SN74HC139DW-00 [TI]
HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16;型号: | SN74HC139DW-00 |
厂家: | TEXAS INSTRUMENTS |
描述: | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16 驱动 光电二极管 输出元件 逻辑集成电路 |
文件: | 总21页 (文件大小:922K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
SN54HC139 . . . J OR W PACKAGE
SN74HC139 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
D
Targeted Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
D
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
V
CC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
Low Power Consumption, 80-µA Max I
CC
Typical t = 10 ns
pd
4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
SN54HC139 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
The ’HC139 devices are designed for
high-performance
memory-decoding
or
data-routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can minimize
the effects of system decoding. When employed
with high-speed memories utilizing a fast enable
circuit, the delay time of these decoders and the
enable time of the memory usually are less than
the typical access time of the memory. This means
that the effective system delay introduced by the
decoders is negligible.
3
2
1
20 19
18
2A
2B
NC
1B
1Y0
NC
4
5
6
7
8
17
16
15 2Y0
14
9 10 11 12 13
1Y1
1Y2
2Y1
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
†
T
A
PACKAGE
PDIP − N
PACKAGE
Tube of 25
Tube of 40
SN74HC139N
SN74HC139N
SN74HC139D
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
SN74HC139DR
SN74HC139DT
SN74HC139NSR
SN74HC139DBR
SN74HC139PW
SN74HC139PWR
SN74HC139PWT
SNJ54HC139J
SOIC − D
HC139
SOP − NS
HC139
HC139
−40°C to 85°C
SSOP − DB
Reel of 2000
Reel of 250
Tube of 25
TSSOP − PW
HC139
CDIP − J
CFP − W
LCCC − FK
SNJ54HC139J
SNJ54HC139W
SNJ54HC139FK
Tube of 150
Tube of 55
SNJ54HC139W
SNJ54HC139FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢔ ꢛ ꢦ ꢞ ꢝꢩ ꢤꢣ ꢡꢢ ꢣꢝ ꢟꢦ ꢨꢚ ꢠꢛ ꢡ ꢡꢝ ꢗꢑ ꢎꢐ ꢘꢕ ꢰ ꢐꢇꢱꢂ ꢇꢂꢉ ꢠꢨꢨ ꢦꢠ ꢞ ꢠ ꢟꢥ ꢡꢥꢞ ꢢ ꢠ ꢞ ꢥ ꢡꢥ ꢢꢡꢥ ꢩ
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ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢊ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢋ ꢌꢍꢎ ꢏ ꢐꢎ ꢑ ꢁꢒ ꢓꢔ ꢃ ꢐꢎꢑ ꢁ ꢒ ꢋꢒ ꢅꢔ ꢋꢒ ꢕꢀ ꢖ ꢋ ꢒꢗ ꢌꢎꢓ ꢑꢘ ꢎꢒ ꢙꢒꢕꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
The ’HC139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable
(G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully
buffered inputs, each of which represents only one normalized load to its driving circuit.
FUNCTION TABLE
INPUTS
OUTPUTS
SELECT
G
B
X
L
A
X
L
Y0
H
L
Y1
H
H
L
Y2
H
H
H
L
Y3
H
H
H
H
L
H
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
H
logic diagram (positive logic)
4
5
1Y0
1Y1
1Y2
1Y3
1
1G
6
2
1A
7
3
1B
12
11
10
9
2Y0
2Y1
15
2G
2Y2
2Y3
14
2A
13
2B
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC139
MIN NOM
SN74HC139
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢊ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢋ ꢌꢍꢎ ꢏ ꢐꢎ ꢑ ꢁꢒ ꢓꢔ ꢃ ꢐꢎꢑ ꢁ ꢒ ꢋꢒ ꢅꢔ ꢋꢒ ꢕꢀ ꢖ ꢋ ꢒꢗ ꢌꢎꢓ ꢑꢘ ꢎꢒ ꢙꢒꢕꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC139
SN74HC139
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −4 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −5.2 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
I
IH
IL
I
I
= 4 mA
4.5 V
6 V
0.4
0.33
0.33
1000
80
OL
= 5.2 mA
0.4
OL
I
I
V = V
I
or 0
6 V
1000
160
10
nA
µA
pF
I
CC
V = V
I
or 0,
I
O
= 0
6 V
CC
CC
C
2 V to 6 V
3
10
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
47
SN54HC139
SN74HC139
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
175
35
MIN
MAX
255
51
MIN
MAX
220
44
2 V
4.5 V
6 V
14
A or B
Y
Y
Y
12
30
44
38
t
pd
ns
2 V
39
175
35
255
51
220
44
4.5 V
6 V
11
G
10
30
44
38
2 V
38
75
110
22
95
t
t
4.5 V
6 V
8
15
19
ns
6
13
19
16
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per decoder
No load
25
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢉ ꢀꢁꢊ ꢃꢄ ꢅꢆ ꢇꢈ
ꢋꢌꢍ ꢎ ꢏ ꢐꢎ ꢑꢁꢒ ꢓ ꢔ ꢃ ꢐꢎ ꢑꢁꢒ ꢋꢒꢅ ꢔꢋ ꢒꢕꢀ ꢖ ꢋꢒ ꢗꢌꢎꢓꢑ ꢘ ꢎꢒ ꢙꢒ ꢕ ꢀ
SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
From Output
Under Test
Test
Point
Input
50%
50%
0 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
50%
10%
50%
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
90%
t
90%
OH
Input
50%
10%
50%
10%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
0 V
OL
t
r
f
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-8409201VEA
ACTIVE
CDIP
CFP
J
16
16
20
25
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
5962-8409201VE
A
SNV54HC139J
5962-8409201VFA
84092012A
ACTIVE
ACTIVE
W
1
1
5962-8409201VF
A
SNV54HC139W
LCCC
FK
POST-PLATE
-55 to 125
84092012A
SNJ54HC
139FK
8409201EA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
CDIP
CFP
CDIP
CFP
J
W
J
16
16
16
16
16
16
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
8409201EA
SNJ54HC139J
8409201FA
8409201FA
SNJ54HC139W
JM38510/65803BEA
JM38510/65803BFA
M38510/65803BEA
M38510/65803BFA
JM38510/
65803BEA
W
J
JM38510/
65803BFA
JM38510/
65803BEA
W
JM38510/
65803BFA
SN54HC139J
SN74HC139D
ACTIVE
ACTIVE
CDIP
SOIC
J
16
16
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HC139J
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC139
SN74HC139DBR
SN74HC139DBRE4
SN74HC139DBRG4
SN74HC139DE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SOIC
SOIC
DB
DB
DB
D
16
16
16
16
16
2000
2000
2000
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HC139
HC139
HC139
HC139
HC139
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC139DG4
D
40
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC139DR
SN74HC139DRE4
SN74HC139DRG4
SN74HC139DT
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
D
16
16
16
16
16
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC139
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
N
2500
2500
250
250
250
25
Green (RoHS
& no Sb/Br)
HC139
Green (RoHS
& no Sb/Br)
HC139
Green (RoHS
& no Sb/Br)
HC139
SN74HC139DTE4
SN74HC139DTG4
SN74HC139N
Green (RoHS
& no Sb/Br)
HC139
Green (RoHS
& no Sb/Br)
HC139
Pb-Free
(RoHS)
SN74HC139N
SN74HC139N3
SN74HC139NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
-40 to 85
-40 to 85
25
2000
2000
2000
90
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC139N
HC139
SN74HC139NSR
SN74HC139NSRE4
SN74HC139NSRG4
SN74HC139PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
16
16
16
16
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
HC139
SO
Green (RoHS
& no Sb/Br)
HC139
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
HC139
SN74HC139PWE4
SN74HC139PWG4
90
Green (RoHS
& no Sb/Br)
HC139
90
Green (RoHS
& no Sb/Br)
HC139
SN74HC139PWLE
SN74HC139PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HC139
HC139
HC139
SN74HC139PWRE4
SN74HC139PWRG4
ACTIVE
ACTIVE
TSSOP
TSSOP
PW
PW
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC139PWT
SN74HC139PWTE4
SN74HC139PWTG4
SNJ54HC139FK
ACTIVE
TSSOP
TSSOP
TSSOP
LCCC
PW
16
16
16
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC139
ACTIVE
ACTIVE
ACTIVE
PW
PW
FK
250
250
1
Green (RoHS
& no Sb/Br)
-40 to 85
HC139
HC139
Green (RoHS
& no Sb/Br)
-40 to 85
TBD
-55 to 125
84092012A
SNJ54HC
139FK
SNJ54HC139J
SNJ54HC139W
ACTIVE
ACTIVE
CDIP
CFP
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8409201EA
SNJ54HC139J
W
8409201FA
SNJ54HC139W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC139, SN54HC139-SP, SN74HC139 :
Catalog: SN74HC139, SN54HC139
•
Automotive: SN74HC139-Q1, SN74HC139-Q1
•
Military: SN54HC139
•
Space: SN54HC139-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC139DBR
SN74HC139DR
SN74HC139NSR
SN74HC139PWR
SN74HC139PWT
SSOP
SOIC
DB
D
16
16
16
16
16
2000
2500
2000
2000
250
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
12.4
8.2
6.5
8.2
6.9
6.9
6.6
10.3
10.5
5.6
2.5
2.1
2.5
1.6
1.6
12.0
8.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
SO
NS
PW
PW
12.0
8.0
TSSOP
TSSOP
5.6
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC139DBR
SN74HC139DR
SN74HC139NSR
SN74HC139PWR
SN74HC139PWT
SSOP
SOIC
DB
D
16
16
16
16
16
2000
2500
2000
2000
250
367.0
333.2
367.0
367.0
367.0
367.0
345.9
367.0
367.0
367.0
38.0
28.6
38.0
35.0
35.0
SO
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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