SN74AVC24T245NMUR [TI]
24-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation And 3-State Outputs;型号: | SN74AVC24T245NMUR |
厂家: | TEXAS INSTRUMENTS |
描述: | 24-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation And 3-State Outputs |
文件: | 总29页 (文件大小:1768K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74AVC24T245
SCES552E – FEBRUARY 2004 – REVISED AUGUST 2020
24-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation And 3-
State Outputs
direction-control (DIR) input. The output-enable ( OE)
input can be used to disable the outputs so the buses
1 Features
•
•
•
•
Control Inputs VIH/VIL Levels Are Referenced to
VCCA Voltage
are effectively isolated.
The SN74AVC24T245 is designed so that the control
pins (1DIR, 2DIR, 3DIR, 4DIR, 5DIR, 6DIR, 1 OE, 2
OE, 3 OE, 4 OE, 5 OE, and 6 OE) are supplied by
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance State
Overvoltage-Tolerant Inputs/Outputs Allow Mixed-
Voltage-Mode Data Communications
Fully Configurable Dual-Rail Design Allows Each
Port to Operate Over Full 1.2-V to 3.6-V Power-
Supply Range
Ioff Supports Partial-Power-Down Mode Operation
I/Os Are 4.6-V Tolerant
Max Data Rates
– 380 Mbps (1.8-V to 3.3-V Translation)
– 200 Mbps (<1.8-V to 3.3-V Translation)
– 200 Mbps (Translate to 2.5 V or 1.8 V)
– 150 Mbps (Translate to 1.5 V)
– 100 Mbps (Translate to 1.2 V)
Latch-Up Performance Exceeds 100 mA Per JESD
78, Class II
VCCA
.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
•
•
•
The VCC isolation feature ensures that if either VCC
input is at GND, then both ports are in the high-
impedance state.
To ensure the high-impedance state during power up
or power down, OE should be tied to VCCA through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
•
•
Device Information
PART NUMBER
PACKAGE(1) BODY SIZE (NOM)
ESD Protection Exceeds JESD 22
– 8000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
10.00 mm × 4.50
mm
SN74AVC24T245GRG/ZRG LFBGA
SN74AVC24T245NMU nFBGA
10.00 mm × 4.50
mm
2 Applications
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
•
•
•
Personal Electronics
Industrial
Enterprise
P5
P6
2DIR
1DIR
A6
A5
1OE
2OE
D6
B6
1A1
2A1
Telecom
D1
B1
1B1
2B1
3 Description
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
P3
P4
4DIR
3DIR
This 24-bit noninverting bus transceiver uses two
separate configurable power-supply rails. The
SN74AVC24T245 is optimized to operate with VCCA
VCCB set at 1.4 V to 3.6 V. It is operational with
VCCA/VCCB as low as 1.2 V. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2
V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.2 V to 3.6 V. This
allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-
V, and 3.3-V voltage nodes.
A4
A3
3OE
4OE
H6
F6
3A1
4A1
/
H1
F1
4B1
3B1
P1
P2
6DIR
5DIR
A2
A1
5OE
6OE
M6
K6
6A1
5A1
M1
K1
6B1
5B1
Figure 3-1. Logic Diagram
The SN74AVC24T245 is designed for asynchronous
communication between data buses. The device
transmits data from the A bus to the B bus or from the
B bus to the A bus, depending on the logic level at the
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AVC24T245
SCES552E – FEBRUARY 2004 – REVISED AUGUST 2020
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 6
6.1 Absolute Maximum Ratings........................................ 6
6.2 ESD Ratings............................................................... 6
6.3 Recommended Operating Conditions.........................7
6.4 Thermal Information....................................................8
6.5 Electrical Characteristics.............................................9
6.6 Switching Characteristics..........................................10
6.7 Switching Characteristics..........................................10
6.8 Switching Characteristics..........................................11
6.9 Switching Characteristics..........................................11
6.10 Switching Charactertistics.......................................12
6.11 Operating Characteristics........................................12
6.12 Typical Characteristics............................................13
7 Parameter Measurement Information..........................15
8 Detailed Description......................................................16
8.1 Overview...................................................................16
8.2 Functional Block Diagram.........................................16
8.3 Feature Description...................................................17
8.4 Device Functional Modes..........................................17
9 Application and Implementation..................................18
9.1 Application Information............................................. 18
9.2 EnableTimes............................................................. 18
9.3 Typical Application.................................................... 19
10 Power Supply Recommendations..............................21
11 Layout...........................................................................21
11.1 Layout Guidelines................................................... 21
11.2 Layout Example...................................................... 21
12 Device and Documentation Support..........................22
12.1 Documentation Support.......................................... 22
12.2 Related Documentation.......................................... 22
12.3 Trademarks.............................................................22
12.4 Electrostatic Discharge Caution..............................22
12.5 Glossary..................................................................22
13 Mechanical, Packaging, and Orderable
Information.................................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (August 2005) to Revision E (August 2020)
Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Updated document to current TI data sheet format............................................................................................1
Removed Ordering Information table..................................................................................................................1
Added Applications list, Device Information table...............................................................................................1
Added NMU package option to Device Information table...................................................................................1
Added NMU package to pinout drawing............................................................................................................. 3
Added ESD Ratings table...................................................................................................................................6
Added Thermal Information table....................................................................................................................... 8
Added NMU package to Thermal Information table............................................................................................8
Added Typical Characteristics section..............................................................................................................13
Added Detailed Description section..................................................................................................................16
Added Application and Implementation section................................................................................................18
Added Power Supply Recommendations section.............................................................................................21
Added Layout section....................................................................................................................................... 21
Added Device and Documentation Support section......................................................................................... 22
Added Mechanical, Packaging, and Orderable Information section.................................................................22
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5 Pin Configuration and Functions
1
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Figure 5-1. GRG/ZRG, NMU Package 83-Pin LFBGA, nFBGA Top View
Table 5-1. Pin Assignments
1
2
3
4
5
6
A
B
C
D
E
F
6 OE
1B1
1B3
2B1
2B3
3B1
3B3
4B1
4B3
5B1
5B3
6B1
6B3
6DIR
5 OE
1B2
1B4
2B2
2B4
3B2
3B4
4B2
4B4
5B2
5B4
6B2
6B4
5DIR
4 OE
VCCB
GND
VCCB
GND
GND
3 OE
VCCA
GND
VCCA
GND
GND
GND
VCCA
GND
GND
VCCA
GND
VCCA
3DIR
2 OE
1A2
1A4
2A2
2A4
3A2
3A4
4A2
4A4
5A2
5A4
6A2
6A4
2DIR
1 OE
1A1
1A3
2A1
2A3
3A1
3A3
4A1
4A3
5A1
5A3
6A1
6A3
1DIR
G
H
J
VCCB
GND
GND
VCCB
GND
VCCB
4DIR
K
L
M
N
P
Table 5-2. Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
A1
A2
A3
A4
6 OE
5 OE
4 OE
3 OE
Input
Input
Input
Input
mode. Referenced to VCCA
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
.
.
.
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
.
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Table 5-2. Pin Functions (continued)
PIN
I/O
DESCRIPTION
NO.
NAME
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
A5
2 OE
Input
Input
mode. Referenced to VCCA
.
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
A6
1 OE
.
B1
B2
B3
B4
B5
B6
C1
C2
C3
C4
C5
C6
D1
D2
D3
D4
D5
D6
E1
E2
E3
E4
E5
E6
F1
F2
F3
F4
F5
F6
G1
G2
G4
G5
G6
H1
H2
H3
H4
H5
H6
1B1
1B2
VCCB
VCCA
1A2
1A1
1B3
1B4
GND
GND
1A4
1A3
2B1
2B2
VCCB
VCCA
2A2
2A1
2B3
2B4
GND
GND
2A4
2A3
3B1
3B2
GND
GND
3A2
3A1
3B3
3B4
GND
3A4
3A3
4B1
4B2
VCCB
VCCA
4A2
4A1
Input/Output
Input/Output
—
Referenced to VCCB
Referenced to VCCB
.
.
B-port supply voltage. 1.2 V ≤ VCCB ≤ 3.6 V.
A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V.
—
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
.
—
Ground.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
.
.
.
B-port supply voltage. 1.2 V ≤ VCCB ≤ 3.6 V.
A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V.
—
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
.
—
Ground.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
—
Ground.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
.
.
.
.
B-port supply voltage. 1.2 V ≤ VCCB ≤ 3.6 V.
A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V.
—
Input/Output
Input/Output
Referenced to VCCA
Referenced to VCCA
.
.
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Table 5-2. Pin Functions (continued)
PIN
I/O
DESCRIPTION
NO.
J1
NAME
4B3
Input/Output
Input/Output
—
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
J2
4B4
J3
GND
GND
4A4
J4
—
Ground.
J5
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
.
J6
4A3
K1
K2
K3
K4
K5
K6
L1
5B1
5B2
GND
GND
5A2
—
Ground.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
.
.
.
.
5A1
5B3
L2
5B4
L3
VCCB
VCCA
5A4
B-port supply voltage. 1.2 V ≤ VCCB ≤ 3.6 V.
A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V.
L4
—
L5
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
Ground.
.
.
.
.
L6
5A3
M1
M2
M3
M4
M5
M6
N1
N2
N3
N4
N5
N6
P1
P2
P3
P4
P5
P6
6B1
6B2
GND
GND
6A2
—
Ground.
Input/Output
Input/Output
Input/Output
Input/Output
—
Referenced to VCCA
Referenced to VCCA
Referenced to VCCB
Referenced to VCCB
.
.
.
.
6A1
6B3
6B4
VCCB
VCCA
6A4
B-port supply voltage. 1.2 V ≤ VCCB ≤ 3.6 V.
A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V.
—
Input/Output
Input/Output
Input
Referenced to VCCA
Referenced to VCCA
.
.
6A3
6DIR
5DIR
4DIR
3DIR
2DIR
1DIR
Direction-control signal. Referenced to VCCA
Direction-control signal. Referenced to VCCA
Direction-control signal. Referenced to VCCA
Direction-control signal. Referenced to VCCA
Direction-control signal. Referenced to VCCA
.
.
.
.
.
Input
Input
Input
Input
Input
Direction-control signal. Referenced to VCCA.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX UNIT
VCCA
Supply voltage range
VCCB
–0.5
4.6
V
I/O ports (A port)
I/O ports (B port)
Control inputs
A port
–0.5
–0.5
–0.5
–0.5
–0.5
4.6
4.6
4.6
4.6
4.6
VI
Input voltge range(2)
V
Voltage range applied to any output
VO
VO
V
V
in the high-impedance or power-off state(2)
B port
A port
–0.5 VCCA + 0.5
Voltage range applied to any output in the high or low state(2) (3)
B port
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
mA
mA
mA
mA
°C
Output clamp current
VO < 0
Continuous output current
±50
Continuous current through each VCCA, VCCB, and GND
Storage temperature range
±100
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.6-V maximum if the output current rating is observed.
6.2 ESD Ratings
VALUE
±8000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-0011
V (ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C1012
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6.3 Recommended Operating Conditions
(1) (2) (3)
VCCI
VCCO
MIN
MAX UNIT
VCCA
VCCB
Supply voltage
Supply voltage
1.2
3.6
3.6
V
V
1.2
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
VCCI × 0.65
High-level
input voltage
VIH
VIL
VIH
VIL
Data inputs(4)
Data inputs(4)
1.6
2
V
V
V
V
VCCI × 0.35
Low-level
input voltage
0.7
0.8
VCCA × 0.65
High-level
input voltage
DIR
1.6
2
(5)
(5)
(referenced to VCCA
)
VCCA × 0.35
Low-level
input voltage
DIR
0.7
0.8
3.6
VCCO
3.6
–3
–6
–8
–9
–12
3
(referenced to VCCA
)
VI
Input voltage
0
0
0
V
V
Active state
3-state
VO
Output voltage
1.2 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
1.2 V
IOH
High-level output current
Low-level output current
mA
mA
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
6
IOL
8
9
12
5
Δt/Δv
TA
Input transition rise or fall rate
Operating free-air temperature
ns/V
°C
–40
85
(1) VCCI is the VCC associated with the data input port.
(2) VCCO is the VCC associated with the output port.
(3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(4) For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V.
(5) For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V.
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6.4 Thermal Information
SN74AVC24T245
THERMAL METRIC(1)
GRG
83
ZRG
83
NMU
83
UNIT
R θJA
Junction-to-ambient thermal resistance
38.1
38.1
44.3
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal
resistance
R θJC(top)
R θJB
22.8
17.0
0.44
22.8
17.0
0.44
24.5
29.1
0.5
Junction-to-board thermal resistance
Junction-to-top characterization
parameter
ψ JT
Junction-to-board characterization
parameter
ψ JB
16.9
16.9
29.2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)(2) (3)
TA = 25°C
–40°C to 85°C
PARAMETER
TEST CONDITIONS
VCCA
VCCB
UNIT
MIN
TYP
MAX
MIN
MAX
IOH = –100 μA
1.2 V to 3.6 V 1.2 V to 3.6 V
VCCO – 0.2
IOH = –3 mA
IOH = –6 mA
IOH = –8 mA
IOH = –9 mA
IOH = –12 m
IOL = 100 μA
IOL = 3 mA
IOL = 6 mA
IOL = 8 mA
IOL = 9 mA
IOL = 12 mA
1.2 V
1.4 V
1.65 V
2.3 V
3 V
1.2 V
1.4 V
1.65 V
2.3 V
3 V
0.95
1.05
1.2
VOH
VI = VIH
V
1.75
2.3
1.2 V to 3.6 V 1.2 V to 3.6 V
0.2
1.2 V
1.4 V
1.65 V
2.3 V
3 V
1.2 V
1.4 V
1.65 V
2.3 V
3 V
0.15
0.35
0.45
0.55
0.7
VOL
VI = VIL
V
Control
inputs
II
VI = VCCA or GND
1.2 V to 3.6 V 1.2 V to 3.6 V
±0.025 ±0.25
±1
±5
±5
μA
μA
A or B
port
0 V
0 to 3.6 V
0 V
±0.1
±0.1
±2.5
±2.5
Ioff
VI or VO = 0 to 3.6 V
A or B
port
0 to 3.6 V
VO = VCCO or GND,
VI = VCCI or GND,
OE = VIH
A or B
port
(1)
IOZ
3.6 V
3.6 V
±0.5
±2.5
±5
μA
μA
1.2 V to 3.6 V 1.2 V to 3.6 V
40
–5
40
40
40
–5
VI = VCCI or GND,
IO = 0
ICCA
0 V
3.6 V
0 V
3.6 V
1.2 V to 3.6 V 1.2 V to 3.6 V
VI = VCCI or GND,
IO = 0
ICCB
0 V
3.6 V
0 V
μA
3.6 V
VI = VCCI or GND,
IO = 0
ICCA + ICCB
1.2 V to 3.6 V 1.2 V to 3.6 V
75
μA
pF
pF
Control
inputs
Ci
VI = 3.3 V or GND
VO = 3.3 V or GND
3.3 V
3.3 V
3.3 V
3.3 V
3.5
7
A or B
port
Cio
(1) For I/O ports, the parameter IOZ includes the input leakage current.
(2) VCCO is the VCC associated with the output port.
(3) VCCI is the VCC associated with the input port.
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6.6 Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.2 V (see Figure 7-1)
VCCB = 1.2 V
VCCB = 1.5 V
VCCB = 1.8 V
VCCB = 2.5 V
TYP
2.8
VCCB = 3.3 V
TYP
3.2
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
TYP
4.1
4.1
4.4
4.4
6.4
6.4
6
TYP
3.3
3.3
4
TYP
3
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
A
B
A
A
B
A
B
3
2.8
3.2
3.8
3.8
6.4
6.4
4
3.6
3.5
B
ns
4
3.6
3.5
6.4
6.4
4.6
4.6
6.6
6.6
4.9
4.9
6.4
6.4
OE
OE
OE
OE
ns
6.4
6.4
3.4
3.2
ns
6
4
3.4
3.2
6.6
6.6
6
6.6
6.6
4.9
4.9
6.6
6.8
ns
6.6
6.8
4.2
5.3
ns
6
4.2
5.3
6.7 Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (see Figure 7-1)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.1 V
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
TYP
3.6
3.6
3.3
3.3
4.3
4.3
5.6
5.6
4.5
4.5
5.5
5.5
MIN MAX
MIN MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.5
0.5
0.5
0.5
1
6.2
6.2
0.5
0.5
0.5
0.5
1
5.2
5.2
0.5
0.5
0.5
0.5
1
4.1
4.1
0.5
0.5
0.5
0.5
1
3.7
3.7
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
6.2
5.9
5.6
5.5
B
6.2
5.9
5.6
5.5
10.1
10.1
10.1
10.1
9.1
10.1
10.1
8.1
10.1
10.1
5.9
10.1
10.1
5.2
OE
OE
OE
OE
1
1
1
1
1
0.5
0.5
1.5
1.5
1.5
1.5
0.5
0.5
1.5
1.5
1
0.5
0.5
1.5
1.5
1
1
8.1
5.9
5.2
1.5
1.5
1.5
1.5
9.1
9.1
9.1
9.1
9.1
9.1
9.1
8.7
7.5
6.5
6.3
8.7
7.5
1
6.5
1
6.3
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6.8 Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (see Figure 7-1)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.1 V
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
TYP
3.4
3.4
3
MIN MAX
MIN MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.5
0.5
0.5
0.5
1
5.9
5.9
5.2
5.2
7.8
7.8
9.2
9.2
7.7
7.7
8.4
8.4
0.5
0.5
0.5
0.5
1
4.8
4.8
4.8
4.8
7.8
7.8
7.4
7.4
7.7
7.7
7.1
7.1
0.5
0.5
0.5
0.5
1
3.7
3.7
4.5
4.5
7.8
7.8
5.3
5.3
7.7
7.7
5.9
5.9
0.5
0.5
0.5
0.5
1
3.3
3.3
4.4
4.4
7.8
7.8
4.5
4.5
7.7
7.7
5.7
5.7
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
3
3.4
3.4
5.4
5.4
4.2
4.2
5.2
5.2
OE
OE
OE
OE
1
1
1
1
1
0.5
0.5
1.5
1.5
1.5
1.5
0.5
0.5
1.5
1.5
1
0.5
0.5
1.5
1.5
1
1
1.5
1.5
1.5
1.5
1
1
6.9 Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (see Figure 7-1)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.1 V
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
TYP
3.2
3.2
2.6
2.6
2.5
2.5
5.2
5.2
3
MIN MAX
MIN MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
5.6
5.6
4.1
4.1
5.3
5.3
9.4
9.4
6.1
6.1
7.9
7.9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
4.5
4.5
3.7
3.7
5.3
5.3
7.3
7.3
6.1
6.1
6.6
6.6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
3.3
3.3
3.3
3.3
5.3
5.3
5.1
5.1
6.1
6.1
6.1
6.1
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
2.8
2.8
3.2
3.2
5.3
5.3
4.5
4.5
6.1
6.1
5.2
5.2
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
OE
OE
OE
OE
3
1
1
1
1
5
1
1
1
1
5
1
1
1
1
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6.10 Switching Charactertistics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (see Figure 7-1)
VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
VCCB = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.1 V
± 0.15 V
± 0.2 V
± 0.3 V
PARAMETER
UNIT
TYP
3.2
3.2
2.8
2.8
2.2
2.2
5.1
5.1
3.4
3.4
4.9
4.9
MIN MAX
MIN MAX
MIN MAX
MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
5.5
5.5
3.7
3.7
4.3
4.3
9.3
9.3
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
4.4
4.4
3.3
3.3
4.2
4.2
7.2
7.2
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1
3.2
3.2
2.8
2.8
4.1
4.1
4.9
4.9
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
2.7
2.7
2.7
2.7
4
A
B
A
A
B
A
B
ns
ns
ns
ns
ns
ns
B
OE
OE
OE
OE
4
4
4
5
5
5
5
5
7.7
7.7
6.5
6.5
5.2
5.2
5
1
1
1
5
6.11 Operating Characteristics
VCCA and VCCB = 3.3 V, TA = 25°C
VCCA
=
VCCA
=
VCCA
=
VCCA
=
VCCA =
TEST
CONDITIONS
VCCB = 1.5 V VCCB = 1.2 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V
PARAMETER
UNIT
TYP
TYP
TYP
TYP
TYP
Outputs
enabled
1
1
1
2
2
A to B
B to A
A to B
B to A
Outputs
disabled
1
19
1
1
19
1
1
20
1
1
21
1
2
22
1
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
Outputs
enabled
Outputs
disabled
Outputs
enabled
19
1
19
1
20
1
21
1
22
1
Outputs
disabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
Outputs
enabled
1
1
1
2
2
Outputs
disabled
1
1
1
1
2
(1) Power dissipation capacitance per transceiver
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6.12 Typical Characteristics
6
6
5
4
3
2
1
0
T
= 25°C
T
A
= 25°C
A
V
= 1.2 V
V
CCA
= 1.2 V
CCA
5
4
3
2
1
0
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
CCB
V
V
V
V
V
V
V
V
CCB
CCB
CCB
CCB
CCB
CCB
CCB
CCB
0
10
20
30
40
− Load Capacitance − pF
50
60
0
10
20
30
40
50
60
C
L
C
L
− Load Capacitance − pF
Figure 6-1. Propagation Delay vs Load
Capacitance
Figure 6-2. Propagation Delay vs Load
Capacitance
6
6
T = 25°C
A
T
A
= 25°C
V = 1.5 V
CCA
V
CCA
= 1.5 V
5
4
3
2
1
0
5
4
3
2
1
0
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
V
V
V
CCB
CCB
CCB
CCB
V
V
V
V
CCB
CCB
CCB
CCB
0
10
20
30
40
50
60
0
10
20
30
40
50
60
C
L
− Load Capacitance − pF
C
L
− Load Capacitance − pF
Figure 6-3. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
Figure 6-4. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
6
6
T
A
= 25°C
T
A
= 25°C
V
CCA
= 1.8 V
V
CCA
= 1.8 V
5
4
3
2
1
0
5
4
3
2
1
0
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
CCB
V
V
V
V
V
V
V
V
CCB
CCB
CCB
CCB
CCB
CCB
CCB
CCB
0
10
20
30
40
50
60
0
10
20
30
40
50
60
C
L
− Load Capacitance − pF
C
L
− Load Capacitance − pF
Figure 6-6. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
Figure 6-5. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
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6
6
5
T
= 25°C
T
= 25°C
A
A
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
= 2.5 V
V
= 2.5 V
CCA
CCA
V
V
V
V
CCB
CCB
CCB
CCB
5
4
3
2
1
0
4
3
2
1
0
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
V
V
V
CCB
CCB
CCB
CCB
0
10
20
30
40
50
60
0
10
20
30
40
50
60
C
L
− Load Capacitance − pF
C
L
− Load Capacitance − pF
Figure 6-8. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
Figure 6-7. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
6
6
T
A
= 25°C
T
= 25°C
A
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
CCA
= 3.3 V
V
= 3.3 V
CCA
V
V
V
V
CCB
CCB
CCB
CCB
5
4
3
2
1
0
5
4
3
2
1
0
V
= 1.2 V
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
CCB
V
V
V
V
CCB
CCB
CCB
CCB
0
10
20
30
40
50
60
0
10
20
30
40
50
60
C
L
− Load Capacitance − pF
C
L
− Load Capacitance − pF
Figure 6-9. Typical Propagation Delay tPLH (A to B)
vs Load Capacitance
Figure 6-10. Propagation Delay vs Load
Capacitance
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7 Parameter Measurement Information
2 × V
CCO
TEST
S1
S1
R
L
Open
GND
t
Open
pd
From Output
Under Test
t
/t
PLZ PZL
2 × V
CCO
t /t
PHZ PZH
GND
C
L
(see Note A)
R
L
t
w
LOAD CIRCUIT
V
CCI
V
CCI
/2
V
CCI
/2
Input
C
L
V
TP
R
L
V
CCO
0 V
1.5 V 0.1 V
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.1 V
0.15 V
0.15 V
0.3 V
15 pF
15 pF
15 pF
15 pF
VOLTAGE WAVEFORMS
PULSE DURATION
1.8 V 0.15 V
2.5 V 0.2 V
3.3 V 0.3 V
V
CCA
Output
Control
(low-level
enabling)
V /2
CCA
V
CCA
/2
t
0 V
t
PZL
PLZ
V
V
CCO
Output
V
CCI
V
/2
/2
Waveform 1
S1 at 2 × V
CCO
Input
V
CCI
/2
V
CCI
/2
V
+ V
OL
TP
CCO
(see Note B)
OL
0 V
t
t
PZH
PHZ
t
t
PHL
PLH
Output
Waveform 2
S1 at GND
V
OH
V
OH
V
OH
− V
TP
V
CCO
Output
V /2
CCO
V
CCO
/2
(see Note B)
0 V
V
OL
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
PROPAGATION DELAY TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
are the same as t
.
PZH
en
and t
are the same as t .
pd
PHL
V
V
is the V associated with the input port.
CC
is the V associated with the output port.
CCI
CCO
CC
Figure 7-1. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
The SN74AVC24T245 is a 16-bit, dual-supply noninverting bidirectional voltage level translation. Pins A and
control pins (DIR and OE) are supported by VCCA and pins B are supported by VCCB. The A port can accept I/O
voltages ranging from 1.2 V to 3.6 V, while the B port can accept I/O voltages from 1.2 V to 3.6 V. A high on DIR
allows data transmission from A to B and a low on DIR allows data transmission from B to A when OE is set to
low. When OE is set to high, both A and B are in the high-impedance state.
This device is fully specified for partial-power-down applications using off output current (Ioff).
The VCC isolation feature ensures that if either VCC input is at GND, both ports are put in a high-impedance
state.
8.2 Functional Block Diagram
P5
P6
2DIR
1DIR
A6
A5
1OE
2OE
D6
B6
1A1
2A1
D1
B1
2B1
1B1
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
To Three Other Channels
P3
P4
4DIR
3DIR
A4
A3
3OE
4OE
H6
F6
4A1
3A1
H1
F1
4B1
3B1
P1
P2
6DIR
5DIR
A2
A1
5OE
6OE
M6
K6
6A1
5A1
M1
K1
6B1
5B1
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8.3 Feature Description
8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-
Supply Range
Both VCCA and VCCB can be supplied at any voltage from 1.2 V to 3.6 V which makes the device suitable for
translating between any of the low voltage nodes (1.2 V, 1.8 V, 2.5 V, and 3.3 V).
8.3.2 Partial-Power-Down Mode Operation
This device is fully specified for partial-power-down applications using off output current (Ioff). The Ioff circuitry will
prevent backflow current by disabling I/O output circuits when device is in partial power-down mode.
8.3.3 VCC Isolation
The VCC isolation feature ensures that if either VCCA or VCCB are at GND, both ports will be in a high-impedance
state (IOZ). This prevents false logic levels from being presented to either bus.
8.4 Device Functional Modes
The SN74AVC24T245 is a voltage level translator that can operate from 1.2 V to 3.6 V (VCCA) and 1.2 V to 3.6 V
(VCCB). The signal translation between 1.2 V and 3.6 V requires direction control and output enable control.
When OE is low and DIR is high, data transmission is from A to B. When OE is low and DIR is low, data
transmission is from B to A. When OE is high, both output ports will be high-impedance.
Table 8-1. Function Table
(Each 4-Bit Section)
INPUTS
OPERATION
OE
DIR
B data to A
bus
L
L
A data to B
bus
L
H
X
H
Isolation
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The SN74AVC24T245 device can be used in level-shifting applications for interfacing devices and addressing
mixed voltage incompatibility. The SN74AVC24T245 device is ideal for data transmission where direction is
different for each channel.
9.2 EnableTimes
Calculate the enable times for the SN74AVC24T245 using the following formulas:
tPZH (DIR to A) = tPLZ (DIR to B) + tPLH (B to A)
tPZL (DIR to A) = tPHZ (DIR to B) + tPHL (B to A)
tPZH (DIR to B) = tPLZ (DIR to A) + tPLH (A to B)
tPZL (DIR to B) = tPHZ (DIR to A) + tPHL (A to B)
(1)
(2)
(3)
(4)
In a bidirectional application, these enable times provide the maximum delay from the time the DIR bit is
switched until an output is expected. For example, if the SN74AVC24T245 initially is transmitting from A to B,
then the DIR bit is switched; the B port of the device must be disabled before presenting it with an input. After the
B port has been disabled, an input signal applied to it appears on the corresponding A port after the specified
propagation delay.
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9.3 Typical Application
1.8 V
3.3 V
0.1 µF
0.1 µF
V
V
CCB
CCA
1DIR/2DIR/3DIR/
4DIR/5DIR/6DIR
1OE/2OE/3OE/
4OE/5OE/6OE
1.8-V
Controller
3.3-V
System
SN74AVC(H)24T245
1B1/1B2/1B3/1B4
1A1/1A2/1A3/1A4
2A1/2A2/2A3/2A4
3A1/3A2/3A3/3A4
4A1/4A2/4A3/4A4
5A1/5A2/5A3/5A4
6A1/6A2/6A3/6A4
2B1/2B2/2B3/2B4
3B1/3B2/3B3/3B4
4B1/4B2/4B3/4B4
5B1/5B2/5B3/5B4
Data
Data
6B1/6B2/6B3/6B4
GND
GND
GND
Figure 9-1. Application Schematic
9.3.1 Design Requirements
This device uses drivers which are enabled depending on the state of the DIR pin. The designer must know the
intended flow of data and take care not to violate any of the high or low logic levels. Unused data inputs must not
be floating, as this can cause excessive internal leakage on the input CMOS structure. Tie any unused input and
output ports directly to ground.
For this design example, use the parameters listed in the Electrical Characteristics.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.2 V to 3.6 V
Output voltage range
1.2 V to 3.6 V
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9.3.2 Detailed Design Procedure
To begin the design process, determine the following:
9.3.2.1 Input Voltage Ranges
Use the supply voltage of the device that is driving the SN74AVC24T245 device to determine the input voltage
range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low the value must
be less than the VIL of the input port.
9.3.2.2 Output Voltage Range
Use the supply voltage of the device that the SN74AVC24T245 device is driving to determine the output voltage
range.
9.3.3 Application Curve
Input (1.2 V)
Output (3.3 V)
Figure 9-2. Translation Up (1.2 V to 3.3 V) at 2.5 MHz
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10 Power Supply Recommendations
The SN74AVC24T245 device uses two separate configurable power-supply rails, VCCA and VCCB. VCCA accepts
any supply voltage from 1.2 V to 3.6 V and VCCB accepts any supply voltage from 1.2 V to 3.6 V. The A port and
B port are designed to track VCCA and VCCB, respectively, allowing for low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V and 3.3-V voltage nodes.
The output-enable OE input circuit is designed so that it is supplied by VCCA and when the OE input is high, all
outputs are placed in the high-impedance state. To ensure the high-impedance state of the outputs during power
up or power down, the OE input pin must be tied to VCCA through a pullup resistor and must not be enabled until
VCCA and VCCB are fully ramped and stable. The minimum value of the pullup resistor to VCCA is determined by
the current-sinking capability of the driver.
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, following common printed-circuit-board layout guidelines is recommended.
•
•
•
Bypass capacitors must be used on power supplies.
Short trace lengths must be used to avoid excessive loading.
Place pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of
signals, depending on the system requirements.
11.2 Layout Example
0.8mm
pitch
0.50mm dia.
solder mask
opening
0.350mm
Dia. Pad
0.254mm
dia. hole
0.125mm
Trace
Figure 11-1. BGA Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.2 Related Documentation
For related documentation, see the following:
http://www.ti.com/lit/an/scea014/scea014.pdf
12.3 Trademarks
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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28-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74AVC24T245GRGR
LIFEBUY
BGA
GRG
83
1000
TBD
SNPB
Level-1-240C-UNLIM
-40 to 85
WH245
MICROSTAR
JUNIOR
SN74AVC24T245NMUR
SN74AVC24T245ZRGR
ACTIVE
ACTIVE
NFBGA
NMU
ZRG
83
83
1000
1000
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
Level-3-260C-168 HR
Level-1-260C-UNLIM
-40 to 85
-40 to 85
2CPW
BGA
MICROSTAR
JUNIOR
Green (RoHS
& no Sb/Br)
WH245
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AVC24T245GRGR BGA MI
GRG
83
1000
330.0
24.4
4.8
10.3
1.8
8.0
24.0
Q1
CROSTA
R JUNI
OR
SN74AVC24T245ZRGR BGA MI
ZRG
83
1000
330.0
24.4
4.8
10.3
1.8
8.0
24.0
Q1
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AVC24T245GRGR BGA MICROSTAR
JUNIOR
GRG
83
1000
350.0
350.0
43.0
SN74AVC24T245ZRGR BGA MICROSTAR
JUNIOR
ZRG
83
1000
350.0
350.0
43.0
Pack Materials-Page 2
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