SN74AUC17RGYRG4 [TI]
HEX SCHMITT-TRIGGER BUFFER; HEX施密特触发缓冲器
| 型号： | SN74AUC17RGYRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX SCHMITT-TRIGGER BUFFER |
| 文件： | 总8页 (文件大小：175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A–OCTOBER 2003–REVISED MARCH 2005
FEATURES
RGY PACKAGE
(TOP VIEW)
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
•
Ioff Supports Partial-Power-Down Mode
Operation
1
14
1Y
2A
2Y
3A
3Y
13 6A
2
3
4
5
6
•
•
•
•
•
Sub-1-V Operable
12
11
10
9
6Y
5A
5Y
4A
Max tpd of 1.8 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
7
8
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This hex Schmitt-trigger buffer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to
1.95-V VCC operation.
The SN74AUC17 contains six independent buffers and performs the Boolean function Y = A. The device
functions as six independent buffers, but because of Schmitt action, it may have different input threshold levels
for positive-going (VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
QFN – RGY
Tape and reel
SN74AUC17RGYR
MS17
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
H
L
LOGIC DIAGRAM, EACH BUFFER (POSITIVE LOGIC)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A–OCTOBER 2003–REVISED MARCH 2005
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Output voltage range(2)
3.6
3.6
3.6
V
VO
VO
IIK
V
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±20
±100
47
mA
mA
mA
mA
°C/W
°C
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
Package thermal impedance(3)
Storage temperature range
θJA
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions(1)
MIN
0.8
0
MAX UNIT
VCC
VI
Supply voltage
Input voltage
Output voltage
2.7
3.6
VCC
–0.7
–3
–5
–8
–9
0.7
3
V
V
V
VO
0
VCC = 0.8 V
VCC = 1.1 V
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
VCC = 0.8 V
VCC = 1.1 V
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
IOH
High-level output current
mA
IOL
Low-level output current
5
mA
°C
8
9
TA
Operating free-air temperature
–40
85
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A–OCTOBER 2003–REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN TYP(1) MAX UNIT
0.8 V
1.1 V
0.5
0.51
0.65
0.79
1.11
0.86
1
VT+
Positive-going input
threshold voltage
1.4 V
V
V
V
1.65 V
2.3 V
1.16
1.56
0.8 V
0.3
1.1 V
0.22
0.3
0.53
0.58
0.62
0.87
VT–
Negative-going input
threshold voltage
1.4 V
1.65 V
2.3 V
0.39
0.58
0.8 V
0.21
1.1 V
0.25
0.31
0.38
0.5
∆VT
Hysteresis
1.4 V
(VT+ – VT–
)
1.65 V
2.3 V
0.37
0.62
0.77
0.48
IOH = –100 µA
IOH = –0.7 mA
IOH = –3 mA
IOH = –5 mA
IOH = –8 mA
IOH = –9 mA
IOL = 100 µA
IOL = 0.7 mA
IOL = 3 mA
0.8 V to 2.7 V
0.8 V
VCC – 0.1
0.55
0.25
1.1 V
0.8
1
VOH
V
V
1.4 V
1.65 V
2.3 V
1.2
1.8
0.8 V to 2.7 V
0.8 V
0.2
1.1 V
0.3
0.4
0.45
0.6
±5
VOL
IOL = 5 mA
1.4 V
IOL = 8 mA
1.65 V
2.3 V
IOL = 9 mA
II
A inputs
VI = VCC or GND
VI or VO = 2.7 V
VI = VCC or GND,
VI = VCC or GND
0 to 2.7 V
0
µA
µA
µA
pF
Ioff
ICC
Ci
±10
10
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
(1) All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 0.8 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
MIN MAX MIN
1.3 3.5
MAX MIN TYP MAX MIN
2.2 0.9 1.2 1.8 0.7
MAX
tpd
A
Y
6.7
1
1.4
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.3
TYP
MAX
MIN
MAX
1.9
tpd
A
Y
1.7
2.4
1.2
ns
3
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A–OCTOBER 2003–REVISED MARCH 2005
Operating Characteristics
TA = 25°C
VCC = 0.8 V
TYP
VCC = 1.2 V
TYP
VCC = 1.5 V
TYP
VCC = 1.8 V
TYP
VCC = 2.5 V
TEST
PARAMETER
UNIT
CONDITIONS
TYP
Power dissipation
capacitance
Cpd
f = 10 MHz
18
19
19
20
22
pF
4
SN74AUC17
HEX SCHMITT-TRIGGER BUFFER
www.ti.com
SCES497A–OCTOBER 2003–REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
/t
PLH PHL
S1
Open
2 × V
S1
Open
GND
R
L
t
t
From Output
Under Test
t
/t
PLZ PZL
CC
/t
GND
PHZ PZH
C
L
R
L
(see Note A)
C
L
V
∆
R
L
V
CC
0.8 V
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
LOAD CIRCUIT
0.15 V
0.15 V
0.15 V
0.15 V
V
CC
Timing Input
V /2
CC
0 V
t
w
t
su
t
h
V
CC
V
CC
V /2
CC
V /2
CC
Input
V /2
CC
V /2
CC
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V
CC
/2
V
CC
/2
V /2
CC
V /2
CC
Input
0 V
V
0 V
t
t
t
PLZ
t
t
PHL
PZL
PLH
Output
Waveform 1
V
OH
CC
V
/2
/2
V
V
/2
/2
V
CC
/2
CC
CC
Output
S1 at 2 × V
V
OL
+ V
PHZ
CC
∆
V
OL
V
OL
(see Note B)
t
t
PZH
t
PHL
PLH
/2
Output
Waveform 2
S1 at GND
V
OH
V
OH
V
OH
− V
∆
V
CC
V
CC
CC
Output
≈0 V
V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, slew rate ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2006
PACKAGING INFORMATION
Orderable Device
SN74AUC17RGYR
SN74AUC17RGYRG4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RGY
14
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
QFN
RGY
14
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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