SN74BCT760-EP [TI]
OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS; 八路缓冲器/驱动器，集电极开路输出
| 型号： | SN74BCT760-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS |
| 文件： | 总11页 (文件大小：508K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
FEATURES
•
Controlled Baseline
DW PACKAGE
(TOP VIEW)
– One Assembly/Test Site, One Fabrication
Site
1
2
3
4
5
6
7
8
9
10
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
20 VCC
•
•
Extended Temperature Performance of –55°C
to 125°C
19
18
17
16
15
14
13
12
11
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
Enhanced Diminishing Manufacturing
Sources (DMS) Support
•
•
•
•
Enhanced Product-Change Notification
(1)
Qualification Pedigree
Open-Collector Version of 'BCT244
Open-Collector Outputs Drive Bus Lines or
Buffer Memory Address Registers
•
•
ESD Protection Exceeds 2000 V Per
MIL-STD-883C Method 3015
Available In Plastic Small-Outline (DW)
Package
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and
density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
The device is characterized for operation over the full military temperature range of –55°C to 125°C.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
BCT760MEP
–55°C to 125°C
SOIC – DW
Tape and reel
SN74BCT760MDWREP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
L
A
H
L
H
L
L
H
X
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
LOGIC SYMBOL(1)
1
EN
1OE
2
1A1
4
1A2
6
1A3
8
1A4
18
16
14
12
1Y1
1Y2
1Y3
1Y4
19
EN
2OE
11
2A1
13
2A2
15
2A3
17
2A4
9
7
5
3
2Y1
2Y2
2Y3
2Y4
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
18
16
2
4
6
1Y1
1Y2
1A1
1A2
1A3
1A4
14
12
1Y3
1Y4
8
19
2OE
9
7
11
13
15
17
2Y1
2Y2
2A1
2A2
5
3
2Y3
2Y4
2A3
2A4
2
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SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–30
MAX
7
UNIT
V
VCC Supply voltage range
VI
Input voltage range(2)
7
V
II
Input current range
5
mA
V
VO
VO
Voltage range applied to any output in the disabled or power-off state
Voltage range applied to any output in the high state
Current into any output in the low state
Operating free-air temperature range(3)
–0.5
–0.5
5.5
VCC
96
V
mA
°C
°C
–55
–65
125
150
Tstg Storage temperature range
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The negative input voltage rating may be exceeded if the input clamp current rating is observed.
(3) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Recommended Operating Conditions
MIN
4.5
2
NOM
MAX
UNIT
V
VCC Supply voltage
5
5.5
VIH
VIL
High-level input voltage
Low-level input voltage
V
0.8
5.5
–18
48
V
VOH High-level output voltage
V
IIK
Input clamp current
mA
mA
°C
IOL
TA
Low-level output current
Operating free-air temperature
–55
125
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
II = –18 mA
MIN
TYP(1)
MAX UNIT
VIK
VOL
II
VCC = 4.5 V,
VCC = 4.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 5.5 V,
VCC = 4.5 V,
–1.2
0.55
0.1
20
V
IOL = 48 mA
VI = 7 V
0.38
V
mA
µA
mA
mA
IIH
VI = 2.7 V
VI = 0.5 V
VOH = 5.5 V
IIL
–1
IOH
0.1
33
Outputs high
Outputs low
OE disabled
21
48
6
ICC
VCC = 5.5 V,
Outputs open
76
mA
10
Ci
VCC = 5 V,
VCC = 5 V,
VI = 2.5 V or 0.5 V
VI = 2.5 V or 0.5 V
6
pF
pF
Co
10
(1) All typical values are at VCC = 5 V, TA = 25°C.
3
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SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
Switching Characteristics
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
FROM
PARAMETER
TO
(OUTPUT)
UNIT
TA = MIN to MAX(1)
(INPUT)
MIN
TYP
8
MAX
9.5
MIN
6.3
2.1
8.6
3.2
MAX
tPLH
6.3
2.1
8.6
3.2
11.1
7.7
Any A
Y
Y
ns
ns
tPHL
tPLH
4.3
13
6.5
15.2
8.9
18.7
10.4
OE
tPHL
6.2
(1) For conditions shown as MIN or MAX, use the appropriate values specified under recommended operating conditions.
SN74BCT760MDWREP Operating Life Derating Chart
1000
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
1
0.1
100
110
120
130
140
150
160
170
180
Continuous Tj (°C)
A. See datasheet for absolute maximum ratings and minimum recommended operating conditions.
B. Silicon operating life design goal is 10 years at 10°C junction temperature (does not include package interconnect
life).
C. Enhanced plastic product disclaimer applies.
4
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SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
V
CC
R
L
From Output
Under Test
Test
Point
C
L
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
3 V
0 V
Input
1.5 V
1.5 V
t
PHL
t
PLH
V
OH
OL
In-Phase
Output
1.5 V
1.5 V
1.5 V
V
t
PLH
t
PHL
V
V
OH
Out-of-Phase
Output
1.5 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. CL includes probe and jig capacitance.
B. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
5
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74BCT760MDWREP
V62/06672-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74BCT760-EP :
Catalog: SN74BCT760
Military: SN54BCT760
•
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
•
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74BCT760MDWREP
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 20
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
SN74BCT760MDWREP
2000
Pack Materials-Page 2
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