SN74HC20DTG4 [TI]

HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, GREEN, PLASTIC, SOIC-14;
SN74HC20DTG4
型号: SN74HC20DTG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, GREEN, PLASTIC, SOIC-14

栅 输入元件 光电二极管 逻辑集成电路 触发器
文件: 总18页 (文件大小:693K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢇ  
ꢊꢋꢌ ꢍ ꢃ ꢎꢏꢁ ꢐꢋꢑ ꢐꢒ ꢀꢏ ꢑ ꢏꢓꢔ ꢎꢁꢌꢁꢊ ꢕ ꢌꢑꢔ ꢀ  
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003  
D
D
D
Wide Operating Voltage Range of 2 V to 6 V  
Outputs Can Drive Up To 10 LSTTL Loads  
D
D
D
Typical t = 11 ns  
pd  
4-mA Output Drive at 5 V  
Low Power Consumption, 20-µA Max I  
Low Input Current of 1 µA Max  
CC  
SN54HC20 . . . FK PACKAGE  
(TOP VIEW)  
SN54HC20 . . . J OR W PACKAGE  
SN74HC20 . . . D, DB, N, NS, OR PW PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
1A  
1B  
14  
13  
12  
11  
10  
9
V
CC  
3
2
1
20 19  
18  
2D  
2C  
NC  
2B  
2A  
2Y  
2C  
NC  
NC  
NC  
NC  
1C  
NC  
1D  
4
5
6
7
8
NC  
1C  
17  
16  
1D  
15 NC  
14  
9 10 11 12 13  
1Y  
2B  
8
GND  
NC − No internal connection  
description/ordering information  
The ’HC20 devices contain two independent 4-input NAND gates. They perform the Boolean function  
Y = A B C D or Y = A + B + C + D in positive logic.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP − N  
SOIC − D  
Tube of 25  
Tube of 50  
Reel of 2500  
Reel of 250  
Reel of 2000  
Reel of 2000  
Tube of 90  
Reel of 2000  
Reel of 250  
Tube of 25  
Tube of 150  
Tube of 55  
SN74HC20N  
SN74HC20N  
SN74HC20D  
SN74HC20DR  
SN74HC20DT  
SN74HC20NSR  
SN74HC20DBR  
SN74HC20PW  
SN74HC20PWR  
SN74HC20PWT  
SNJ54HC20J  
SNJ54HC20W  
SNJ54HC20FK  
HC20  
SOP − NS  
HC20  
HC20  
−40°C to 85°C  
SSOP − DB  
TSSOP − PW  
HC20  
CDIP − J  
CFP − W  
LCCC − FK  
SNJ54HC20J  
SNJ54HC20W  
SNJ54HC20FK  
−55°C to 125°C  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
ꢒ ꢘ ꢣ ꢛ ꢚꢦ ꢡꢠ ꢞꢟ ꢠꢚ ꢜꢣ ꢥꢗ ꢝꢘ ꢞ ꢞꢚ ꢭꢏ ꢍꢎ ꢐꢖ ꢮ ꢎꢯꢰꢂ ꢯꢂꢈ ꢝꢥꢥ ꢣꢝ ꢛ ꢝ ꢜꢢ ꢞꢢꢛ ꢟ ꢝ ꢛ ꢢ ꢞꢢ ꢟꢞꢢ ꢦ  
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ  
ꢡ ꢘꢥ ꢢꢟꢟ ꢚ ꢞꢨꢢ ꢛ ꢪꢗ ꢟꢢ ꢘ ꢚꢞꢢ ꢦꢧ ꢒ ꢘ ꢝꢥ ꢥ ꢚ ꢞꢨꢢ ꢛ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢟ ꢈ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢗꢚ ꢘ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢇ  
ꢊ ꢋꢌꢍ ꢃ ꢎꢏ ꢁꢐ ꢋꢑ ꢐ ꢒꢀ ꢏ ꢑꢏ ꢓ ꢔꢎ ꢁꢌꢁ ꢊ ꢕ ꢌꢑꢔ ꢀ  
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003  
FUNCTION TABLE  
(each gate)  
INPUTS  
OUTPUT  
Y
A
H
L
B
C
H
X
X
L
D
H
X
X
X
L
H
X
L
L
H
H
H
H
X
X
X
X
X
X
logic diagram (positive logic)  
1
1A  
9
10  
12  
13  
2A  
2B  
2C  
2D  
2
1B  
6
8
1Y  
2Y  
4
1C  
5
1D  
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
IK  
I
CC  
Output clamp current, I  
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Continuous current through V  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W  
JA  
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢇ  
ꢊꢋꢌ ꢍ ꢃ ꢎꢏꢁ ꢐꢋꢑ ꢐꢒ ꢀꢏ ꢑ ꢏꢓꢔ ꢎꢁꢌꢁꢊ ꢕ ꢌꢑꢔ ꢀ  
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003  
recommended operating conditions (see Note 3)  
SN54HC20  
MIN NOM  
SN74HC20  
UNIT  
MAX  
MIN NOM  
MAX  
V
V
Supply voltage  
2
1.5  
5
6
2
1.5  
5
6
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
= 4.5 V  
= 6 V  
3.15  
4.2  
3.15  
4.2  
High-level input voltage  
V
V
IH  
= 2 V  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
= 4.5 V  
= 6 V  
V
IL  
Low-level input voltage  
V
V
Input voltage  
0
0
V
V
0
0
V
V
V
V
I
CC  
CC  
Output voltage  
O
CC  
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
1000  
500  
400  
125  
1000  
500  
400  
85  
= 4.5 V  
= 6 V  
t/v  
Input transition rise/fall time  
ns  
T
A
Operating free-air temperature  
−55  
−40  
°C  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54HC20  
SN74HC20  
A
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
TYP  
MAX  
MIN  
1.9  
4.4  
5.9  
3.7  
5.2  
MAX  
MIN  
1.9  
MAX  
2 V  
4.5 V  
6 V  
1.9 1.998  
4.4 4.499  
5.9 5.999  
4.4  
I
= −20 µA  
OH  
5.9  
V
OH  
V
OL  
V = V or V  
IH  
V
I
IL  
I
I
= −4 mA  
4.5 V  
6 V  
3.98  
5.48  
4.3  
5.8  
3.84  
5.34  
OH  
= −5.2 mA  
OH  
2 V  
0.002  
0.001  
0.001  
0.17  
0.15  
0.1  
0.1  
0.1  
0.1  
0.26  
0.26  
100  
2
0.1  
0.1  
0.1  
0.1  
4.5 V  
6 V  
I
= 20 µA  
OL  
0.1  
0.1  
V = V or V  
V
I
IH  
IL  
I
I
= 4 mA  
4.5 V  
6 V  
0.4  
0.33  
0.33  
1000  
20  
OL  
= 5.2 mA  
0.4  
OL  
I
I
V = V  
I
or 0  
6 V  
1000  
40  
nA  
µA  
pF  
I
CC  
V = V  
I
or 0,  
I
O
= 0  
6 V  
CC  
CC  
C
2 V to 6 V  
3
10  
10  
10  
i
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢇ  
ꢊ ꢋꢌꢍ ꢃ ꢎꢏ ꢁꢐ ꢋꢑ ꢐ ꢒꢀ ꢏ ꢑꢏ ꢓ ꢔꢎ ꢁꢌꢁ ꢊ ꢕ ꢌꢑꢔ ꢀ  
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
T
A
= 25°C  
TYP  
45  
SN54HC20  
MIN MAX  
SN74HC20  
MIN MAX  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
V
UNIT  
CC  
MIN  
MAX  
110  
22  
2 V  
4.5 V  
6 V  
165  
33  
140  
28  
24  
95  
19  
16  
14  
t
A, B, C, or D  
Y
Y
ns  
pd  
t
11  
19  
28  
2 V  
27  
75  
110  
22  
t
4.5 V  
6 V  
9
15  
ns  
7
13  
19  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
TYP  
UNIT  
C
Power dissipation capacitance  
No load  
25  
pF  
pd  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢇ  
ꢊꢋꢌ ꢍ ꢃ ꢎꢏꢁ ꢐꢋꢑ ꢐꢒ ꢀꢏ ꢑ ꢏꢓꢔ ꢎꢁꢌꢁꢊ ꢕ ꢌꢑꢔ ꢀ  
SCLS086F − DECEMBER 1982 − REVISED AUGUST 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
From Output  
Under Test  
Test  
Point  
Input  
50%  
50%  
0 V  
C
= 50 pF  
L
t
t
PLH  
PHL  
90%  
(see Note A)  
V
V
OH  
In-Phase  
Output  
90%  
t
50%  
10%  
50%  
10%  
LOAD CIRCUIT  
OL  
t
r
f
f
t
t
PLH  
PHL  
90%  
V
CC  
V
V
90%  
t
90%  
OH  
Input  
50%  
10%  
50%  
10%  
90%  
t
Out-of-Phase  
Output  
50%  
10%  
50%  
10%  
0 V  
OL  
t
r
f
t
r
VOLTAGE WAVEFORM  
INPUT RISE AND FALL TIMES  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES  
NOTES: A.  
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following  
characteristics: PRR 1 MHz, Z = 50 , t = 6 ns, t = 6 ns.  
C includes probe and test-fixture capacitance.  
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.  
D. and t are the same as t  
t
.
PLH  
PHL pd  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
5962-8403901VCA  
5962-8403901VDA  
84039012A  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
W
FK  
J
14  
14  
20  
14  
14  
14  
14  
14  
1
1
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
LCCC  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
8403901CA  
A42  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
8403901DA  
W
J
JM38510/65003BCA  
SN54HC20J  
CDIP  
CDIP  
SOIC  
J
SN74HC20D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC20DBR  
SN74HC20DBRE4  
SN74HC20DBRG4  
SN74HC20DE4  
SN74HC20DG4  
SN74HC20DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DB  
DB  
DB  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC20DRE4  
SN74HC20DRG4  
SN74HC20DT  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC20DTE4  
SN74HC20DTG4  
SN74HC20N  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74HC20N3  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
14  
14  
TBD  
Call TI  
Call TI  
SN74HC20NE4  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74HC20NSR  
SN74HC20NSRE4  
SN74HC20NSRG4  
SN74HC20PW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
NS  
PW  
PW  
PW  
14  
14  
14  
14  
14  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC20PWE4  
SN74HC20PWG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74HC20PWR  
SN74HC20PWRE4  
SN74HC20PWRG4  
SN74HC20PWT  
TSSOP  
PW  
14  
14  
14  
14  
14  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC20PWTE4  
SN74HC20PWTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54HC20FK  
SNJ54HC20J  
SNJ54HC20W  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
14  
14  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
SN74HC20DBR  
SN74HC20DR  
SN74HC20NSR  
SN74HC20PWR  
SSOP  
SOIC  
SO  
DB  
D
14  
14  
14  
14  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
12.4  
8.2  
6.5  
8.2  
7.0  
6.6  
9.0  
2.5  
2.1  
2.5  
1.6  
12.0  
8.0  
16.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
NS  
PW  
10.5  
5.6  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74HC20DBR  
SN74HC20DR  
SN74HC20NSR  
SN74HC20PWR  
SSOP  
SOIC  
SO  
DB  
D
14  
14  
14  
14  
2000  
2500  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
33.0  
29.0  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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