SN74CBT3125CDBQRE4 [TI]

QUADRUPLE FET BUS SWITCH 5-VBUS SWITCH WITH -2-V UNDERSHOOT PROTECTION; 与-2 -V冲保护翻两番FET总线开关5 VBUS开关
SN74CBT3125CDBQRE4
型号: SN74CBT3125CDBQRE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

QUADRUPLE FET BUS SWITCH 5-VBUS SWITCH WITH -2-V UNDERSHOOT PROTECTION
与-2 -V冲保护翻两番FET总线开关5 VBUS开关

开关
文件: 总15页 (文件大小:411K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
D
D
D
D
Undershoot Protection for Off-Isolation on  
A and B Ports Up To −2 V  
D
Control Inputs Can Be Driven by TTL or  
5-V/3.3-V CMOS Outputs  
Bidirectional Data Flow, With Near-Zero  
Propagation Delay  
D
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
Low ON-State Resistance (r  
)
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
on  
Characteristics (r = 3 Typical)  
on  
Low Input/Output Capacitance Minimizes  
Loading and Signal Distortion  
ESD Performance Tested Per JESD 22  
− 2000-V Human-Body Model  
(A114-B, Class II)  
(C  
= 5 pF Typical)  
io(OFF)  
− 1000-V Charged-Device Model (C101)  
D
D
Data and Control Inputs Provide  
Undershoot Clamp Diodes  
D
Supports Both Digital and Analog  
Applications: USB Interface, Bus Isolation,  
Low-Distortion Signal Gating  
Low Power Consumption  
(I  
= 3 µA Max)  
CC  
D
V
Operating Range From 4 V to 5.5 V  
CC  
D
Data I/Os Support 0 to 5-V Signaling Levels  
(0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)  
RGY PACKAGE  
(TOP VIEW)  
D, DB, DGV, OR PW PACKAGE  
(TOP VIEW)  
DBQ PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
4OE  
4A  
4B  
3OE  
3A  
3B  
NC  
1OE  
1A  
1B  
2OE  
2A  
1OE  
1A  
1B  
2OE  
2A  
2B  
V
CC  
4OE  
CC  
1
14  
4A  
4B  
3OE  
3A  
3B  
1A  
1B  
13 4OE  
12 4A  
2
3
4
5
6
11  
10  
9
2OE  
2A  
4B  
3OE  
3A  
8
2B  
GND  
GND  
2B  
NC  
7
8
NC − No internal connection  
description/ordering information  
The SN74CBT3125C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (r ),  
on  
allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the  
SN74CBT3125C provides protection for undershoot up to −2 V by sensing an undershoot event and ensuring  
that the switch remains in the proper OFF state.  
The SN74CBT3125C is organized as four 1-bit bus switches with separate output-enable (1OE, 2OE, 3OE,  
4OE) inputs. It can be used as four 1-bit bus switches or as one 4-bit bus switch. When OE is low, the associated  
1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports.  
When OE is high, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A  
and B ports.  
This device is fully specified for partial-power-down applications using I . The I feature ensures that  
off  
off  
damaging current will not backflow through the device when it is powered down. The device has isolation during  
power off.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢆꢦ  
Copyright 2003, Texas Instruments Incorporated  
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢰ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢫ  
1
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ꢊꢗ ꢘ ꢅ ꢌ ꢀ ꢀꢔ ꢕ ꢆ ꢄꢖ ꢔ ꢕ ꢆꢖ ꢙ ꢉ ꢗꢘ ꢌꢁ ꢎꢒ ꢏꢀ ꢖꢚ ꢚ ꢆ ꢐꢏ ꢚꢆ ꢒꢄꢆ ꢕ ꢚ ꢁ  
SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
description/ordering information (continued)  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
QFN − RGY  
SOIC − D  
Tape and reel SN74CBT3125CRGYR  
CU125C  
Tube  
SN74CBT3125CD  
CBT3125C  
Tape and reel  
Tube  
SN74CBT3125CDR  
SN74CBT3125CDB  
SN74CBT3125CDBR  
SN74CBT3125CDBQR  
SN74CBT3125CPW  
SN74CBT3125CPWR  
SN74CBT3125CDGVR  
SSOP − DB  
CU125C  
CU125C  
−40°C to 85°C  
Tape and reel  
SSOP (QSOP) − DBQ Tape and reel  
Tube  
TSSOP − PW  
CU125C  
CU125C  
Tape and reel  
TVSOP − DGV  
Tape and reel  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
FUNCTION TABLE  
(each bus switch)  
INPUT INPUT/OUTPUT  
FUNCTION  
OE  
L
A
B
Z
A port = B port  
Disconnect  
H
logic diagram (positive logic)  
2
3
8
5
6
1A  
1B  
3B  
SW  
2A  
2B  
4B  
SW  
SW  
1
4
1OE  
2OE  
12  
11  
9
3A  
4A  
SW  
13  
10  
4OE  
3OE  
Pin numbers shown are for the D, DB, DGV, PW, and RGY packages.  
2
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ꢆꢄ  
SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
simplified schematic, each FET switch (SW)  
A
B
Undershoot  
Protection Circuit  
EN  
EN is the internal enable signal applied to the switch.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Control input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
Switch I/O voltage range, V (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
Control input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IN  
I/O  
IK IN  
I/O port clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
I/OK I/O  
ON-state switch current, I (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Continuous current through V  
I/O  
or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
CC  
Package thermal impedance, θ (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W  
JA  
(see Note 5): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W  
(see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W  
(see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W  
(see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W  
(see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltages are with respect to ground unless otherwise specified.  
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
3. V and V are used to denote specific conditions for V  
.
I
O
I/O  
4. I and I are used to denote specific conditions for I .  
I
O
I/O  
5. The package thermal impedance is calculated in accordance with JESD 51-7.  
6. The package thermal impedance is calculated in accordance with JESD 51-5.  
recommended operating conditions (see Note 7)  
MIN  
4
MAX  
5.5  
5.5  
0.8  
5.5  
85  
UNIT  
V
V
V
V
V
Supply voltage  
CC  
High-level control input voltage  
Low-level control input voltage  
Data input/output voltage  
Operating free-air temperature  
2
V
IH  
0
V
IL  
0
V
I/O  
T
A
−40  
°C  
NOTE 7: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
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SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
Control inputs  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
V
V
V
V
V
V
V
V
= 4.5 V,  
= 5 V,  
I = −18 mA  
IN  
−1.8  
V
IK  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
0 mA > I −50 mA,  
I
Data inputs  
Switch OFF  
Switch OFF,  
−2  
1
V
IKU  
V
V
V
= V  
or GND,  
IN  
IN  
O
CC  
I
I
I
I
Control inputs  
= 5.5 V,  
= 5.5 V,  
= 0,  
= V  
or GND  
µA  
µA  
µA  
µA  
IN  
CC  
= 0 to 5.5 V,  
10  
10  
3
OZ  
off  
V = 0,  
V
= V or GND  
CC  
I
IN  
V = 0  
V
O
= 0 to 5.5 V,  
= 0,  
= V or GND,  
CC  
I
I
V
I/O  
IN  
= 5.5 V,  
Switch ON or OFF  
CC  
§
I  
Control inputs  
Control inputs  
V
V
V
V
V
= 5.5 V,  
One input at 3.4 V,  
Other inputs at V  
CC  
or GND  
2.5  
mA  
pF  
pF  
pF  
CC  
C
C
C
= 3 V or 0  
= 3 V or 0,  
= 3 V or 0,  
3
5
in  
IN  
Switch OFF,  
Switch ON,  
V
V
= V  
= V  
or GND  
or GND  
io(OFF)  
io(ON)  
I/O  
I/O  
CC  
IN  
CC  
12.5  
8
IN  
CC  
= 4 V,  
V = 2.4 V,  
I
O
= −15 mA  
12  
I
TYP at V  
CC  
= 4 V  
I
O
I
O
I
O
= 64 mA  
= 30 mA  
= −15 mA  
3
3
5
6
6
r
on  
V = 0  
I
V
CC  
= 4.5 V  
V = 2.4 V,  
I
10  
V
§
and I refer to control inputs. V , V , I , and I refer to data pins.  
IN  
IN  
I
O
I
O
All typical values are at V  
= 5 V (unless otherwise noted), T = 25°C.  
CC  
A
For I/O ports, the parameter I  
includes the input leakage current.  
OZ  
This is the increase in supply current for each input that is at the specified voltage level, rather than V  
or GND.  
CC  
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by  
the lower of the voltages of the two (A or B) terminals.  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (see Figure 3)  
V
= 5 V  
CC  
0.5 V  
V
= 4 V  
CC  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
#
t
t
t
A or B  
OE  
B or A  
A or B  
A or B  
0.24  
4.4  
0.15  
4
ns  
ns  
ns  
pd  
en  
1.5  
1.5  
4.4  
4.4  
OE  
dis  
#
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,  
when driven by an ideal voltage source (zero output impedance).  
4
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ꢆꢄ  
SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
undershoot characteristics (see Figures 1 and 2)  
TYP  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
V
V
CC  
= 5.5 V,  
Switch OFF,  
V
IN  
= V  
or GND  
2
V
OH  
−0.3  
V
OUTU  
CC  
All typical values are at V  
= 5 V (unless otherwise noted), T = 25°C.  
CC  
A
V
CC  
11 V  
100 kΩ  
5.5 V  
Input  
(Open  
Socket)  
Input  
Generator  
90 %  
10 %  
90 %  
10 %  
50 Ω  
2 ns 2 ns  
20 ns  
DUT  
Ax  
Bx  
−2 V  
100 kΩ  
10 pF  
V
S
Output  
V
OH  
V
OH  
(V  
OUTU  
)
− 0.3  
Figure 1. Device Test Setup  
Figure 2. Transient Input Voltage (V ) and Output  
I
Voltage (V  
) Waveforms  
OUTU  
(Switch OFF)  
5
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SCDS122A − JULY 2003 − REVISED OCTOBER 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Input Generator  
V
IN  
50 Ω  
50 Ω  
V
G1  
TEST CIRCUIT  
DUT  
7 V  
Open  
GND  
Input Generator  
50 Ω  
S1  
R
V
V
O
L
I
50 Ω  
V
G2  
C
R
L
L
(see Note A)  
S1  
V
I
V
C
R
V
CC  
TEST  
L
L
5 V 0.5 V  
4 V  
Open  
Open  
500 Ω  
500 Ω  
V
CC  
V
CC  
or GND  
or GND  
50 pF  
50 pF  
t
pd(s)  
5 V 0.5 V  
4 V  
7 V  
7 V  
500 Ω  
500 Ω  
GND  
GND  
50 pF  
50 pF  
0.3 V  
0.3 V  
t
/t  
PLZ PZL  
5 V 0.5 V  
4 V  
Open  
Open  
500 Ω  
500 Ω  
V
CC  
V
CC  
50 pF  
50 pF  
0.3 V  
0.3 V  
t
/t  
PHZ PZH  
Output  
Control  
(V  
3 V  
0 V  
1.5 V  
1.5 V  
)
IN  
t
t
PLZ  
PZL  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
Output  
Control  
3 V  
0 V  
1.5 V  
V
V
+ V  
1.5 V  
1.5 V  
OL  
(V  
IN  
)
V
OL  
(see Note B)  
t
t
PZH  
PHZ  
t
t
PLH  
PHL  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
V
OH  
− V  
OH  
1.5 V  
Output  
1.5 V  
1.5 V  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES (t  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
)
pd(s)  
C includes probe and jig capacitance.  
L
NOTES: A.  
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
are the same as t  
are the same as t  
.
.
PLZ  
PZL  
PLH  
PHZ  
PZH  
PHL  
dis  
en  
. The tpd propagation delay is the calculated RC time constant of the typical ON-state  
pd(s)  
resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).  
H. All parameters and waveforms are not applicable to all devices.  
Figure 3. Test Circuit and Voltage Waveforms  
6
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PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74CBT3125CD  
ACTIVE  
SOIC  
D
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74CBT3125CDB  
PREVIEW  
ACTIVE  
SSOP  
DB  
14  
16  
80  
TBD  
Call TI  
Call TI  
SN74CBT3125CDBQR  
SSOP/  
QSOP  
DBQ  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
SN74CBT3125CDBQRE4  
SN74CBT3125CDBR  
SN74CBT3125CDBRE4  
SN74CBT3125CDE4  
SN74CBT3125CDGVR  
SN74CBT3125CDGVRE4  
SN74CBT3125CDR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP/  
QSOP  
DBQ  
DB  
16  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
SSOP  
SSOP  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TVSOP  
TVSOP  
SOIC  
DGV  
DGV  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74CBT3125CDRE4  
SN74CBT3125CPW  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
QFN  
PW  
PW  
PW  
PW  
RGY  
RGY  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74CBT3125CPWE4  
SN74CBT3125CPWR  
SN74CBT3125CPWRE4  
SN74CBT3125CRGYR  
SN74CBT3125CRGYRG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
QFN  
1000  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Oct-2005  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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