SN74CBT3251DBQRE4 [TI]

1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER; 1 -OF- 8的FET用/解复用器


型号：	SN74CBT3251DBQRE4
厂家：	TEXAS INSTRUMENTS
描述：	1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER 1 -OF- 8的FET用/解复用器解复用器
文件：	总12页 (文件大小：363K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊ

ꢊ ꢋꢌ ꢍꢋ ꢎ ꢍ ꢏꢆ ꢐ ꢑꢒꢆ ꢓꢔ ꢒꢏ ꢕꢏꢖꢗ ꢘꢏꢐ ꢑꢒꢆꢓ ꢔ ꢒꢏ ꢕꢏ ꢖ

SCDS019L − MAY 1995 − REVISED JANUARY 2004

5-Ω Switch Connection Between Two Ports

TTL-Compatible Input Levels

D, DB, DBQ, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

GND

15 B5

14 B6

13 B7

12 B8

NC − No internal connection

description/ordering information

The SN74CBT3251 is a 1-of-8 high-speed TTL-compatible FET multiplexer/demultiplexer. The low on-state

resistance of the switch allows connections to be made with minimal propagation delay.

When output enable (OE) is low, the SN74CBT3251 is enabled. S0, S1, and S2 select one of the B outputs for

the A-input data.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

QFN − RGY

Tape and reel

SN74CBT3251RGYR

SN74CBT3251D

CU251

Tube

SOIC − D

CBT3251

Tape and reel

SN74CBT3251DR

SN74CBT3251DBR

SN74CBT3251DBQR

SN74CBT3251PW

SN74CBT3251PWR

SSOP − DB

CU251

−40°C to 85°C

SSOP (QSOP) − DBQ Tape and reel

Tube

TSSOP − PW

CU251

Tape and reel

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design

guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢊ

ꢊꢋ ꢌꢍ ꢋꢎ ꢍ ꢏꢆ ꢐ ꢑꢒꢆꢓ ꢔ ꢒ ꢏꢕ ꢏꢖ ꢗ ꢘꢏ ꢐꢑ ꢒꢆꢓ ꢔ ꢒꢏ ꢕꢏꢖ

SCDS019L − MAY 1995 − REVISED JANUARY 2004

FUNCTION TABLE

(each multiplexer/demultiplexer)

INPUTS

FUNCTION

A port = B1 port

A port = B2 port

A port = B3 port

A port = B4 port

A port = B5 port

A port = B6 port

A port = B7 port

A port = B8 port

Disconnect

logic diagram (positive logic)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈꢉ ꢊ

ꢊ ꢋꢌ ꢍꢋ ꢎ ꢍ ꢏꢆ ꢐ ꢑꢒꢆ ꢓꢔ ꢒꢏ ꢕꢏꢖꢗ ꢘꢏꢐ ꢑꢒꢆꢓ ꢔ ꢒꢏ ꢕꢏ ꢖ

SCDS019L − MAY 1995 − REVISED JANUARY 2004

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA

Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

I/O

Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W

(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W

(see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W

(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W

(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

3. The package thermal impedance is calculated in accordance with JESD 51-5.

recommended operating conditions (see Note 4)

MIN

MAX

UNIT

Supply voltage

5.5

High-level control input voltage

Low-level control input voltage

Operating free-air temperature

0.8

−40

°C

NOTE 4: All unused control inputs of the device must be held at V

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

‡

PARAMETER

TEST CONDITIONS

I = −18 mA

MIN TYP

MAX

−1.2

UNIT

= 4.5 V,

= 5.5 V,

V = 5.5 V or GND

µA

= 0,

V = V

I CC

or GND

∆I

Control inputs

One input at 3.4 V,

Other inputs at V

or GND

2.5

Control inputs V = 3 V or 0

3.5

17.5

A port

= 3 V or 0,

OE = V

io(OFF)

B port

= 4 V,

V = 2.4 V,

I = 15 mA

TYP at V

= 4 V

I = 64 mA

Ω

V = 0

I = 30 mA

= 4.5 V

V = 2.4 V,

I = 15 mA

‡

All typical values are at V

= 5 V (unless otherwise noted), T = 25°C.

This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V

or GND.

Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined

by the lower of the voltages of the two (A or B) terminals.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢊ

ꢊꢋ ꢌꢍ ꢋꢎ ꢍ ꢏꢆ ꢐ ꢑꢒꢆꢓ ꢔ ꢒ ꢏꢕ ꢏꢖ ꢗ ꢘꢏ ꢐꢑ ꢒꢆꢓ ꢔ ꢒꢏ ꢕꢏꢖ

SCDS019L − MAY 1995 − REVISED JANUARY 2004

switching characteristics over recommended operating free-air temperature range, C = 50 pF

(unless otherwise noted) (see Figure 1)

= 5 V

0.5 V

= 4 V

FROM

(INPUT)

(OUTPUT)

PARAMETER

UNIT

MIN

MAX

MIN

MAX

†

A or B

B or A

0.35

0.25

6.4

6.8

1.5

1.6

1.9

2.3

5.5

5.6

5.8

6.4

6.2

A or B

dis

A or B

†

The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when

driven by an ideal voltage source (zero output impedance).

PARAMETER MEASUREMENT INFORMATION

7 V

TEST

Open

GND

500 Ω

Open

7 V

From Output

Under Test

PLZ PZL

Open

PHZ PZH

= 50 pF

500 Ω

(see Note A)

3 V

0 V

Output

Control

1.5 V

LOAD CIRCUIT

PLZ

PZL

Output

Waveform 1

S1 at 7 V

3.5 V

3 V

0 V

1.5 V

Input

+ 0.3 V

1.5 V

(see Note B)

PHZ

PZH

PHL

PLH

Output

Waveform 2

S1 at Open

(see Note B)

− 0.3 V

1.5 V

Output

1.5 V

0 V

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

NOTES: A.

C includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.

D. The outputs are measured one at a time with one transition per measurement.

and t

PHL

are the same as t

dis

PLZ

PZL

PLH

PHZ

PZH

are the same as t

are the same as t .

H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

30-Aug-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SN74CBT3251D

ACTIVE

SOIC

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3251DBLE

SN74CBT3251DBQR

OBSOLETE

ACTIVE

SSOP

TBD

Call TI

SSOP/

QSOP

DBQ

2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

SN74CBT3251DBQRE4

SN74CBT3251DBR

SN74CBT3251DBRE4

SN74CBT3251DE4

SN74CBT3251DR

ACTIVE

SSOP/

QSOP

DBQ

2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

SSOP

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3251DRE4

SN74CBT3251PW

SOIC

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3251PWE4

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3251PWLE

SN74CBT3251PWR

OBSOLETE TSSOP

TBD

Call TI

ACTIVE

TSSOP

QFN

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3251PWRE4

SN74CBT3251RGYR

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

RGY

1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

30-Aug-2005

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

0,15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

0,25

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

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SN74CBT3251DBQRE4 [TI]

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