SN74BCT2240N-10 [TI]

BCT/FBT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDIP20;
SN74BCT2240N-10
型号: SN74BCT2240N-10
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

BCT/FBT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDIP20

驱动 信息通信管理 光电二极管 输出元件 逻辑集成电路
文件: 总13页 (文件大小:397K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54BCT2240, SN74BCT2240  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS030E − SEPTEMBER 1988 − REVISED MARCH 2003  
SN54BCT2240 . . . J OR W PACKAGE  
SN74BCT2240 . . . DB, DW, N,OR NS PACKAGE  
(TOP VIEW)  
D Operating Voltage Range of 4.5 V to 5.5 V  
D State-of-the-Art BiCMOS Design  
Significantly Reduces I  
CCZ  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
VCC  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
D Output Ports Have Equivalent 33-Ω Series  
Resistors, So No External Resistors Are  
Required  
D 3-State Outputs Drive Bus Lines or Buffer  
Memory Address Registers  
description/ordering information  
These octal buffers and line drivers are designed  
specifically to improve both the performance and  
density of 3-state memory address drivers, clock  
drivers, and bus-oriented receivers and  
transmitters. Together with the SN74BCT2241  
and the ’BCT2244 devices, these devices provide  
the choice of selected combinations of inverting  
and noninverting outputs, symmetrical active-low  
output-enable (OE) inputs, and complementary  
OE and OE inputs. These devices feature high  
fan-out and improved fan-in.  
SN54BCT2240 . . . FK PACKAGE  
(TOP VIEW)  
3
2
1
20 19  
18  
4
5
6
7
8
1Y1  
2A4  
1Y2  
2A3  
1Y3  
1A2  
2Y3  
1A3  
2Y2  
1A4  
17  
16  
15  
14  
The ’BCT2240 devices are organized as two 4-bit  
line drivers with separate output-enable (OE)  
inputs. When OE is low, the device passes data  
from the A inputs to the Y outputs. When OE is  
high, the outputs are in the high-impedance state.  
9 10 11 12 13  
To ensure the high-impedance state during power  
up or power down, OE should be tied to V  
CC  
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of  
the driver.  
The outputs, which are designed to source or sink up to 12 mA, include 33-Ω series resistors to reduce overshoot  
and undershoot.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
PDIP − N  
Tube  
SN74BCT2240N  
SN74BCT2240N  
Tube  
SN74BCT2240DW  
SN74BCT2240DWR  
SN74BCT2240NSR  
SN74BCT2240DBR  
SNJ54BCT2240J  
SNJ54BCT2240W  
SNJ54BCT2240FK  
SOIC − DW  
BCT2240  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
0°C to 70°C  
SOP − NS  
SSOP − DB  
CDIP − J  
BCT2240  
BA240  
SNJ54BCT2240J  
SNJ54BCT2240W  
SNJ54BCT2240FK  
−55°C to 125°C  
CFP − W  
Tube  
LCCC − FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright © 2003, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
SN54BCT2240, SN74BCT2240  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS030E − SEPTEMBER 1988 − REVISED MARCH 2003  
FUNCTION TABLE  
(each buffer)  
INPUTS  
OUTPUT  
Y
A
OE  
L
H
L
L
H
Z
L
H
X
logic diagram (positive logic)  
1
2
4
1OE  
1A1  
1A2  
18  
16  
1Y1  
1Y2  
6
8
14  
12  
1A3  
1A4  
1Y3  
1Y4  
19  
2OE  
9
7
11  
13  
2A1  
2A2  
2Y1  
2Y2  
15  
17  
5
3
2A3  
2A4  
2Y3  
2Y4  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
SN54BCT2240, SN74BCT2240  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS030E − SEPTEMBER 1988 − REVISED MARCH 2003  
schematic of Y outputs  
V
CC  
Output  
GND  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the disabled or power-off state, V . . . . . . . . . . . . . . . . −0.5 V to 5.5 V  
O
Voltage range applied to any output in the high state, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
O
CC  
Input clamp current, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA  
IK  
Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA  
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
SN54BCT2240, SN74BCT2240  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS030E − SEPTEMBER 1988 − REVISED MARCH 2003  
recommended operating conditions (see Note 3)  
SN54BCT2240  
MIN NOM MAX  
SN74BCT2240  
MIN NOM MAX  
UNIT  
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.5  
2
5
5.5  
V
V
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Input clamp current  
0.8  
−18  
−12  
12  
0.8  
−18  
−12  
12  
V
I
I
I
mA  
mA  
mA  
°C  
IK  
High-level output current  
Low-level output current  
Operating free-air temperature  
OH  
OL  
T
A
−55  
125  
0
70  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54BCT2240  
SN74BCT2240  
PARAMETER  
TEST CONDITIONS  
I = −18 mA  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
IK  
V
V
= 4.5 V,  
= 4.5 V  
−1.2  
−1.2  
V
CC  
I
I
I
I
I
= −1 mA  
= −12 mA  
= 1 mA  
2.4  
2
3.3  
2.4  
2
3.3  
OH  
OH  
OL  
OL  
V
OH  
V
V
CC  
3.2  
0.15  
0.35  
3.2  
0.15  
0.35  
0.5  
0.8  
0.1  
20  
0.5  
0.8  
0.1  
20  
V
OL  
V
CC  
= 4.5 V  
= 12 mA  
I
I
I
I
I
I
I
I
I
V
V
V
V
V
V
V
V
V
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
V = 7 V  
I
mA  
μA  
I
CC  
CC  
CC  
CC  
V = 2.7 V  
I
IH  
V = 0.5 V  
I
−1  
−1  
mA  
μA  
IL  
V
O
V
O
V
O
= 2.7 V  
= 0.5 V  
= 0  
50  
50  
OZH  
OZL  
−50  
−50  
−225  
32  
μA  
CC  
CC  
CC  
CC  
CC  
−100  
−225 −100  
mA  
mA  
mA  
mA  
OS  
Outputs open  
Outputs open  
Outputs open  
19  
46  
6
32  
76  
8
19  
46  
6
CCH  
CCL  
CCZ  
76  
8
All typical values are at V = 5 V, T = 25°C.  
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
CC  
A
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, CL =50 pF (unless otherwise noted) (see Figure 1)  
V
T
= 5 V,  
CC  
SN54BCT2240 SN74BCT2240  
FROM  
(INPUT)  
TO  
(OUTPUT)  
= 25°C  
TYP  
3.4  
A
PARAMETER  
UNIT  
MIN  
0.5  
0.5  
2.6  
4.3  
2
MAX  
4.8  
4
MIN  
0.5  
0.5  
2.6  
4.3  
2
MAX  
6.3  
MIN  
0.5  
0.5  
2.6  
4.3  
2
MAX  
5.7  
t
t
PLH  
PHL  
PZH  
A
Y
Y
Y
ns  
ns  
ns  
2.8  
4.6  
4.4  
t
6.2  
8.2  
10.9  
7.1  
8.5  
10.1  
12.9  
9.2  
9.3  
OE  
OE  
t
8.8  
12.4  
8.7  
PZL  
PHZ  
t
5.3  
t
2.2  
6.7  
2.2  
12.2  
2.2  
10.6  
PLZ  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
SN54BCT2240, SN74BCT2240  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS030E − SEPTEMBER 1988 − REVISED MARCH 2003  
PARAMETER MEASUREMENT INFORMATION  
7 V (t  
, t  
, O.C.)  
PZL PLZ  
Open  
(all others)  
S1  
From Output  
Under Test  
Test  
Point  
C
L
R1  
R1  
(see Note A)  
From Output  
Under Test  
Test  
Point  
C
L
R2  
(see Note A)  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
R = R1 = R2  
L
LOAD CIRCUIT FOR  
3-STATE AND OPEN-COLLECTOR OUTPUTS  
High-Level  
Pulse  
(see Note B)  
3 V  
0 V  
1.5 V  
1.5 V  
3 V  
Timing Input  
(see Note B)  
1.5 V  
t
w
0 V  
3 V  
0 V  
3 V  
0 V  
t
h
Low-Level  
Pulse  
t
1.5 V  
su  
1.5 V  
Data Input  
(see Note B)  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
Output  
Control  
(low-level enable)  
3 V  
0 V  
1.5 V  
1.5 V  
Input  
(see Note B)  
1.5 V  
1.5 V  
t
PZL  
t
t
PLZ  
PHL  
t
PLH  
3.5 V  
In-Phase  
Output  
(see Note D)  
V
V
OH  
1.5 V  
Waveform 1  
(see Notes C and D)  
1.5 V  
1.5 V  
1.5 V  
V
OL  
OL  
0.3 V  
t
t
PHZ  
PLH  
t
PHL  
t
PZH  
V
V
V
OH  
Out-of-Phase  
Output  
(see Note D)  
OH  
Waveform 2  
(see Notes C and D)  
1.5 V  
1.5 V  
0.3 V  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES (see Note D)  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS  
NOTES: A. C includes probe and jig capacitance.  
L
B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, t = t 2.5 ns, duty cycle = 50%.  
r
f
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
D. The outputs are measured one at a time with one transition per measurement.  
E. When measuring propagation delay times of 3-state outputs, switch S1 is open.  
F. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
5962-9093901M2A  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
5962-  
9093901M2A  
SNJ54BCT  
2240FK  
5962-9093901MRA  
5962-9093901MSA  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
5962-9093901MR  
A
SNJ54BCT2240J  
W
Call TI  
5962-9093901MS  
A
SNJ54BCT2240W  
SN74BCT2240DBLE  
SN74BCT2240NE4  
OBSOLETE  
ACTIVE  
SSOP  
PDIP  
DB  
N
20  
20  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
SN74BCT2240N  
SNJ54BCT2240FK  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
5962-  
9093901M2A  
SNJ54BCT  
2240FK  
SNJ54BCT2240J  
SNJ54BCT2240W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
5962-9093901MR  
A
SNJ54BCT2240J  
W
Call TI  
5962-9093901MS  
A
SNJ54BCT2240W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54BCT2240, SN74BCT2240 :  
Catalog: SN74BCT2240  
Military: SN54BCT2240  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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