SN74HC244QPWREPG4 [TI]
具有三态输出的增强型产品 8 通道、2V 至 6V 缓冲器 | PW | 20 | -40 to 125;
| 型号： | SN74HC244QPWREPG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有三态输出的增强型产品 8 通道、2V 至 6V 缓冲器 | PW | 20 | -40 to 125 驱动 总线驱动器 总线收发器 |
| 文件： | 总14页 (文件大小：608K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢃ ꢃꢇ ꢈꢉ
ꢊ ꢅꢋꢌꢍ ꢎꢏꢐ ꢐ ꢈꢑ ꢌꢁꢒ ꢍ ꢓꢁꢈ ꢒ ꢑꢓ ꢔ ꢈꢑ
ꢕ ꢓꢋ ꢄ ꢖ ꢇꢀꢋꢌꢋ ꢈ ꢊ ꢏꢋ ꢉꢏ ꢋꢀ
SCLS463A − JULY 2002 − REVISED JANUARY 2004
DW OR PW PACKAGE
(TOP VIEW)
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
V
CC
2OE
1
2
3
4
5
6
7
8
9
10
20
19
D
D
D
D
D
Extended Temperature Performance of Up
To −55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
18 1Y1
17 2A4
16
15
14
13
12
11
1Y2
2A3
1Y3
2A2
1Y4
2A1
Enhanced Product-Change Notification
†
Qualification Pedigree
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
GND
D
High-Current Outputs Drive Up To 15
LSTTL Loads
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life.
description/ordering information
This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74HC244 is
organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device
passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOP − DW
TSSOP − PW
SOP − DW
Tape and reel
Tape and reel
Tape and reel
SN74HC244QDWREP
SN74HC244QPWREP
SN74HC244MDWREP
SHC244EP
−40°C to 125°C
−55°C to 125°C
SHC244EP
HC244MEP
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
H
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢃꢇꢈ ꢉ
ꢊꢅ ꢋꢌ ꢍ ꢎ ꢏꢐ ꢐ ꢈ ꢑ ꢌꢁ ꢒ ꢍꢓ ꢁ ꢈ ꢒꢑ ꢓ ꢔꢈ ꢑ
ꢕꢓ ꢋ ꢄ ꢖ ꢇꢀꢋꢌꢋ ꢈ ꢊꢏꢋ ꢉ ꢏꢋꢀ
SCLS463A − JULY 2002 − REVISED JANUARY 2004
logic diagram (positive logic)
1
19
1OE
2OE
2A1
2A2
9
7
2
18
16
11
13
15
17
1A1
1Y1
1Y2
2Y1
2Y2
4
1A2
5
3
14
12
6
1Y3
1Y4
2Y3
2Y4
1A3
2A3
2A4
8
1A4
†
absolute maximum ratings over operating free-air temperature range
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
JA
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Storage temperature range, T
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM
MAX
UNIT
V
Supply voltage
2
1.5
3.15
4.2
0
5
6
V
CC
IH
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
V
High-level input voltage
V
V
= 2 V
0.5
1.35
1.8
= 4.5 V
= 6 V
0
V
IL
Low-level input voltage
0
V
V
Input voltage
0
V
V
V
V
I
CC
Output voltage
0
O
CC
V
V
V
= 2 V
0
1000
500
400
125
125
CC
CC
CC
= 4.5 V
= 6 V
0
t
t
Input transition (rise and fall) time
Operating free-air temperature
ns
0
Q-suffix device
M-suffix device
−40
−55
T
A
°C
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢃ ꢃꢇ ꢈꢉ
ꢊ ꢅꢋꢌꢍ ꢎꢏꢐ ꢐ ꢈꢑ ꢌꢁꢒ ꢍ ꢓꢁꢈ ꢒ ꢑꢓ ꢔ ꢈꢑ
ꢕ ꢓꢋ ꢄ ꢖ ꢇꢀꢋꢌꢋ ꢈ ꢊ ꢏꢋ ꢉꢏ ꢋꢀ
SCLS463A − JULY 2002 − REVISED JANUARY 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
CC
MIN
MAX
UNIT
MIN
TYP
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
1.9
4.4
5.9
3.7
5.2
I
= −20 µA
OH
V
V = V or V
IH
V
OH
OL
I
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
V
V = V or V
V
I
IH
IL
I
I
= 6 mA
4.5 V
6 V
0.4
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
or 0
6 V
1000
10
nA
µA
µA
pF
I
I
CC
V
= V
or 0,
or 0,
V = V or V
6 V
0.01
OZ
CC
O
CC
I
IH
= 0
IL
V = V
I CC
I
O
6 V
160
10
C
2 V to 6 V
3
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
40
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
MIN
MAX
UNIT
CC
MIN
MAX
115
23
2 V
4.5 V
6 V
170
34
13
t
t
t
t
A
Y
Y
Y
Y
ns
pd
en
dis
t
11
20
29
2 V
75
150
30
225
45
4.5 V
6 V
15
OE
OE
ns
ns
ns
13
26
38
2 V
75
150
30
225
45
4.5 V
6 V
15
13
26
38
2 V
28
60
90
4.5 V
6 V
8
12
18
6
10
15
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢃꢇꢈ ꢉ
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ꢕꢓ ꢋ ꢄ ꢖ ꢇꢀꢋꢌꢋ ꢈ ꢊꢏꢋ ꢉ ꢏꢋꢀ
SCLS463A − JULY 2002 − REVISED JANUARY 2004
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
56
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
MIN
MAX
UNIT
CC
MIN
MAX
165
33
2 V
4.5 V
6 V
245
49
18
t
pd
t
en
t
t
A
Y
Y
Y
ns
15
28
42
2 V
100
20
200
40
300
60
4.5 V
6 V
OE
ns
ns
17
34
51
2 V
45
210
42
315
63
4.5 V
6 V
17
13
36
53
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
No load
35
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢕ ꢓꢋ ꢄ ꢖ ꢇꢀꢋꢌꢋ ꢈ ꢊ ꢏꢋ ꢉꢏ ꢋꢀ
SCLS463A − JULY 2002 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
S1
S2
t
t
Open
Closed
Closed
Open
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
L
From Output
Under Test
PZL
t
t
Open
Closed
Open
PHZ
PLZ
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PLH
PHL
90%
V
V
OH
In-Phase
Output
90%
50%
10%
50%
10%
OL
t
Output
Control
(Low-Level
Enabling)
t
r
f
f
V
CC
t
t
PLH
PHL
90%
50%
50%
V
V
OH
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
≈V
CC
r
Output
Waveform 1
(See Note B)
50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
90%
V
OL
OH
t
PZH
V
CC
V
Output
Waveform 2
(See Note B)
90%
t
90%
Input
50%
10%
50%
10%
50%
0 V
≈0 V
t
PHZ
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN74HC244MDWREP
SN74HC244QDWREP
SN74HC244QPWREP
SN74HC244QPWREPG4
V62/03607-01XE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
PW
PW
DW
DW
PW
20
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TSSOP
TSSOP
SOIC
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
Purchase Samples
V62/03607-02XE
SOIC
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
V62/03607-02YE
TSSOP
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2010
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HC244-EP :
Catalog: SN74HC244
•
Automotive: SN74HC244-Q1
•
Military: SN54HC244
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC244MDWREP
SN74HC244QDWREP
SN74HC244QPWREP
SOIC
SOIC
DW
DW
PW
20
20
20
2000
2000
2000
330.0
330.0
330.0
24.4
24.4
16.4
10.8
10.8
6.95
13.0
13.0
7.1
2.7
2.7
1.6
12.0
12.0
8.0
24.0
24.0
16.0
Q1
Q1
Q1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC244MDWREP
SN74HC244QDWREP
SN74HC244QPWREP
SOIC
SOIC
DW
DW
PW
20
20
20
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
38.0
TSSOP
Pack Materials-Page 2
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