SN74HC08N-00 [TI]
HC/UH SERIES, QUAD 2-INPUT AND GATE, PDIP14;
| 型号： | SN74HC08N-00 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, QUAD 2-INPUT AND GATE, PDIP14 输入元件 光电二极管 逻辑集成电路 |
| 文件： | 总22页 (文件大小：1163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54HC08, SN74HC08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
www.ti.com
SCLS081F–DECEMBER 1982–REVISED JANUARY 2007
FEATURES
•
•
•
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 20-µA Max ICC
•
•
•
Typical tpd = 8 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
SN54HC04...FK PACKAGE
(TOP VIEW)
SN54HC04...J OR W PACKAGE
SN74HC04...D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
3
2
1
20 19
VCC
1
2
3
4
5
6
7
14
13
12
11
10
9
1A
1B
18
17
16
15
14
4A
NC
4Y
NC
3B
4
5
6
7
8
1Y
NC
2A
4B
4A
4Y
3B
3A
3Y
1Y
2A
NC
2B
2B
2Y
9
10 11 12 13
8
GND
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
The ’HC08 devices contain four independent 2-input AND gates. They perform the Boolean function
Y = A• B or Y = A +B
in positive logic.
ORDERING INFORMATION
TA
PACKAGE(1)
ODERABLE PART NUMBER
SN74HC08N
TOP-SIDE MARKING
SN74HC08N
PDIP – N
Reel of 1000
Reel of 1000
Reel of 2500
Tube of 250
SN74HC08DE4
SN74HC08DR
SN74HC08DT
SOIC – D
HC08
SN74HC08NSR
SN74HC08NSRG4
SN74HC08DBR
SN74HC08DBRE4
SN74HC08PW
SN74HC08PWR
SN74HC08PWT
SNJ54HC08J
SOP – NS
Reel of 2000
Reel of 2000
HC08
HC08
–40°C to 85°C
SSOP – DB
Tube of 90
TSSOP – PW
Reel of 2000
Tube of 250
Reel of 1000
Reel of 900
Reel of 2200
HC08
CDIP – J
CFP – W
LCCC –FK
SNJ54HC08J
SNJ54HC08W
SNJ54HC08JFK
–55°C to 125°C
SNJ54HC08W
SNJ54HC08FK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1982–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN54HC08, SN74HC08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
www.ti.com
SCLS081F–DECEMBER 1982–REVISED JANUARY 2007
FUNCTION TABLE
(EACH INVERTER)
INPUTS
OUTPUT
Y
A
H
L
B
H
X
L
H
L
L
X
LOGIC DIAGRAM (POSITIVE LOGIC)
A
Y
B
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
VCC Supply voltage range
–0.5
7
±20
±20
±25
±50
86
IIK
IOK
IO
Input clamp current(2)
Output clamp current(2)
VI < 0 or VI > VCC
VO < 0
mA
mA
mA
mA
Continuous output current
Continuous current through VCCor GND
VO = 0 to VCC
D package
DB package
N package
NS package
PW package
96
θJA
Package thermal impedance(3)
80
°C/W
°C
76
113
150
Tstg
Storage temperature range
–60
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SN54HC08, SN74HC08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
www.ti.com
SCLS081F–DECEMBER 1982–REVISED JANUARY 2007
Recommended Operating Conditions(1)
SN54HC08
SN74HC08
UNIT
MIN
2
NOM
MAX
MIN
2
NOM
MAX
VCC Supply voltage
5
6
5
6
V
VCC = 2 V
1.5
3.15
4.2
1.5
3.15
4.2
VIH
High-level input voltage
Low-level input voltage
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
V
V
0.5
1.35
1.8
0.5
1.35
1.8
VIL
VI
Input voltage
0
0
VCC
VCC
1000
500
400
125
0
0
VCC
VCC
1000
500
400
85
V
V
VO
Output voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
∆t/∆v Input transition rise or fall rate
ns
TA
Operating free-air temperature
–55
–40
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
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SN54HC08, SN74HC08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
www.ti.com
SCLS081F–DECEMBER 1982–REVISED JANUARY 2007
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
TA = 25°C
SN54HC08
SN74HC08
PARAMETER
TEST CONDITIONS
VCC
UNIT
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
1.9
4.4
IOH = –20 µA
VOH
VI = VIH or VIL
5.9
V
IOH = –4 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
IOH = –5.2 mA
2 V
0.002
0.001
0.001
0.17
0.1
0.1
0.1
0.1
0.1
IOL = 20 µA
4.5 V
6 V
0.1
0.1
VOL
VI = VIH or VIL
VI = VCC or 0
0.1
0.1
V
IOL = 4 mA
4.5 V
6 V
0.26
0.26
±100
2
0.4
0.33
0.33
±1000
20
IOL = 5.2 mA
0.15
0.4
II
6 V
±0.1
±1000
40
nA
µA
pF
ICC
Ci
VI = VCC or 0, IO = 0
6 V
2 V to 6 V
3
10
10
10
Switching Characteristics
over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
TA = 25°C
SN54HC08
MIN MAX
SN74HC08
MIN MAX
125
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
VCC
UNIT
MIN
TYP
50
10
8
MAX
100
20
2 V
4.5 V
6 V
150
30
tpd
A
Y
Y
25
24
95
19
16
ns
17
25
2 V
38
8
75
110
22
tt
4.5 V
6 V
15
ns
6
13
19
Operating Characteristics
TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
pF
Cpd
Power dissipation capacitance per inverter
No load
20
4
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SN54HC08, SN74HC08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
www.ti.com
SCLS081F–DECEMBER 1982–REVISED JANUARY 2007
PARAMETER MEASURMENT INFORMATION
VCC
0 V
Test
Point
From Output
Under Test
Input
50%
50%
CL = 50 pF
(see Note A)
tPHL
tPLH
VOH
VOL
90%
90%
In-Phase
Output
50%
10%
50%
10%
LOAD CIRCUIT
tr
tf
VCC
0 V
tPHL
90%
tPLH
90%
90%
50%
10%
50%
10%
VOH
VOL
Input
90%
Out-of-Phase
Output
50%
10%
50%
10%
tr
tf
tf
tr
VOLTAGE WAVEFORMS
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
5
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-8404701VCA
ACTIVE
CDIP
CFP
J
14
14
20
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
5962-8404701VC
A
SNV54HC08J
5962-8404701VDA
84047012A
ACTIVE
ACTIVE
W
25
1
-55 to 125
-55 to 125
5962-8404701VD
A
SNV54HC08W
LCCC
FK
POST-PLATE
84047012A
SNJ54HC
08FK
8404701CA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
FK
J
14
14
20
14
14
20
14
14
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
8404701CA
SNJ54HC08J
8404701DA
8404701DA
SNJ54HC08W
JM38510/65203B2A
JM38510/65203BCA
JM38510/65203BDA
M38510/65203B2A
M38510/65203BCA
M38510/65203BDA
LCCC
CDIP
CFP
POST-PLATE
A42
JM38510/
65203B2A
JM38510/
65203BCA
W
FK
J
A42
JM38510/
65203BDA
LCCC
CDIP
CFP
POST-PLATE
A42
JM38510/
65203B2A
JM38510/
65203BCA
W
A42
JM38510/
65203BDA
SN54HC08J
SN74HC08D
ACTIVE
ACTIVE
CDIP
SOIC
J
14
14
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC08J
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC08
SN74HC08DBR
SN74HC08DBRE4
SN74HC08DBRG4
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
DB
DB
DB
14
14
14
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
HC08
HC08
HC08
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC08DE4
SN74HC08DG4
SN74HC08DR
SN74HC08DRE4
SN74HC08DRG4
SN74HC08DT
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
D
14
14
14
14
14
14
14
14
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC08
HC08
HC08
HC08
HC08
HC08
HC08
HC08
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
N
50
2500
2500
2500
250
250
250
25
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC08DTE4
SN74HC08DTG4
SN74HC08N
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free
(RoHS)
SN74HC08N
SN74HC08N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
SN74HC08NE4
25
2000
2000
2000
90
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC08N
HC08
SN74HC08NSR
SN74HC08NSRE4
SN74HC08NSRG4
SN74HC08PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
HC08
SO
Green (RoHS
& no Sb/Br)
HC08
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
HC08
SN74HC08PWE4
SN74HC08PWG4
90
Green (RoHS
& no Sb/Br)
HC08
90
Green (RoHS
& no Sb/Br)
HC08
SN74HC08PWLE
SN74HC08PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC08
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC08PWRE4
SN74HC08PWRG4
SN74HC08PWT
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
14
14
14
14
14
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC08
HC08
HC08
HC08
HC08
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
FK
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
-40 to 85
Green (RoHS
& no Sb/Br)
-40 to 85
SN74HC08PWTE4
SN74HC08PWTG4
SNJ54HC08FK
Green (RoHS
& no Sb/Br)
-40 to 85
Green (RoHS
& no Sb/Br)
-40 to 85
TBD
-55 to 125
84047012A
SNJ54HC
08FK
SNJ54HC08J
SNJ54HC08W
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8404701CA
SNJ54HC08J
W
8404701DA
SNJ54HC08W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC08, SN54HC08-SP, SN74HC08 :
Catalog: SN74HC08, SN54HC08
•
Automotive: SN74HC08-Q1, SN74HC08-Q1
•
Military: SN54HC08
•
Space: SN54HC08-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC08DBR
SN74HC08DR
SSOP
SOIC
DB
D
14
14
14
14
14
14
14
2000
2500
2500
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
12.4
12.4
8.2
6.5
6.5
6.5
6.5
6.9
6.9
6.6
9.0
9.0
9.0
9.0
5.6
5.6
2.5
2.1
2.1
2.1
2.1
1.6
1.6
12.0
8.0
8.0
8.0
8.0
8.0
8.0
16.0
16.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SN74HC08DRG4
SN74HC08DRG4
SN74HC08DT
SOIC
D
SOIC
D
SOIC
D
SN74HC08PWR
SN74HC08PWT
TSSOP
TSSOP
PW
PW
2000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC08DBR
SN74HC08DR
SSOP
SOIC
DB
D
14
14
14
14
14
14
14
2000
2500
2500
2500
250
367.0
333.2
333.2
367.0
367.0
367.0
367.0
367.0
345.9
345.9
367.0
367.0
367.0
367.0
38.0
28.6
28.6
38.0
38.0
35.0
35.0
SN74HC08DRG4
SN74HC08DRG4
SN74HC08DT
SOIC
D
SOIC
D
SOIC
D
SN74HC08PWR
SN74HC08PWT
TSSOP
TSSOP
PW
PW
2000
250
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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