SN74CBTLV3861-Q1_15 [TI]

LOW-VOLTAGE 10-BIT FET BUS SWITCH;
SN74CBTLV3861-Q1_15
型号: SN74CBTLV3861-Q1_15
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-VOLTAGE 10-BIT FET BUS SWITCH

文件: 总7页 (文件大小:124K)
中文:  中文翻译
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ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢈ ꢉꢊ ꢋꢌ ꢍꢎ ꢌ  
ꢇ ꢏꢐꢍꢈꢏ ꢇꢆꢑꢒ ꢓ ꢌ ꢔ ꢍꢅꢕ ꢆ ꢖ ꢓꢆ ꢅꢗ ꢀ ꢀ ꢐꢕ ꢆꢄ ꢘ  
SCDS160A − MARCH 2004 − REVISED MAY 2004  
DW OR PW PACKAGE  
(TOP VIEW)  
D
Qualification in Accordance With  
AEC-Q100  
D
Qualified for Automotive Applications  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
NC  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
V
CC  
D
Customer-Specific Configuration Control  
Can Be Supported Along With  
Major-Change Approval  
2
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
B10  
3
4
5
D
D
D
D
D
5-Switch Connection Between Two Ports  
Rail-to-Rail Switching on Data I/O Ports  
6
7
I
Supports Partial-Power-Down Mode  
off  
8
Operation  
9
Flowthrough Architecture Optimizes PCB  
Layout  
10  
11  
12  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
GND  
NC − No internal connection  
Contact factory for details. Q100 qualification data available on  
request.  
description/ordering information  
The SN74CBTLV3861 provides ten bits of high-speed bus switching. The low on-state resistance of the switch  
allows connections to be made with minimal propagation delay.  
The device is organized as one 10-bit bus switch. When output enable (OE) is low, the 10-bit bus switch is on,  
and port A is connected to port B. When OE is high, the switch is open, and the high-impedance state exists  
between the two ports.  
This device is fully specified for partial-power-down applications using I . The I feature ensures that  
off  
off  
damaging current will not backflow through the device when it is powered down. The device has isolation during  
power off.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
SOIC − DW  
Tape and reel  
Tape and reel  
CCBTLV3861IDWRQ1  
CCBTLV3861IPWRQ1  
CL3861Q1  
CL3861Q1  
−40°C to 85°C  
TSSOP − PW  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
FUNCTION TABLE  
INPUT  
FUNCTION  
OE  
L
A port = B port  
Disconnect  
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2004, Texas Instruments Incorporated  
ꢙꢠ ꢟ ꢫꢦꢥ ꢣ ꢤ ꢥ ꢟꢝ ꢞꢟ ꢠ ꢡ ꢣ ꢟ ꢤ ꢨꢧ ꢥ ꢜꢞ ꢜꢥꢢ ꢣꢜ ꢟꢝꢤ ꢨꢧ ꢠ ꢣꢭ ꢧ ꢣꢧ ꢠ ꢡꢤ ꢟꢞ ꢆꢧꢮ ꢢꢤ ꢕꢝꢤ ꢣꢠ ꢦꢡ ꢧꢝꢣ ꢤ  
ꢤ ꢣ ꢢ ꢝꢫ ꢢ ꢠꢫ ꢯ ꢢ ꢠꢠ ꢢ ꢝ ꢣꢰꢬ ꢙꢠ ꢟ ꢫꢦꢥ ꢣꢜꢟꢝ ꢨꢠ ꢟꢥ ꢧꢤ ꢤꢜ ꢝꢱ ꢫꢟꢧ ꢤ ꢝꢟꢣ ꢝꢧ ꢥꢧ ꢤꢤ ꢢꢠ ꢜꢪ ꢰ ꢜꢝꢥ ꢪꢦꢫ ꢧ  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢱ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢬ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ ꢍꢎ ꢌ  
ꢇ ꢏꢐꢍꢈ ꢏꢇꢆꢑ ꢒꢓ ꢌ ꢔ ꢍꢅꢕ ꢆ ꢖꢓ ꢆ ꢅꢗ ꢀ ꢀ ꢐꢕ ꢆ ꢄꢘ  
SCDS160A − MARCH 2004 − REVISED MAY 2004  
logic diagram (positive logic)  
2
22  
13  
A1  
B1  
SW  
SW  
11  
23  
A10  
OE  
B10  
simplified schematic, each FET switch  
A
B
(OE)  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK I/O  
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W  
JA  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Storage temperature range, T  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢈ ꢉꢊ ꢋꢌ ꢍꢎ ꢌ  
ꢇ ꢏꢐꢍꢈꢏ ꢇꢆꢑꢒ ꢓ ꢌ ꢔ ꢍꢅꢕ ꢆ ꢖ ꢓꢆ ꢅꢗꢀ ꢀ ꢐꢕ ꢆꢄ ꢘ  
SCDS160A − MARCH 2004 − REVISED MAY 2004  
recommended operating conditions (see Note 3)  
MIN  
2.3  
1.7  
2
MAX  
UNIT  
V
V
Supply voltage  
3.6  
V
CC  
V
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
CC  
CC  
CC  
CC  
High-level control input voltage  
V
IH  
V
V
V
0.7  
0.8  
85  
V
IL  
Low-level control input voltage  
Operating free-air temperature  
V
T
A
−40  
°C  
NOTE 3: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range T = −405C to  
A
855C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
I = −18 mA  
MIN TYP  
MAX  
−1.2  
1
UNIT  
V
V
IK  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3 V,  
I
I
I
I
= 3.6 V,  
= 0,  
V = V  
I CC  
or GND  
µA  
µA  
µA  
µA  
pF  
I
V or V = 0 to 3.6 V  
10  
off  
I
O
= 3.6 V,  
= 3.6 V,  
I
O
= 0,  
V = V  
I CC  
or GND  
10  
CC  
I  
CC  
Control inputs  
One input at 3 V,  
Other inputs at V  
CC  
or GND  
300  
C
C
Control inputs V = 3 V or 0  
3
5
5
5
i
I
V
O
= 3 V or 0,  
OE = V  
CC  
pF  
io(OFF)  
I = 64 mA  
8
8
I
V = 0  
I
V
= 2.3 V,  
CC  
I = 24 mA  
I
TYP at V  
CC  
= 2.5 V  
V = 1.7 V,  
I
I = 15 mA  
I
27  
5
40  
7
§
on  
r
I = 64 mA  
I
V = 0  
I
V
CC  
= 3 V  
I = 24 mA  
I
5
7
V = 2.4 V,  
I
I = 15 mA  
I
10  
15  
§
All typical values are at V  
This is the increase in supply current for each input that is at the specified voltage level, rather than V  
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by  
the lower of the voltages of the two (A or B) terminals.  
= 3.3 V (unless otherwise noted), T = 25°C.  
A
CC  
or GND.  
CC  
switching characteristics over recommended operating free-air temperature range T = −405C to  
A
855C (unless otherwise noted) (see Figure 1)  
V
= 2.5 V  
V
= 3.3 V  
CC  
0.3 V  
CC  
0.2 V  
FROM  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
(INPUT)  
MIN MAX  
MIN MAX  
t
t
t
A or B  
OE  
B or A  
A or B  
A or B  
0.15  
5.5  
0.25  
4.9  
ns  
ns  
ns  
pd  
en  
2.1  
1.7  
2.1  
2.5  
5.5  
5.8  
OE  
dis  
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when  
driven by an ideal voltage source (zero output impedance).  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ ꢍꢎ ꢌ  
ꢇ ꢏꢐꢍꢈ ꢏꢇꢆꢑ ꢒꢓ ꢌ ꢔ ꢍꢅꢕ ꢆ ꢖꢓ ꢆ ꢅꢗ ꢀ ꢀ ꢐꢕ ꢆ ꢄꢘ  
SCDS160A − MARCH 2004 − REVISED MAY 2004  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CC  
TEST  
S1  
S1  
t
/t  
Open  
Open  
R
PLH PHL  
L
From Output  
Under Test  
t
/t  
2 × V  
CC  
GND  
PLZ PZL  
GND  
t
/t  
PHZ PZH  
C
L
R
L
(see Note A)  
C
V
R
V
CC  
L
L
2.5 V 0.2 V  
3.3 V 0.3 V  
500 Ω  
500 Ω  
0.15 V  
0.3 V  
30 pF  
50 pF  
LOAD CIRCUIT  
V
CC  
Timing Input  
V
CC  
/2  
0 V  
t
w
t
t
h
su  
V
CC  
V
CC  
V
CC  
/2  
V
CC  
/2  
Input  
V
CC  
/2  
V
CC  
/2  
Data Input  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
V
CC  
/2  
V
CC  
/2  
V
CC  
/2  
V
/2  
Input  
CC  
0 V  
V
0 V  
t
t
t
PHL  
t
t
PLH  
PZL  
PLZ  
+ V  
Output  
Waveform 1  
V
V
OH  
CC  
V
V
/2  
/2  
V
CC  
/2  
V
CC  
/2  
/2  
Output  
CC  
S1 at 2 × V  
(see Note B)  
CC  
V
OL  
V
OL  
OL  
t
t
t
PHL  
PLH  
/2  
PZH  
PHZ  
− V  
Output  
Waveform 2  
S1 at GND  
V
V
V
OH  
OH  
V
OH  
V
V
CC  
CC  
Output  
CC  
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2 ns, t 2 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-May-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CCBTLV3861IPWRQ1  
NRND  
TSSOP  
PW  
24  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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TI

SN74CBTLV3861DWG4

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI

SN74CBTLV3861DWR

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI

SN74CBTLV3861NSR

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI

SN74CBTLV3861NSRE4

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI

SN74CBTLV3861PW

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI

SN74CBTLV3861PWE4

LOW-VOLTAGE 10-BIT FET BUS SWITCH
TI