SN74CBT3345CDBRE4_技术文档

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SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

D

Undershoot Protection for Off-Isolation on

A and B Ports Up To −2 V

D

Control Inputs Can Be Driven by TTL or

5-V/3.3-V CMOS Outputs

Bidirectional Data Flow, With Near-Zero

Propagation Delay

D

I

Supports Partial-Power-Down Mode

off

Operation

Low ON-State Resistance (r

)

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

on

Characteristics (r = 3 Ω Typical)

on

Low Input/Output Capacitance Minimizes

Loading and Signal Distortion

ESD Performance Tested Per JESD 22

− 2000-V Human-Body Model

(A114-B, Class II)

(C

= 5.5 pF Typical)

io(OFF)

− 1000-V Charged-Device Model (C101)

D

Data and Control Inputs Provide

Undershoot Clamp Diodes

D

Supports Both Digital and Analog

Applications: USB Interface, Memory

Interleaving, Bus Isolation, Low-Distortion

Signal Gating

Low Power Consumption

(I

= 3 µA Max)

CC

D

V

Operating Range From 4 V to 5.5 V

CC

D

Data I/Os Support 0 to 5-V Signaling Levels

(0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)

DB, DBQ, DGV, DW, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

V

OE

A1

A2

A3

A4

A5

A6

A7

A8

CC

OE

B1

B2

B3

B4

B5

B6

B7

B8

1

20

19

18

17

16

15

14

13

12

2

3

4

5

6

7

8

9

A1

A2

A3

A4

A5

A6

A7

A8

OE

B1

B2

B3

B4

B5

B6

B7

GND

10

11

description/ordering information

The SN74CBT3345C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (r ),

on

allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the

SN74CBT3345C provides protection for undershoot up to −2 V by sensing an undershoot event and ensuring

that the switch remains in the proper OFF state.

The SN74CBT3345C is organized as an 8-bit bus switch with two output-enable (OE, OE) inputs. When OE

is high or OE is low, the bus switch is ON, and the A port is connected to the B port, allowing bidirectional data

flow between ports. When OE is low and OE is high, the bus switch is OFF and the high-impedance state exists

between the A and B ports.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Copyright  2003, Texas Instruments Incorporated

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1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢇ ꢃꢈ ꢄ

ꢉꢊ ꢅꢋ ꢆ ꢌ ꢍꢆ ꢅ ꢎ ꢀ ꢀ ꢏꢋ ꢆ ꢄꢐ

ꢈꢊ ꢑ ꢅ ꢎ ꢀ ꢀꢏ ꢋ ꢆ ꢄꢐ ꢏ ꢋ ꢆꢐ ꢒ ꢓ ꢊꢑ ꢎꢁ ꢔꢍ ꢕꢀ ꢐ ꢖꢖ ꢆ ꢗꢕꢖ ꢆ ꢍꢄ ꢆꢋ ꢖ ꢁ

SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

description/ordering information (continued)

This device is fully specified for partial-power-down applications using I . The I feature ensures that

off

damaging current will not backflow through the device when it is powered down. The device has isolation during

power off.

To ensure the high-impedance state during power up or power down, OE should be tied to V

through a pullup

CC

resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is

determined by the current-sinking/current-sourcing capability of the driver.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

T

A

QFN − RGY

SOIC − DW

Tape and reel

SN74CBT3345CRGYR

SN74CBT3345CDW

SN74CBT3345CDWR

SN74CBT3345CDB

SN74CBT3345CDBR

SN74CBT3345CDBQR

SN74CBT3345CPW

SN74CBT3345CPWR

SN74CBT3345CDGVR

CU345C

Tube

CBT3345C

Tape and reel

Tube

SSOP − DB

CU345C

−40°C to 85°C

Tape and reel

Tube

SSOP (QSOP) − DBQ

CBT3345C

TSSOP − PW

TVSOP − DGV

CU345C

Tape and reel

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

FUNCTION TABLE

INPUTS

INPUT/OUTPUT

A

FUNCTION

OE

X

H

X

L

B

Z

A port = B port

Disconnect

L

H

logic diagram (positive logic)

2

9

18

A1

B1

SW

11

A8

B8

SW

1

OE

19

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

simplified schematic, each FET switch (SW)

A

B

Undershoot

Protection Circuit

†

EN

†

EN is the internal enable signal applied to the switch.

‡

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

CC

Control input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

Switch I/O voltage range, V (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V

Control input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

IN

I/O

IK IN

I/O port clamp current, I

(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

I/OK I/O

ON-state switch current, I (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA

Continuous current through V

I/O

or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

CC

Package thermal impedance, θ (see Note 5): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W

JA

(see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W

(see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W

(see Note 5): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W

(see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W

(see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

‡

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltages are with respect to ground unless otherwise specified.

2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

3. V and V are used to denote specific conditions for V

.

I

O

I/O

4. I and I are used to denote specific conditions for I .

I

O

I/O

5. The package thermal impedance is calculated in accordance with JESD 51-7.

6. The package thermal impedance is calculated in accordance with JESD 51-5.

recommended operating conditions (see Note 7)

MIN

4

MAX

5.5

0.8

5.5

85

UNIT

V

Supply voltage

CC

High-level control input voltage

Low-level control input voltage

Data input/output voltage

Operating free-air temperature

2

V

IH

0

V

IL

0

V

I/O

T

A

−40

°C

NOTE 7: All unused control inputs of the device must be held at V

or GND to ensure proper device operation. Refer to the TI application report,

CC

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢉꢊ ꢅꢋ ꢆ ꢌ ꢍꢆ ꢅ ꢎ ꢀ ꢀ ꢏꢋ ꢆ ꢄꢐ

ꢈꢊ ꢑ ꢅ ꢎ ꢀ ꢀꢏ ꢋ ꢆ ꢄꢐ ꢏ ꢋ ꢆꢐ ꢒ ꢓ ꢊꢑ ꢎꢁ ꢔꢍ ꢕꢀ ꢐ ꢖꢖ ꢆ ꢗꢕꢖ ꢆ ꢍꢄ ꢆꢋ ꢖ ꢁ

SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

†

PARAMETER

Control inputs

TEST CONDITIONS

MIN TYP

MAX

UNIT

V

= 4.5 V,

= 5 V,

I = −18 mA

IN

−1.8

V

IK

CC

0 mA > I ≥ −50 mA,

I

Data inputs

Switch OFF

Switch OFF,

−2

1

V

IKU

V

= V

or GND,

IN

O

CC

I

Control inputs

= 5.5 V,

= 0,

= V

or GND

µA

IN

CC

= 0 to 5.5 V,

‡

10

3

OZ

off

V = 0,

V

= V or GND

CC

I

IN

V = 0

V

O

= 0 to 5.5 V,

= 0,

= V or GND,

CC

I

V

I/O

IN

= 5.5 V,

Switch ON or OFF

CC

§

∆I

Control inputs

V

= 5.5 V,

One input at 3.4 V,

Other inputs at V

CC

or GND

2.5

mA

pF

CC

C

= 3 V or 0

= 3 V or 0,

4

in

IN

Switch OFF,

Switch ON,

V

= V

or GND

5.5

14

io(OFF)

io(ON)

I/O

CC

IN

CC

IN

CC

= 4 V,

V = 2.4 V,

I

O

= −15 mA

8

12

I

TYP at V

CC

= 4 V

¶

I

O

I

O

I

O

= 64 mA

= 30 mA

= −15 mA

3

5

6

Ω

r

on

V = 0

I

V

CC

= 4.5 V

V = 2.4 V,

I

10

V

†

‡

§

¶

and I refer to control inputs. V , V , I , and I refer to data pins.

IN

I

O

I

O

All typical values are at V

= 5 V (unless otherwise noted), T = 25°C.

CC

A

For I/O ports, the parameter I

includes the input leakage current.

OZ

This is the increase in supply current for each input that is at the specified voltage level, rather than V

or GND.

CC

Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by

the lower of the voltages of the two (A or B) terminals.

switching characteristics over recommended operating free-air temperature range (unless

otherwise noted) (see Figure 3)

V

= 5 V

CC

0.5 V

V

= 4 V

CC

FROM

(INPUT)

TO

(OUTPUT)

PARAMETER

UNIT

MIN

MAX

MIN

MAX

#

t

A or B

B or A

A or B

0.24

5.3

0.15

4.9

ns

pd

en

1.5

OE or OE

5.8

5.7

dis

#

The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,

when driven by an ideal voltage source (zero output impedance).

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

undershoot characteristics (see Figures 1 and 2)

†

PARAMETER

TEST CONDITIONS

Switch OFF,

= 5 V (unless otherwise noted), T = 25°C.

MIN

TYP

MAX

UNIT

V

CC

= 5.5 V,

V

IN

= V

CC

or GND

2

V

−0.3

V

OUTU

OH

†

All typical values are at V

CC

A

V

CC

11 V

100 kΩ

5.5 V

Input

(Open

Socket)

Input

Generator

90 %

10 %

90 %

10 %

50 Ω

2 ns 2 ns

20 ns

DUT

Ax

Bx

−2 V

100 kΩ

10 pF

V

S

Output

V

OH

V

OH

(V

OUTU

)

− 0.3

Figure 1. Device Test Setup

Figure 2. Transient Input Voltage (V ) and Output

I

Voltage (V

) Waveforms

OUTU

(Switch OFF)

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢈꢊ ꢑ ꢅ ꢎ ꢀ ꢀꢏ ꢋ ꢆ ꢄꢐ ꢏ ꢋ ꢆꢐ ꢒ ꢓ ꢊꢑ ꢎꢁ ꢔꢍ ꢕꢀ ꢐ ꢖꢖ ꢆ ꢗꢕꢖ ꢆ ꢍꢄ ꢆꢋ ꢖ ꢁ

SCDS129A − SEPTEMBER 2003 − REVISED OCTOBER 2003

PARAMETER MEASUREMENT INFORMATION

V

CC

Input Generator

V

IN

50 Ω

V

G1

TEST CIRCUIT

DUT

7 V

Open

GND

Input Generator

50 Ω

S1

R

V

O

L

I

50 Ω

V

G2

C

R

L

(see Note A)

S1

V

I

V

∆

C

R

V

CC

TEST

L

5 V 0.5 V

4 V

Open

500 Ω

V

CC

V

CC

or GND

50 pF

t

pd(s)

5 V 0.5 V

4 V

7 V

500 Ω

GND

50 pF

0.3 V

t

/t

PLZ PZL

5 V 0.5 V

4 V

Open

500 Ω

V

CC

V

CC

50 pF

0.3 V

t

/t

PHZ PZH

Output

Control

(V

3 V

0 V

1.5 V

)

IN

t

PLZ

PZL

Output

Waveform 1

S1 at 7 V

3.5 V

Output

Control

3 V

0 V

1.5 V

V

+ V

1.5 V

OL

∆

(V

IN

)

V

OL

(see Note B)

t

PZH

PHZ

t

PLH

PHL

Output

Waveform 2

S1 at Open

(see Note B)

V

OH

V

OH

− V

OH

∆

1.5 V

Output

1.5 V

0 V

OL

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES (t

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

)

pd(s)

C includes probe and jig capacitance.

L

NOTES: A.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.

O

r

f

D. The outputs are measured one at a time with one transition per measurement.

E.

F.

G.

t

and t

are the same as t

.

PLZ

PZL

PLH

PHZ

PZH

PHL

dis

en

. The tpd propagation delay is the calculated RC time constant of the typical ON-state

pd(s)

resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

H. All parameters and waveforms are not applicable to all devices.

Figure 3. Test Circuit and Voltage Waveforms

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2006

PACKAGING INFORMATION

Orderable Device

SN74CBT3345CDBQR

SN74CBT3345CDBQRE4

SN74CBT3345CDBQRG4

SN74CBT3345CDBR

SN74CBT3345CDBRE4

SN74CBT3345CDGVR

SN74CBT3345CDGVRE4

SN74CBT3345CDW

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SSOP/

QSOP

DBQ

20

2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

SSOP/

QSOP

DBQ

DB

2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

SSOP/

QSOP

2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

SSOP

TVSOP

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DGV

DW

PW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3345CDWE4

SN74CBT3345CDWR

SN74CBT3345CDWRE4

SN74CBT3345CPW

SOIC

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

QFN

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74CBT3345CPWE4

SN74CBT3345CPWR

SN74CBT3345CPWRE4

SN74CBT3345CRGYR

SN74CBT3345CRGYRG4

PW

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

PW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

PW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

RGY

1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

QFN

1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2006

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000

DGV (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

24 PINS SHOWN

0,23

0,13

M

0,07

0,40

24

13

0,16 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–ā8°

0,75

1

12

0,50

A

Seating Plane

0,08

0,15

0,05

1,20 MAX

PINS **

14

16

20

24

38

48

56

DIM

A MAX

A MIN

3,70

3,50

3,70

3,50

5,10

4,90

5,10

4,90

7,90

7,70

9,80

9,60

11,40

11,20

4073251/E 08/00

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.

D. Falls within JEDEC: 24/48 Pins – MO-153

14/16/20/56 Pins – MO-194

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

28

M

0,15

15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

1

14

0,25

A

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

14

16

20

24

28

30

38

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Low Power Wireless www.ti.com/lpw

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265


型号：	SN74CBT3345CDBRE4
厂家：	TEXAS INSTRUMENTS
描述：	8-BIT FET BUS SWITCH 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION 8位FET总线开关5 -V总线-2 -V冲保护开关总线驱动器总线收发器开关逻辑集成电路光电二极管
文件：	总17页 (文件大小：619K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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