SN74F373N-10 [TI]
F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20;
| 型号： | SN74F373N-10 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总16页 (文件大小：1018K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
SN54F373 . . . J PACKAGE
SN74F373 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
• Eight Latches in a Single Package
• 3-State Bus-Driving True Outputs
• Full Parallel Access for Loading
• Buffered Control Inputs
• Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
8Q
8D
7D
7Q
6Q
6D
13 5D
12 5Q
description
These 8-bit latches feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
11
GND
LE
SN54F373 . . . FK PACKAGE
(TOP VIEW)
The eight latches of the ′F373 are transparent
D-type latches. While the latch-enable (LE) input
ishigh, theQoutputswillfollowthedata(D)inputs.
When the latch enable is taken low, the Q outputs
are latched at the logic levels set up at the D
inputs.
3
2
1
20 19
18
2D
2Q
3Q
3D
4D
4
5
6
7
8
8D
7D
7Q
6Q
6D
17
16
15
14
9 10 11 12 13
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal
logic state (high or low logic levels) or a
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without need for interface or pullup
components.
The output-enable (OE) input does not affect the internal operations of the latches. Old data can be retained
or new data can be entered while the outputs are in the high-impedance state.
The SN74F373 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F373 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74F373 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
OE
L
LE
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
Copyright 1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
†
logic symbol
logic diagram (positive logic)
1
1
OE
LE
EN
C1
OE
11
11
LE
3
2
5
1D
2D
3D
4D
5D
6D
7D
8D
1D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
4
C1
2
1Q
7
6
3
1D
1D
8
9
13
14
17
18
12
15
16
19
To Seven Other Channels
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –1.2 V to 7 V
I
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
CC
Current into any output in the low state: SN54F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
SN74F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA
Operating free-air temperature range: SN54F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
SN74F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
recommended operating conditions
SN54F373
SN74F373
UNIT
MIN NOM
MAX
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input clamp current
0.8
–18
– 3
0.8
–18
– 3
24
V
I
I
I
mA
mA
mA
°C
IK
High-level output current
Low-level output current
Operating free-air temperature
OH
OL
20
T
A
–55
125
0
70
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54F373
SN74F373
PARAMETER
TEST CONDITIONS
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
V
V
V
= 4.5 V,
= 4.5 V
= 4.75 V,
= 4.5 V
I = –18 mA
–1.2
–1.2
V
IK
CC
CC
CC
CC
I
I
I
I
I
I
= – 1 mA
= – 3 mA
= – 1 mA to –3 mA
= 20 mA
2.5
2.4
3.4
3.3
2.5
2.4
2.7
3.4
3.3
OH
OH
OH
OL
OL
V
OH
V
0.3
0.5
V
OL
V
= 24 mA
0.35
0.5
50
I
I
I
I
I
I
I
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
V
= 2.7 V
50
–50
0.1
µA
µA
OZH
OZL
I
O
O
V
= 0.5 V
–50
0.1
V = 7 V
I
mA
µA
V = 2.7 V
I
20
20
IH
V = 0.5 V
I
– 0.6
–150
55
– 0.6
–150
55
mA
mA
mA
IL
‡
V
O
= 0
–60
–60
OS
See Note 2
38
38
CCZ
†
‡
All typical values are at V
= 5 V, T = 25°C.
A
CC
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
is measured with OE at 4.5 V and all other inputs grounded.
NOTE 2:
I
CCZ
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
V
T
= 5 V,
= 25°C
CC
A
SN54F373
SN74F373
UNIT
′F373
MIN
6
MAX
MIN
6
MAX
MIN
6
MAX
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data after LE↓
ns
ns
ns
2
2
2
3
3
3
switching characteristics (see Note 3)
V
C
R
= 5 V,
V
C
R
= 4.5 V to 5.5 V,
= 50 pF,
CC
L
L
CC
L
L
= 50 pF,
= 500 Ω,
= 25°C
= 500Ω,
= MIN to MAX
FROM
(INPUT)
TO
(OUTPUT)
§
PARAMETER
UNIT
T
A
T
A
′F373
TYP
4.9
SN54F373
SN74F373
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
7
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
t
t
t
t
8.5
7
8
6
PLH
PHL
PLH
PHL
PZH
D
ns
ns
ns
ns
Q
Q
Q
Q
3.3
5
8.6
11.5
7
15
8.5
13.5
10
10
7
13
8
LE
4.8
t
4.6
11
7.5
6.5
6
12
8.5
7.5
6
OE
OE
t
5.2
PZL
PHZ
t
4.1
t
3.4
PLZ
§
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 3: Load circuits and waveforms are shown in Section 1.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-9758901Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9758901Q2A
SNJ54F
373FK
5962-9758901QRA
5962-9758901QSA
ACTIVE
ACTIVE
CDIP
CFP
J
20
20
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9758901QR
A
SNJ54F373J
W
Call TI
5962-9758901QS
A
SNJ54F373W
JM38510/34601B2A
JM38510/34601BRA
JM38510/34601BSA
M38510/34601B2A
M38510/34601BRA
M38510/34601BSA
SN54F373J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
20
20
20
20
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
JM38510/
34601B2A
JM38510/
34601BRA
W
FK
J
Call TI
JM38510/
34601BSA
LCCC
CDIP
CFP
POST-PLATE
A42
JM38510/
34601B2A
JM38510/
34601BRA
W
J
Call TI
JM38510/
34601BSA
CDIP
TBD
TBD
A42
SN54F373J
SN74F373DBLE
SN74F373DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
20
20
Call TI
Call TI
0 to 70
0 to 70
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
F373
F373
F373
F373
F373
SN74F373DBRE4
SN74F373DBRG4
SN74F373DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
DB
DB
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
DW
DW
Green (RoHS
& no Sb/Br)
SN74F373DWG4
25
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74F373DWR
SN74F373DWRG4
SN74F373N
ACTIVE
SOIC
SOIC
PDIP
DW
20
20
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
F373
F373
ACTIVE
ACTIVE
DW
N
2000
20
Green (RoHS
& no Sb/Br)
0 to 70
Pb-Free
(RoHS)
0 to 70
SN74F373N
SN74F373N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
0 to 70
0 to 70
SN74F373NE4
20
2000
2000
2000
1
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F373N
74F373
SN74F373NSR
SN74F373NSRE4
SN74F373NSRG4
SNJ54F373FK
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
FK
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
74F373
SO
Green (RoHS
& no Sb/Br)
0 to 70
74F373
LCCC
TBD
-55 to 125
5962-
9758901Q2A
SNJ54F
373FK
SNJ54F373J
SNJ54F373W
ACTIVE
ACTIVE
CDIP
CFP
J
20
20
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-9758901QR
A
SNJ54F373J
W
Call TI
5962-9758901QS
A
SNJ54F373W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54F373, SN74F373 :
Catalog: SN74F373
•
Military: SN54F373
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74F373DBR
SN74F373DWR
SN74F373NSR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
2000
2000
2000
330.0
330.0
330.0
16.4
24.4
24.4
8.2
10.8
8.2
7.5
2.5
2.7
2.5
12.0
12.0
12.0
16.0
24.0
24.0
Q1
Q1
Q1
13.0
13.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74F373DBR
SN74F373DWR
SN74F373NSR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
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