SN74F244NSLE [TI]
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS; 八路缓冲器/驱动器，具有三态输出
| 型号： | SN74F244NSLE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 文件： | 总17页 (文件大小：643K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢉ ꢊꢋꢌꢍꢇꢎ ꢏꢄ ꢄꢐ ꢑꢀꢒ ꢓꢑ ꢔ ꢕꢐ ꢑ
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SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993
SN54F244 . . . J PACKAGE
SN74F244 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
• 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
• Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
2OE
1Y1
2A4
1Y2
2A3
1Y3
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′F240 and
′F241, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE (active-low
output-enable) inputs, and complementary OE
and OE inputs.
13 2A2
12 1Y4
11
2A1
SN54F244 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
The ′F244 is organized as two 4-bit buffers/line
drivers with separate output enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
17
16
15
14
9 10 11 12 13
The SN74F244 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F244 is characterized for operation over
the full military temperature range of −55°C to
125°C. The SN74F244 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
H
L
OE
A
H
L
L
L
H
X
Z
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Copyright 1993, Texas Instruments Incorporated
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2−1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
ꢀꢁ ꢂ ꢃꢄ ꢅ ꢃ ꢃ ꢆ ꢇ ꢀ ꢁꢈ ꢃꢄ ꢅꢃ ꢃ
ꢉꢊ ꢋꢌ ꢍꢇ ꢎ ꢏꢄ ꢄꢐ ꢑꢀ ꢒ ꢓꢑ ꢔ ꢕꢐ ꢑꢀ
ꢖꢔ ꢋ ꢗ ꢇꢘ ꢙꢀ ꢋꢌꢋꢐ ꢇ ꢉ ꢏꢋ ꢚꢏꢋ ꢀ
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993
†
logic symbol
logic diagram (positive logic)
1
1OE
1
1OE
EN
18
2
2
4
6
8
18
16
14
12
1Y1
1Y2
1A1
1A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
16
14
4
1A2
6
1Y3
1Y4
1A3
19
EN
2OE
12
8
1A4
11
13
15
17
9
7
5
3
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
19
2OE
9
7
11
2Y1
2Y2
2A1
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
13
2A2
5
3
15
2Y3
2Y4
2A3
17
2A4
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.2 V to 7 V
I
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
CC
Current into any output in the low state: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Operating free-air temperature range: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
2−2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
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ꢖ ꢔꢋ ꢗꢇ ꢘ ꢙꢀꢋꢌꢋ ꢐꢇ ꢉ ꢏꢋ ꢚꢏ ꢋ
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993
recommended operating conditions
SN54F244
SN74F244
UNIT
MIN NOM
MAX
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input clamp current
0.8
−18
− 12
48
0.8
−18
− 15
64
V
I
I
I
mA
mA
mA
°C
IK
High-level output current
Low-level output current
Operating free-air temperature
OH
OL
T
A
−55
125
0
70
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54F244
SN74F244
PARAMETER
TEST CONDITIONS
I = −18 mA
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
V
V
= 4.5 V,
= 4.5 V
−1.2
−1.2
V
IK
CC
I
I
I
I
I
I
I
= − 3 mA
= − 12 mA
= − 15 mA
= − 3 mA
= 48 mA
= 64 mA
= 2.7 V
2.4
2
3.3
3.2
2.4
3.3
3.1
OH
OH
OH
OH
OL
OL
CC
V
OH
2
V
V
= 4.75 V,
= 4.5 V
2.7
CC
0.38
0.55
V
V
OL
CC
0.42
0.55
50
I
I
I
I
V
CC
V
CC
V
CC
V
CC
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
V
50
−50
0.1
µA
µA
mA
µA
OZH
OZL
I
O
O
V
= 0.5 V
−50
0.1
V = 7 V
I
V = 2.7 V
I
20
20
IH
OE
− 1
− 1
I
V
= 5.5 V,
= 5.5 V,
V = 0.5 V
mA
mA
IL
CC
CC
I
Any A
− 1.6
− 1.6
−225
60
‡
I
V
V
O
= 0
−100
−225 −100
OS
Outputs high
Outputs low
40
60
60
60
90
90
40
60
60
V
CC
= 5.5 V,
I
90
mA
CC
Outputs open
Outputs disabled
90
†
‡
All typical values are at V
CC
= 5 V, T = 25°C.
A
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
2−3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
ꢀꢁ ꢂ ꢃꢄ ꢅ ꢃ ꢃ ꢆ ꢇ ꢀ ꢁꢈ ꢃꢄ ꢅꢃ ꢃ
ꢉꢊ ꢋꢌ ꢍꢇ ꢎ ꢏꢄ ꢄꢐ ꢑꢀ ꢒ ꢓꢑ ꢔ ꢕꢐ ꢑꢀ
ꢖꢔ ꢋ ꢗ ꢇꢘ ꢙꢀ ꢋꢌꢋꢐ ꢇ ꢉ ꢏꢋ ꢚꢏꢋ ꢀ
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993
switching characteristics (see Note 2)
V
C
R
= 5 V,
= 50 pF,
= 500 Ω,
= 25°C
V
C
R
= 4.5 V to 5.5 V,
= 50 pF,
CC
L
L
CC
L
L
= 500Ω,
FROM
(INPUT)
TO
(OUTPUT)
†
PARAMETER
UNIT
T
A
T
A
= MIN to MAX
′F244
TYP
3.6
3.6
3.9
5
SN54F244
SN74F244
MIN
1.7
1.7
1.2
1.2
1.2
1.2
MAX
5.2
5.2
5.7
7
MIN
2
MAX
MIN
1.7
1.7
1.2
1.2
1.2
1.2
MAX
t
t
6.5
7
6.2
6.5
6.7
8
PLH
PHL
PZH
Y
Y
Y
A
ns
ns
ns
2
t
2
7
OE
OE
t
2
8.5
7
PZL
t
4.1
4.1
6
2
7
PHZ
t
6
2
7.5
7
PLZ
†
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
2−4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CFP
Drawing
5962-9758601Q2A
5962-9758601QRA
5962-9758601QRA
5962-9758601QSA
5962-9758601QSA
JM38510/33203B2A
JM38510/33203B2A
JM38510/33203BRA
JM38510/33203BRA
JM38510/33203BSA
JM38510/33203BSA
SN54F244J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
FK
J
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1
1
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
FK
FK
J
CFP
A42
LCCC
LCCC
CDIP
CDIP
CFP
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
J
W
W
J
CFP
A42
CDIP
CDIP
SSOP
SSOP
SSOP
A42 SNPB
A42 SNPB
Call TI
SN54F244J
J
SN74F244DBLE
DB
DB
DB
SN74F244DBLE
Call TI
Call TI
SN74F244DBR
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F244DBR
SN74F244DBRE4
SN74F244DBRE4
SN74F244DBRG4
SN74F244DBRG4
SN74F244DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DB
DB
DB
DB
DB
DW
DW
DW
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F244DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F244DWG4
SN74F244DWG4
SN74F244DWR
SN74F244DWR
SN74F244DWRG4
SN74F244DWRG4
SN74F244N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F244N
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
PDIP
PDIP
Drawing
SN74F244N3
SN74F244N3
SN74F244NE4
OBSOLETE
OBSOLETE
ACTIVE
N
N
N
20
20
20
TBD
TBD
Call TI
Call TI
Call TI
Call TI
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F244NE4
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F244NSLE
SN74F244NSLE
SN74F244NSR
OBSOLETE
OBSOLETE
ACTIVE
SO
SO
SO
NS
NS
NS
20
20
20
TBD
TBD
Call TI
Call TI
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F244NSR
SN74F244NSRE4
SN74F244NSRE4
SN74F244NSRG4
SN74F244NSRG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
SO
SO
SO
NS
NS
NS
NS
NS
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54F244FK
SNJ54F244FK
SNJ54F244J
SNJ54F244J
SNJ54F244W
SNJ54F244W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
FK
J
20
20
20
20
20
20
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
W
CFP
A42
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
24
SN74F244DWR
SN74F244DWR
DW
DW
20
20
SITE 41
SITE 60
10.8
10.8
13.0
13.1
2.7
12
12
24
24
Q1
Q1
330
24
2.65
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74F244DWR
SN74F244DWR
DW
DW
20
20
SITE 41
SITE 60
346.0
346.0
346.0
346.0
41.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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