SN74CBT3861DGVRE4 [TI]
10-BIT FET BUS SWITCH; 10位FET总线开关
| 型号： | SN74CBT3861DGVRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-BIT FET BUS SWITCH |
| 文件： | 总10页 (文件大小：258K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74CBT3861
10-BIT FET BUS SWITCH
SCDS061D – APRIL 1998 – REVISED OCTOBER 2000
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
Latch-Up Performance Exceeds 250 mA Per
JESD 17
NC
A1
A2
A3
A4
A5
A6
A7
A8
V
CC
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
OE
B1
B2
B3
B4
B5
B6
B7
description
The SN74CBT3861 provides ten bits of
high-speed TTL-compatible bus switching. The
low on-state resistance of the switch allows
connections to be made with minimal propagation
delay.
A9 10
15 B8
The device is organized as one 10-bit switch with
a single output-enable (OE) input. When OE is
low, the switch is on, and port A is connected to
port B. When OE is high, the switch is open, and
the high-impedance state exists between the two
ports.
A10
GND
B9
B10
11
12
14
13
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN74CBT3861DW
SOIC – DW
CBT3861
Tape and reel SN74CBT3861DWR
Tape and reel SN74CBT3861DBQR
Tape and reel SN74CBT3861PWR
Tape and reel SN74CBT3861DGVR
–40°C to 85°C
SSOP (QSOP) – DBQ
TSSOP – PW
CBT3861
CU861
TVSOP – DGV
CU861
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
logic diagram (positive logic)
2
22
13
A1
A10
OE
B1
11
23
B10
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT3861
10-BIT FET BUS SWITCH
SCDS061D – APRIL 1998 – REVISED OCTOBER 2000
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
IK I/O
Package thermal impedance, θ (see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
JA
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
4
MAX
UNIT
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
2
V
0.8
85
V
T
A
–40
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
‡
PARAMETER
TEST CONDITIONS
I = –18 mA
MIN TYP
MAX
–1.2
±1
UNIT
V
V
V
V
V
V
= 4.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
IK
CC
CC
CC
CC
I
I
I
V = 5.5 V or GND
I
µA
µA
mA
pF
I
I
O
= 0,
V = V
I
or GND
3
CC
CC
§
∆I
CC
Control inputs
One input at 3.4 V,
Other inputs at V
or GND
2.5
CC
C
C
Control inputs V = 3 V or 0
3
5
i
I
V
O
= 3 V or 0,
OE = V
pF
io(OFF)
CC
V
= 4 V,
CC
V = 2.4 V,
I
I = 15 mA
I
14
22
TYP at V
= 4 V
CC
¶
I = 64 mA
I
5
5
7
7
Ω
r
on
V = 0
I
V
CC
= 4.5 V
I = 30 mA
I
V = 2.4 V,
I
I = 15 mA
I
10
15
‡
§
¶
All typical values are at V
= 5 V (unless otherwise noted), T = 25°C.
A
CC
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
or GND.
CC
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74CBT3861
10-BIT FET BUS SWITCH
SCDS061D – APRIL 1998 – REVISED OCTOBER 2000
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
V
= 5 V
CC
± 0.5 V
V
= 4 V
FROM
(INPUT)
TO
(OUTPUT)
CC
PARAMETER
UNIT
MIN
MAX
MIN
MAX
0.25
7.5
†
t
t
t
A or B
OE
B or A
A or B
A or B
0.35
8.1
ns
ns
ns
pd
3.8
3.4
en
6.3
6.6
OE
dis
†
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
7 V
TEST
S1
S1
Open
GND
500 Ω
t
Open
7 V
pd
/t
From Output
Under Test
t
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
V
+ 0.3 V
OL
(see Note B)
V
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
V
OH
V
OH
– 0.3 V
1.5 V
Output
1.5 V
1.5 V
0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
are the same as t
are the same as t
.
dis
en
.
pd
PLZ
PZL
PLH
PHZ
PZH
PHL
.
Figure 1. Load Circuit and Voltage Waveforms
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
SN74CBT3861DBQR
SN74CBT3861DBQRE4
SN74CBT3861DBQRG4
SN74CBT3861DGVR
SN74CBT3861DGVRE4
SN74CBT3861DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP/
QSOP
DBQ
24
24
24
24
24
24
24
24
24
24
24
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
DGV
DGV
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
TVSOP
TVSOP
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT3861DWE4
SN74CBT3861DWR
SN74CBT3861DWRE4
SN74CBT3861PWR
SN74CBT3861PWRE4
SOIC
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
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Copyright 2006, Texas Instruments Incorporated
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