SN74F574DWRG4 [TI]
F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, PLASTIC, SOP-20;型号: | SN74F574DWRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, PLASTIC, SOP-20 驱动 光电二极管 输出元件 逻辑集成电路 触发器 |
文件: | 总13页 (文件大小:636K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74F574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SDFS005A – D3034, SEPTEMBER 1987 – REVISED OCTOBER 1993
DW OR N PACKAGE
(TOP VIEW)
• Eight D-Type Flip-Flops in a Single
Package
• 3-State Bus-Driving True Outputs
• Full Parallel Access for Loading
• Buffered Control Inputs
• Package Options Include Plastic
Small-Outline Packages and Standard
Plastic 300-mil DIPs
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
description
This 8-bit flip-flop features 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. It is particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers.
GND 10
11 CLK
The eight flip-flops of the SN74F574 are edge-triggered D-type flip-flops. On the positive transition of the clock
(CLK) input, the Q outputs will be set to the logic levels that were set up at the data (D) inputs.
A buffered output enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components.
The output enable (OE) does not affect the internal operations of the flip-flops. Old data can be retained or new
data can be entered while the outputs are in the high-impedance state.
The SN74F574 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUT
Q
OE
L
CLK
D
H
L
↑
↑
H
L
L
L
L
X
X
X
Q
0
H
Z
Copyright 1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74F574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SDFS005A – D3034, SEPTEMBER 1987 – REVISED OCTOBER 1993
†
logic symbol
logic diagram (positive logic)
1
1
OE
EN
C1
OE
11
CLK
11
CLK
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
1D
2D
3D
4D
5D
6D
7D
8D
1D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
C1
19
1Q
2
1D
1D
To Seven Other Channels
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –1.2 V to 7 V
I
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
CC
Current into any output in the low state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input-voltage ratings may be exceeded provided the input-current ratings are observed.
recommended operating conditions
MIN NOM
MAX
UNIT
V
V
V
V
Supply voltage
4.5
2
5
5.5
CC
IH
IL
High-level input voltage
Low-level input voltage
Input clamp current
V
0.8
– 18
– 3
24
V
I
I
I
mA
mA
mA
°C
IK
High-level output current
Low-level output current
Operating free-air temperature
OH
OL
T
A
0
70
2–2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74F574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SDFS005A – D3034, SEPTEMBER 1987 – REVISED OCTOBER 1993
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
I = – 18 mA
MIN TYP
MAX
UNIT
V
V
V
V
V
= 4.5 V,
= 4.5 V
– 1.2
V
IK
CC
I
I
I
I
I
= – 1 mA
= – 3 mA
2.5
2.4
2.7
3.4
3.3
OH
OH
OH
OL
CC
V
OH
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 4.75 V,
= 4.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= – 1 mA to – 3 mA
= 24 mA
0.35
0.5
50
V
OL
OZH
OZL
I
I
I
I
I
I
I
I
V
O
V
O
= 2.7 V
µA
µA
mA
µA
mA
mA
mA
= 0.5 V
–50
0.1
V = 7 V
I
V = 2.7 V
I
20
IH
V = 0.5 V
I
– 0.6
– 150
86
IL
‡
V
O
= 0
– 60
OS
See Note 2
55
CCZ
†
‡
All typical values are at V
= 5 V, T = 25°C.
A
CC
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
is measured with OE at 4.5 V and all other inputs grounded.
NOTE 2:
I
CCZ
timing requirements
V
T
= 5 V,
= 25°C
V
= 4.5 V to 5.5 V,
CC
A
CC
§
T = MIN to MAX
A
UNIT
MIN
0
MAX
MIN
0
MAX
f
t
Clock frequency
Pulse duration
100
100
MHz
ns
clock
CLK high
CLK low
Data high
Data low
Data high
Data low
7
7
w
6
6
2
2
t
ns
ns
Setup time before CLK↑
Hold time after CLK↑
su
h
2
2
2
2
t
2
2
switching characteristics (see Note 3)
V
C
R
= 5 V,
V
C
R
= 4.5 V to 5.5 V,
= 50 pF,
CC
L
L
CC
L
L
= 50 pF,
= 500 Ω,
= 25°C
FROM
PARAMETER
TO
(OUTPUT)
= 500Ω,
= MIN to MAX
UNIT
(INPUT)
§
T
A
T
A
MIN
100
3.2
3.2
1.2
1.2
1.2
1.2
TYP
MAX
MIN
100
3.2
3.2
1.2
1.2
1.2
1.2
MAX
f
MHz
ns
max
PLH
PHL
PZH
t
t
6.1
6.1
8.6
4.9
4.9
3.9
8.5
8.5
11.5
7.5
7
10
10
CLK
Any Q
Any Q
Any Q
t
12.5
8.5
8
ns
ns
OE
OE
t
PZL
t
PHZ
t
5.5
6.5
PLZ
§
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 3: Load circuits and waveforms are shown in Section 1.
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2–4
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74F574DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F574DWE4
SN74F574DWG4
SN74F574DWR
SN74F574DWRE4
SN74F574DWRG4
SN74F574N
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DW
DW
DW
DW
DW
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F574NE4
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F574NSR
SN74F574NSRE4
SN74F574NSRG4
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74F574DWR
SN74F574NSR
SOIC
SO
DW
NS
20
20
2000
2000
330.0
330.0
24.4
24.4
10.8
8.2
13.0
13.0
2.7
2.5
12.0
12.0
24.0
24.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74F574DWR
SN74F574NSR
SOIC
SO
DW
NS
20
20
2000
2000
367.0
367.0
367.0
367.0
45.0
45.0
Pack Materials-Page 2
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