C to 85°C  
VFBGA − GQN  
Tape and reel  
VB373  
VFBGA − ZQN (Pb-free)  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢋꢠ  
Copyright 2003, Texas Instruments Incorporated  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
ꢞꢠ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅꢆꢇ ꢈ ꢉ ꢂꢉ  
ꢊꢇ ꢋꢄ ꢅ ꢋ ꢌ ꢄꢁ ꢀꢍꢄꢌ ꢎꢁ ꢋ ꢏꢐꢋ ꢑ ꢍꢎ ꢅꢄꢋꢇ ꢈ  
ꢒꢓ ꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊꢔꢋ ꢍ ꢔꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
GQN OR ZQN PACKAGE  
(TOP VIEW)  
terminal assignments  
1
2
3
4
1
2
3
4
A
B
C
D
E
1Q  
2D  
OE  
7D  
2Q  
5D  
4Q  
V
8Q  
8D  
7Q  
6D  
5Q  
A
B
C
D
E
CC  
1D  
6Q  
3D  
LE  
3Q  
4D  
GND  
FUNCTION TABLE  
(each latch)  
INPUTS  
OUTPUT  
Q
OE  
L
LE  
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
logic diagram (positive logic)  
1
OE  
11  
LE  
C1  
1D  
2
1Q  
3
1D  
To Seven Other Channels  
Pin numbers shown are for the DGV, DW, and PW packages.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢒ ꢓꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊ ꢔꢋ ꢍꢔ ꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
I
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
OK  
O
Continuous output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Continuous current through V  
O
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
CC  
Package thermal impedance, θ (see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. This value is limited to 4.6 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 4)  
MIN  
1.65  
MAX  
UNIT  
V
Supply voltage  
3.6  
V
CC  
IH  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
= 1.65 V to 1.95 V  
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
0.65 × V  
1.7  
CC  
V
High-level input voltage  
V
V
2
0.35 × V  
0.7  
CC  
V
IL  
Low-level input voltage  
0.8  
V
V
Input voltage  
0
0
V
V
V
V
I
CC  
Output voltage  
O
CC  
−4  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.65 V  
= 2.3 V  
= 2.7 V  
= 3 V  
−12  
−12  
−24  
4
I
High-level output current  
Low-level output current  
mA  
mA  
OH  
OL  
= 1.65 V  
= 2.3 V  
= 2.7 V  
= 3 V  
12  
12  
24  
5
I
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
T
A
−40  
85  
°C  
NOTE 4: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
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ꢒꢓ ꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊꢔꢋ ꢍ ꢔꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
−0.2  
MAX  
UNIT  
V
CC  
I
I
I
= −100 µA  
= −4 mA  
= −6 mA  
1.65 V to 3.6 V  
1.65 V  
2.3 V  
V
OH  
OH  
OH  
CC  
1.2  
2
2.3 V  
1.7  
2.2  
2.4  
2
V
OH  
V
2.7 V  
I
= −12 mA  
OH  
3 V  
I
I
I
I
= −24 mA  
= 100 µA  
= 4 mA  
3 V  
OH  
OL  
OL  
OL  
1.65 V to 3.6 V  
1.65 V  
2.3 V  
0.2  
0.45  
0.4  
0.7  
0.4  
0.55  
5
= 6 mA  
V
OL  
V
2.3 V  
I
= 12 mA  
= 24 mA  
OL  
OL  
2.7 V  
I
3 V  
I
I
V = V  
or GND  
3.6 V  
µA  
I
CC  
V = 0.58 V  
1.65 V  
1.65 V  
2.3 V  
25  
−25  
45  
I
V = 1.07 V  
I
V = 0.7 V  
I
V = 1.7 V  
I
2.3 V  
−45  
75  
I
µA  
I(hold)  
V = 0.8 V  
I
3 V  
V = 2 V  
I
3 V  
−75  
V = 0 to 3.6 V  
3.6 V  
500  
10  
I
I
I
V = V  
O CC  
or GND  
or GND,  
3.6 V  
µA  
µA  
µA  
OZ  
V = V  
I CC  
I
O
= 0  
3.6 V  
20  
CC  
I  
CC  
One input at V  
CC  
− 0.6 V,  
Other inputs at V  
CC  
or GND  
3 V to 3.6 V  
750  
Control inputs  
Data inputs  
Outputs  
4.5  
5
C
V = V  
CC  
or GND  
3.3 V  
3.3 V  
pF  
pF  
i
I
C
V
= V  
or GND  
= 3.3 V, T = 25°C.  
7.5  
o
O CC  
All typical values are at V  
CC  
A
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1)  
V
= 2.5 V  
V
= 3.3 V  
CC  
0.2 V  
CC  
0.3 V  
V
= 1.8 V  
MAX  
V
= 2.7 V  
MAX  
CC  
CC  
UNIT  
MIN  
3.8  
1.3  
0.5  
MIN MAX  
MIN  
3.3  
0.5  
1.7  
MIN MAX  
t
w
t
su  
t
h
Pulse duration, LE high  
Setup time, data before LE↓  
Hold time, data after LE↓  
3.3  
0.5  
1.3  
3.3  
0.5  
1.2  
ns  
ns  
ns  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇꢈ ꢉꢂ ꢉ  
ꢊ ꢇꢋꢄꢅ ꢋ ꢌꢄꢁꢀ ꢍꢄꢌꢎ ꢁꢋ ꢏꢐꢋ ꢑꢍꢎ ꢅꢄꢋꢇ ꢈ  
ꢒ ꢓꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊ ꢔꢋ ꢍꢔ ꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (see Figure 1)  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
CC  
0.15 V  
CC  
0.2 V  
CC  
0.3 V  
V
= 2.7 V  
CC  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
6.3  
6.1  
8.3  
7
MIN  
MAX  
4
MIN  
MAX  
4
MIN  
MAX  
3.6  
D
1.7  
2
1
1
1
1
Q
t
pd  
ns  
LE  
OE  
OE  
3.8  
5.4  
4.4  
3.7  
5.4  
4.4  
3.3  
t
t
3.4  
1.6  
1.9  
1
1.6  
1
4.8  
ns  
ns  
Q
Q
en  
4.4  
dis  
operating characteristics, T = 25°C  
A
V
= 1.8 V  
CC  
TYP  
V
= 2.5 V  
CC  
TYP  
V = 3.3 V  
CC  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
TYP  
Outputs enabled  
Outputs disabled  
31  
7
33  
7
37  
9
Power dissipation capacitance  
per latch  
C = 0,  
L
f = 10 MHz  
C
pF  
pd  
5
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ꢀ ꢁꢂ ꢃꢄ ꢅꢆꢇ ꢈ ꢉ ꢂꢉ  
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ꢒꢓ ꢋ ꢈ ꢉ ꢐꢀꢋꢄꢋ ꢎ ꢊꢔꢋ ꢍ ꢔꢋꢀ  
SCES116G − JULY 1997 − REVISED AUGUST 2003  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
Open  
S1  
R
L
From Output  
Under Test  
TEST  
S1  
GND  
t
Open  
pd  
/t  
/t  
C
t
t
V
L
PLZ PZL  
LOAD  
GND  
R
L
(see Note A)  
PHZ PZH  
LOAD CIRCUIT  
INPUT  
V
CC  
V
M
V
C
R
L
V
LOAD  
L
V
I
t /t  
r f  
1.8 V 0.15 V  
2.5 0.2 V  
2.7 V  
V
V
V
/2  
/2  
2 × V  
2 × V  
6 V  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
30 pF  
30 pF  
50 pF  
50 pF  
CC  
CC  
CC  
V
CC  
0.15 V  
0.3 V  
0.3 V  
CC  
CC  
2.7 V  
2.7 V  
1.5 V  
1.5 V  
3.3 V 0.3 V  
6 V  
t
w
V
I
V
I
V
M
V
M
Input  
Timing  
Input  
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
t
t
h
su  
V
I
Output  
Control  
(low-level  
enabling)  
Data  
Input  
V
I
V
V
M
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
t
t
PZL  
PLZ  
+ V  
Output  
Waveform 1  
V
V
/2  
LOAD  
V
I
V
M
Input  
V
M
V
M
S1 at V  
(see Note B)  
V
OL  
LOAD  
0 V  
OL  
t
t
PZH  
PHZ  
t
t
PHL  
PLH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
V
OH  
− V  
V
M
Output  
V
M
V
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A.  
C
includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
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MECHANICAL DATA  
MPBG133C – APRIL 2000 – REVISED AUGUST 2002  
GQN (R-PBGA-N20)  
PLASTIC BALL GRID ARRAY  
1,95 TYP  
3,10  
2,90  
0,65  
0,325  
E
D
C
B
A
4,10  
3,90  
2,60  
1
2
3
4
A1 Corner  
Bottom View  
1,00 MAX  
0,08  
Seating Plane  
0,25  
0,15  
0,45  
20×  
0,35  
M
0,05  
4200704/D 07/2002  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. MicroStar Juniort configuration  
D. Falls within JEDEC MO-225 variation BC.  
E. This package is tin-lead (SnPb). Refer to the 20 ZQN package (drawing 4204492) for lead-free.  
MicroStar Junior is a trademark of Texas Instruments.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPBG297 – JULY 2002  
ZQN (R-PBGA-N20)  
PLASTIC BALL GRID ARRAY  
1,95  
0,65  
3,10  
2,90  
0,325  
E
D
C
B
A
4,10  
3,90  
2,60  
1
2
3
4
Bottom View  
A1 Corner  
1,00 Max  
0,08  
Seating Plane  
0,25  
0,15  
0,45  
0,35  
20×  
0,05  
M
4204492/A 06/2002  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. MicroStar Junior configuration.  
D. Fall within JEDEC MO-225 variation BC.  
E. This package is lead-free. Refer to the 20 GQN package (drawing 4200704) for tin-lead )SnPb).  
MicroStar Junior is a trademark of Texas Instruments.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSOI003E – JANUARY 1995 – REVISED SEPTEMBER 2001  
DW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
16 PINS SHOWN  
0.020 (0,51)  
0.014 (0,35)  
9
0.050 (1,27)  
16  
0.010 (0,25)  
0.419 (10,65)  
0.400 (10,15)  
0.010 (0,25) NOM  
0.299 (7,59)  
0.291 (7,39)  
Gage Plane  
0.010 (0,25)  
1
8
0°– 8°  
0.050 (1,27)  
0.016 (0,40)  
A
Seating Plane  
0.012 (0,30)  
0.004 (0,10)  
0.004 (0,10)  
0.104 (2,65) MAX  
PINS **  
16  
18  
20  
24  
0.610  
28  
DIM  
0.410  
0.462  
0.510  
0.710  
(18,03)  
A MAX  
(10,41) (11,73) (12,95) (15,49)  
0.400  
0.453  
0.500  
0.600  
0.700  
(17,78)  
A MIN  
(10,16) (11,51) (12,70) (15,24)  
4040000/E 08/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MS-013  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
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and conditions of sale supplied at the time of order acknowledgment.  
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accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
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