SN74CBTLV16235DGGR [TI]
CBTLV/3B SERIES, 18 1 LINE TO 2 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO64, PLASTIC, TSSOP-64;![SN74CBTLV16235DGGR](http://pdffile.icpdf.com/pdf1/p00114/img/icpdf/SN74CBTLV16235_621983_icpdf.jpg)
型号: | SN74CBTLV16235DGGR |
厂家: | ![]() |
描述: | CBTLV/3B SERIES, 18 1 LINE TO 2 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO64, PLASTIC, TSSOP-64 解复用器 |
文件: | 总8页 (文件大小:140K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ ꢍ
ꢇꢎ ꢏꢐꢈ ꢎꢇꢆꢑꢒ ꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐ ꢋ ꢖ ꢓꢆ ꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆꢕ ꢙ ꢇꢓ ꢚꢓ ꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
DGG PACKAGE
(TOP VIEW)
D
D
D
D
4-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
I
Supports Partial-Power-Down Mode
1A
2B1
2B2
3A
1B1
1B2
2A
3B1
3B2
4A
off
1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Operation
2
Break-Before-Make Feature
3
4
description/ordering information
4B1
4B2
5A
6B1
6B2
7A
8B1
8B2
GND
5
6
The SN74CBTLV16235 is an 18-bit 1-of-2 FET
multiplexer/demultiplexer used in applications in
which two separate data paths must be
multiplexed onto, or demultiplexed from, a single
path. This device can be used for memory
interleaving, where two different banks of memory
need to be addressed simultaneously.
5B1
5B2
6A
7B1
7B2
8A
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
GND
VCC
9B1
9B2
10A
11B1
11B2
12A
13B1
13B2
14A
15B1
15B2
16A
17B1
17B2
18A
GND
S0
The device is organized as a dual 9-bit 1-of-2
multiplexer/demultiplexer with separate control
inputs. It can be used as two 9-bit
multiplexers/demultiplexers or as one 18-bit
multiplexer/demultiplexer. Two select (S0 and S1)
inputs control the data flow. When the test (T0 and
T1) inputs are asserted, port A is connected to
both ports B1 and B2. The control inputs can be
driven with a low-voltage TTL or an SSTL_3
driver.
V
CC
9A
10B1
10B2
11A
12B1
12B2
13A
14B1
14B2
15A
16B1
16B2
17A
The SN74CBTLV16235 is specified by the
break-before-make design to have no through
current when switching directions.
This
device
is
fully
specified
for
18B1
18B2
GND
T0
partial-power-down applications using I . The I
off
off
feature ensures that damaging current will not
backflow through the device when it is powered
down. The device has isolation during power off.
T1
S1
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
−40°C to 85°C TSSOP − DGG Tape and reel
SN74CBTLV16235GR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢙ
ꢛ
ꢎ
ꢝ
ꢘ
ꢄ
ꢆ
ꢙ
ꢛ
ꢓ
ꢈ
ꢕ
ꢓ
ꢏ
ꢞ
ꢟ
ꢠ
ꢡ
ꢢ
ꢣ
ꢤ
ꢥ
ꢞ
ꢡ
ꢟ
ꢦ
ꢡ
ꢟ
ꢦ
ꢧ
ꢢ
ꢟ
ꢨ
ꢩ
ꢢ
ꢡ
ꢪ
ꢫ
ꢪꢧ ꢨ ꢞ ꢮꢟ ꢩꢬ ꢤ ꢨ ꢧ ꢡꢠ ꢪꢧ ꢭ ꢧ ꢯꢡ ꢩꢣꢧ ꢟꢥꢰ ꢄ ꢬꢤ ꢢꢤ ꢦꢥ ꢧꢢ ꢞꢨ ꢥꢞ ꢦ ꢪꢤ ꢥꢤ ꢤꢟ ꢪ ꢡꢥ ꢬꢧꢢ
ꢦ
ꢥ
ꢨ
ꢞ
ꢟ
ꢥ
ꢬ
ꢧ
ꢠ
ꢡ
ꢢ
ꢣ
ꢤ
ꢥ
ꢞ
ꢭ
ꢧ
ꢡ
ꢢ
Copyright 2003, Texas Instruments Incorporated
ꢨ
ꢩ
ꢧ
ꢦ
ꢞ
ꢠ
ꢞ
ꢦ
ꢤ
ꢥ
ꢞ
ꢡ
ꢟ
ꢨ
ꢤ
ꢢ
ꢧ
ꢪ
ꢧ
ꢨ
ꢞ
ꢮ
ꢟ
ꢮ
ꢡ
ꢤ
ꢯ
ꢨ
ꢰ
ꢆ
ꢧ
ꢱ
ꢤ
ꢨ
ꢕ
ꢟ
ꢨ
ꢥ
ꢢ
ꢫ
ꢣ
ꢧ
ꢟ
ꢦ ꢬꢤ ꢟ ꢮꢧ ꢡꢢ ꢪꢞ ꢨ ꢦ ꢡꢟ ꢥꢞ ꢟꢫꢧ ꢥ ꢬꢧ ꢨ ꢧ ꢩꢢ ꢡꢪ ꢫꢦꢥ ꢨ ꢲ ꢞꢥꢬ ꢡꢫꢥ ꢟꢡꢥ ꢞꢦꢧ ꢰ
ꢥ
ꢨ
ꢢ
ꢧ
ꢨ
ꢧ
ꢢ
ꢭ
ꢧ
ꢨ
ꢥ
ꢬ
ꢧ
ꢢ
ꢞ
ꢮ
ꢬ
ꢥ
ꢥ
ꢡ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ ꢍ
ꢇ ꢎꢏꢐꢈ ꢎꢇꢆꢑ ꢒꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐꢋ ꢖꢓ ꢆ ꢗꢘ ꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
FUNCTION TABLE
(each 9-bit multiplexer/demultiplexer)
INPUTS
FUNCTION
T
L
S
L
A port = B1 port
A port = B2 port
L
H
X
H
A port = B1 port = B2 port
logic diagram (positive logic)
64
1
SW
1A
1B1
1B2
63
SW
15
50
49
SW
9A
9B1
9B2
SW
34
S0
31
T0
16
17
48
SW
10A
10B1
10B2
SW
36
28
29
SW
18A
18B1
18B2
SW
33
S1
32
T1
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ ꢍ
ꢇꢎ ꢏꢐꢈ ꢎꢇꢆꢑꢒ ꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐ ꢋ ꢖ ꢓꢆ ꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆꢕ ꢙ ꢇꢓ ꢚꢓ ꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
simplified schematic, each FET switch
A
B
(OE)
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK
I
Package thermal impedance, θ (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W
JA
stg
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
2.3
1.7
2
MAX
UNIT
V
V
Supply voltage
3.6
V
CC
V
CC
V
CC
V
CC
V
CC
= 2.3 V to 2.7 V
= 2.7 V to 3.6 V
= 2.3 V to 2.7 V
= 2.7 V to 3.6 V
High-level control input voltage
V
IH
0.7
0.8
85
V
IL
Low-level control input voltage
Operating free-air temperature
V
T
A
−40
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to TI application report
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ ꢍ
ꢇ ꢎꢏꢐꢈ ꢎꢇꢆꢑ ꢒꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐꢋ ꢖꢓ ꢆ ꢗꢘ ꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
I = −18 mA
MIN TYP
MAX
−1.2
5
UNIT
V
V
V
V
V
V
V
= 3 V,
IK
CC
CC
CC
CC
CC
I
I
I
I
= 3.6 V,
= 0,
V = V
I CC
or GND
µA
µA
µA
µA
pF
I
V or V = 0 to 3.6 V
10
off
I
O
= 3.6 V,
= 3.6 V,
I
O
= 0,
V = V
I CC
or GND
10
CC
‡
∆I
CC
Control input
One input at 3 V,
Other inputs at V
CC
or GND
300
C
Control input
A port
V = 3 V or 0
I
i
C
V
O
= 3 V or 0
pF
io(OFF)
B port
I = 64 mA
I
V = 0
I
V
= 2.3 V,
CC
I = 24 mA
I
TYP at V
CC
= 2.5 V
V = 1.7 V,
I
I = 15 mA
I
§
on
Ω
r
I = 64 mA
I
V = 0
I
V
CC
= 3 V
I = 24 mA
I
V = 2.4 V,
I
I = 15 mA
I
†
‡
§
All typical values are at V
CC
= 3.3 V (unless otherwise noted), T = 25°C.
This is the increase in supply current for each input that is at the specified voltage level, rather than V
A
or GND.
CC
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
V
= 2.5 V
V
= 3.3 V
CC
0.2 V
CC
0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN MAX
MIN MAX
¶
t
pd
A or B
B or A
ns
t
S
S
A or B
A or B
ns
ns
en
t
dis
t
T
T
A or B
A or B
ns
ns
en
t
dis
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ ꢍ
ꢇꢎ ꢏꢐꢈ ꢎꢇꢆꢑꢒ ꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐ ꢋ ꢖ ꢓꢆ ꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆꢕ ꢙ ꢇꢓ ꢚꢓ ꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
S1
S1
t
/t
Open
Open
R
PLH PHL
L
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
GND
t
/t
PHZ PZH
C
L
R
L
(see Note A)
C
V
∆
R
V
CC
L
L
2.5 V 0.2 V
3.3 V 0.3 V
500 Ω
500 Ω
0.15 V
0.3 V
30 pF
50 pF
LOAD CIRCUIT
V
CC
Timing Input
V
CC
/2
0 V
t
w
t
t
h
su
V
CC
V
CC
V
CC
/2
V
CC
/2
Input
V
CC
/2
V
CC
/2
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V
CC
/2
V
CC
/2
V
CC
/2
V
/2
Input
CC
0 V
V
0 V
t
t
t
t
t
PZL
PLZ
+ V
PHL
PLH
Output
Waveform 1
V
V
OH
CC
V
V
/2
/2
V
CC
/2
V
CC
/2
/2
Output
CC
S1 at 2 × V
(see Note B)
CC
V
OL
∆
V
OL
OL
t
t
t
PHL
PLH
/2
PZH
PHZ
− V
Output
Waveform 2
S1 at GND
V
V
V
OH
OH
V
OH
∆
V
CC
V
CC
CC
Output
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2 ns, t ≤ 2 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
.
PLZ
PZL
PLH
PHZ
PZH
PHL
dis
are the same as t
en
are the same as t .
pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74CBTLV16235GR
PREVIEW
TSSOP
DGG
64
2000
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号:
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_2.jpg)
SN74CBTLV16292
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_2.jpg)
SN74CBTLV16292DGG
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf2/p00285/img/page/SN74CBTLV162_1709550_files/SN74CBTLV162_1709550_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00285/img/page/SN74CBTLV162_1709550_files/SN74CBTLV162_1709550_2.jpg)
SN74CBTLV16292DGGR
CBTLV/3B SERIES, 12 1 LINE TO 2 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO56, TSSOP-56
TI
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_2.jpg)
SN74CBTLV16292DGV
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf2/p00285/img/page/SN74CBTLV162_1709550_files/SN74CBTLV162_1709550_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00285/img/page/SN74CBTLV162_1709550_files/SN74CBTLV162_1709550_2.jpg)
SN74CBTLV16292DGVR
CBTLV/3B SERIES, 12 1 LINE TO 2 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO56, TVSOP-56
TI
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00061/img/page/SN74CBTLV16292_321959_files/SN74CBTLV16292_321959_2.jpg)
SN74CBTLV16292DL
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_2.jpg)
SN74CBTLV16292DLR
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_2.jpg)
SN74CBTLV16292GR
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621984_files/SN74CBTLV16292_621984_2.jpg)
SN74CBTLV16292VR
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS
TI
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621985_files/SN74CBTLV16292_621985_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621985_files/SN74CBTLV16292_621985_2.jpg)
SN74CBTLV16292_07
LOW-VOLTAGE 12-BIT OF-2 FET MILTIP LEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISRORS
TI
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621986_files/SN74CBTLV16292_621986_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00114/img/page/SN74CBTLV16292_621986_files/SN74CBTLV16292_621986_2.jpg)
SN74CBTLV16292_08
LOW-VOLTAGE 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTOR
TI
©2020 ICPDF网 联系我们和版权申明