SN74HC366N-10 [TI]
HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16;
| 型号： | SN74HC366N-10 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总30页 (文件大小：1340K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-86812012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
86812012A
SNJ54HC
368FK
5962-8681201EA
5962-8681201EA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8681201EA
SNJ54HC368J
5962-8681201EA
SNJ54HC368J
5962-86828012A
5962-86828012A
5962-8682801EA
OBSOLETE
OBSOLETE
ACTIVE
LCCC
LCCC
CDIP
FK
FK
J
20
20
16
TBD
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
-55 to 125
-55 to 125
-55 to 125
1
1
1
N / A for Pkg Type
5962-8682801EA
SNJ54HC366J
5962-8682801EA
85001012A
ACTIVE
ACTIVE
CDIP
J
16
20
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8682801EA
SNJ54HC366J
LCCC
FK
POST-PLATE
85001012A
SNJ54HC
365FK
85001012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85001012A
SNJ54HC
365FK
8500101EA
8500101EA
85002012A
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
LCCC
J
J
16
16
20
1
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
8500101EA
SNJ54HC365J
8500101EA
SNJ54HC365J
FK
POST-PLATE
85002012A
SNJ54HC
367FK
85002012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85002012A
SNJ54HC
367FK
8500201EA
8500201EA
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8500201EA
SNJ54HC367J
8500201EA
SNJ54HC367J
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
JM38510/65706BEA
JM38510/65706BEA
JM38510/65708BEA
JM38510/65708BEA
JM38510/65708BFA
JM38510/65708BFA
JM38510/65709BEA
JM38510/65709BEA
M38510/65706BEA
M38510/65706BEA
M38510/65708BEA
M38510/65708BEA
M38510/65708BFA
M38510/65708BFA
M38510/65709BEA
M38510/65709BEA
ACTIVE
CDIP
CDIP
CDIP
CDIP
CFP
J
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/
65706BEA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
JM38510/
65706BEA
JM38510/
65708BEA
J
JM38510/
65708BEA
W
W
J
JM38510/
65708BFA
CFP
JM38510/
65708BFA
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
CFP
JM38510/
65709BEA
J
JM38510/
65709BEA
J
JM38510/
65706BEA
J
JM38510/
65706BEA
J
JM38510/
65708BEA
J
JM38510/
65708BEA
W
W
J
JM38510/
65708BFA
CFP
JM38510/
65708BFA
CDIP
CDIP
JM38510/
65709BEA
J
JM38510/
65709BEA
SN54HC365J
SN54HC365J
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
SN54HC365J
SN54HC365J
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN54HC366J
SN54HC366J
SN54HC367J
SN54HC367J
SN54HC368J
SN54HC368J
SN74HC365D
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
SOIC
J
16
16
16
16
16
16
16
1
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-40 to 85
SN54HC366J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
1
1
SN54HC366J
SN54HC367J
SN54HC367J
SN54HC368J
SN54HC368J
HC365
A42
J
1
A42
J
1
A42
J
1
A42
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
SN74HC365D
SN74HC365DE4
SN74HC365DE4
SN74HC365DG4
SN74HC365DG4
SN74HC365DR
SN74HC365DR
SN74HC365DRE4
SN74HC365DRE4
SN74HC365DRG4
SN74HC365DRG4
SN74HC365DT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
2500
2500
2500
2500
2500
2500
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC365DT
SN74HC365DTE4
SN74HC365DTE4
SN74HC365DTG4
SN74HC365DTG4
SN74HC365N
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
SO
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC365
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
250
250
250
250
25
Green (RoHS
& no Sb/Br)
HC365
Green (RoHS
& no Sb/Br)
HC365
D
Green (RoHS
& no Sb/Br)
HC365
D
Green (RoHS
& no Sb/Br)
HC365
N
Pb-Free
(RoHS)
SN74HC365N
SN74HC365N
SN74HC365N
SN74HC365N
HC365
SN74HC365N
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
SN74HC365NE4
SN74HC365NE4
SN74HC365NSR
SN74HC365NSR
SN74HC365NSRE4
SN74HC365NSRE4
SN74HC365NSRG4
SN74HC365NSRG4
SN74HC365PW
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
NS
NS
NS
NS
NS
NS
PW
PW
PW
2000
2000
2000
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
HC365
SO
Green (RoHS
& no Sb/Br)
HC365
SO
Green (RoHS
& no Sb/Br)
HC365
SO
Green (RoHS
& no Sb/Br)
HC365
SO
Green (RoHS
& no Sb/Br)
HC365
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
HC365
SN74HC365PW
90
Green (RoHS
& no Sb/Br)
HC365
SN74HC365PWE4
90
Green (RoHS
& no Sb/Br)
HC365
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC365PWE4
SN74HC365PWG4
SN74HC365PWG4
SN74HC365PWR
SN74HC365PWR
SN74HC365PWRE4
SN74HC365PWRE4
SN74HC365PWRG4
SN74HC365PWRG4
SN74HC365PWT
SN74HC365PWT
SN74HC365PWTE4
SN74HC365PWTE4
SN74HC365PWTG4
SN74HC365PWTG4
SN74HC367D
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
HC365
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
D
90
90
Green (RoHS
& no Sb/Br)
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC365
HC367
HC367
HC367
Green (RoHS
& no Sb/Br)
2000
2000
2000
2000
2000
2000
250
250
250
250
250
250
40
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC367D
SOIC
D
40
Green (RoHS
& no Sb/Br)
SN74HC367DE4
SOIC
D
40
Green (RoHS
& no Sb/Br)
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC367DE4
SN74HC367DG4
SN74HC367DG4
SN74HC367DR
SN74HC367DR
SN74HC367DRE4
SN74HC367DRE4
SN74HC367DRG4
SN74HC367DRG4
SN74HC367DT
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC367
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
D
D
D
D
D
D
D
N
N
N
40
40
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
2500
2500
2500
2500
2500
2500
250
250
250
250
250
250
25
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
SN74HC367DT
Green (RoHS
& no Sb/Br)
HC367
SN74HC367DTE4
SN74HC367DTE4
SN74HC367DTG4
SN74HC367DTG4
SN74HC367N
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Green (RoHS
& no Sb/Br)
HC367
Pb-Free
(RoHS)
SN74HC367N
SN74HC367N
SN74HC367N
SN74HC367N
25
Pb-Free
(RoHS)
N / A for Pkg Type
SN74HC367NE4
25
Pb-Free
(RoHS)
N / A for Pkg Type
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC367NE4
SN74HC367NSR
SN74HC367NSR
SN74HC367NSRE4
SN74HC367NSRE4
SN74HC367NSRG4
SN74HC367NSRG4
SN74HC367PW
ACTIVE
PDIP
SO
N
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SN74HC367N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NS
NS
2000
2000
2000
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
HC367
SO
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
SN74HC367PW
90
Green (RoHS
& no Sb/Br)
SN74HC367PWE4
SN74HC367PWE4
SN74HC367PWG4
SN74HC367PWG4
SN74HC367PWR
SN74HC367PWR
SN74HC367PWRE4
SN74HC367PWRE4
SN74HC367PWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 7
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC367PWRG4
SN74HC367PWT
SN74HC367PWT
SN74HC367PWTE4
SN74HC367PWTE4
SN74HC367PWTG4
SN74HC367PWTG4
SN74HC368D
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
HC367
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
PW
PW
D
250
250
250
250
250
250
40
Green (RoHS
& no Sb/Br)
HC367
HC367
HC367
HC367
HC367
HC367
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74HC368D
SOIC
D
40
Green (RoHS
& no Sb/Br)
SN74HC368DE4
SN74HC368DE4
SN74HC368DG4
SN74HC368DG4
SN74HC368DR
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
SN74HC368DR
SOIC
D
Green (RoHS
& no Sb/Br)
SN74HC368DRE4
SN74HC368DRE4
SN74HC368DRG4
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
Addendum-Page 8
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC368DRG4
SN74HC368DT
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
SO
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC368
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
250
250
250
250
250
250
25
Green (RoHS
& no Sb/Br)
HC368
SN74HC368DT
Green (RoHS
& no Sb/Br)
HC368
SN74HC368DTE4
SN74HC368DTE4
SN74HC368DTG4
SN74HC368DTG4
SN74HC368N
D
Green (RoHS
& no Sb/Br)
HC368
D
Green (RoHS
& no Sb/Br)
HC368
D
Green (RoHS
& no Sb/Br)
HC368
D
Green (RoHS
& no Sb/Br)
HC368
N
Pb-Free
(RoHS)
SN74HC368N
SN74HC368N
SN74HC368N
SN74HC368N
HC368
SN74HC368N
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
SN74HC368NE4
SN74HC368NE4
SN74HC368NSR
SN74HC368NSR
SN74HC368NSRE4
SN74HC368NSRE4
SN74HC368NSRG4
SN74HC368NSRG4
SN74HC368PW
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
NS
NS
NS
NS
NS
NS
PW
2000
2000
2000
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
HC368
SO
Green (RoHS
& no Sb/Br)
HC368
SO
Green (RoHS
& no Sb/Br)
HC368
SO
Green (RoHS
& no Sb/Br)
HC368
SO
Green (RoHS
& no Sb/Br)
HC368
TSSOP
Green (RoHS
& no Sb/Br)
HC368
Addendum-Page 9
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HC368PW
SN74HC368PWE4
SN74HC368PWE4
SN74HC368PWG4
SN74HC368PWG4
SN74HC368PWR
SN74HC368PWR
SN74HC368PWRE4
SN74HC368PWRE4
SN74HC368PWRG4
SN74HC368PWRG4
SN74HC368PWT
SN74HC368PWT
SN74HC368PWTE4
SN74HC368PWTE4
SN74HC368PWTG4
SN74HC368PWTG4
SNJ54HC365FK
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
20
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HC368
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
PW
FK
90
90
Green (RoHS
& no Sb/Br)
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
HC368
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
2000
2000
2000
250
250
250
250
250
250
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
85001012A
SNJ54HC
Addendum-Page 10
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
365FK
SNJ54HC365FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85001012A
SNJ54HC
365FK
SNJ54HC365J
SNJ54HC365J
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8500101EA
SNJ54HC365J
8500101EA
SNJ54HC365J
SNJ54HC366FK
SNJ54HC366FK
SNJ54HC366J
OBSOLETE
OBSOLETE
ACTIVE
20
20
16
TBD
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
-55 to 125
-55 to 125
-55 to 125
CDIP
CDIP
LCCC
J
J
1
1
1
N / A for Pkg Type
5962-8682801EA
SNJ54HC366J
SNJ54HC366J
ACTIVE
ACTIVE
16
20
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8682801EA
SNJ54HC366J
SNJ54HC367FK
FK
POST-PLATE
85002012A
SNJ54HC
367FK
SNJ54HC367FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85002012A
SNJ54HC
367FK
SNJ54HC367J
SNJ54HC367J
SNJ54HC368FK
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
LCCC
J
J
16
16
20
1
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
8500201EA
SNJ54HC367J
8500201EA
SNJ54HC367J
FK
POST-PLATE
5962-
86812012A
SNJ54HC
368FK
SNJ54HC368FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
86812012A
SNJ54HC
368FK
SNJ54HC368J
SNJ54HC368J
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8681201EA
SNJ54HC368J
5962-8681201EA
SNJ54HC368J
Addendum-Page 11
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC365, SN54HC366, SN54HC367, SN54HC368, SN74HC365, SN74HC366, SN74HC367, SN74HC368 :
Catalog: SN74HC365, SN74HC366, SN74HC367, SN74HC368
•
Military: SN54HC365, SN54HC366, SN54HC367, SN54HC368
•
NOTE: Qualified Version Definitions:
Addendum-Page 12
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Catalog - TI's standard catalog product
•
•
Military - QML certified for Military and Defense Applications
Addendum-Page 13
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC365DR
SN74HC365PWR
SN74HC365PWT
SN74HC367DR
SN74HC367NSR
SN74HC367PWR
SN74HC367PWT
SN74HC368DR
SN74HC368NSR
SN74HC368PWR
SN74HC368PWT
SOIC
TSSOP
TSSOP
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
2500
2000
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
12.4
12.4
16.4
16.4
12.4
12.4
16.4
16.4
12.4
12.4
6.5
6.9
6.9
6.5
8.2
6.9
6.9
6.5
8.2
6.9
6.9
10.3
5.6
2.1
1.6
1.6
2.1
2.5
1.6
1.6
2.1
2.5
1.6
1.6
8.0
8.0
8.0
8.0
12.0
8.0
8.0
8.0
12.0
8.0
8.0
16.0
12.0
12.0
16.0
16.0
12.0
12.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
PW
PW
D
5.6
2500
2000
2000
250
10.3
10.5
5.6
SO
NS
PW
PW
D
TSSOP
TSSOP
SOIC
5.6
2500
2000
2000
250
10.3
10.5
5.6
SO
NS
PW
PW
TSSOP
TSSOP
5.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC365DR
SN74HC365PWR
SN74HC365PWT
SN74HC367DR
SN74HC367NSR
SN74HC367PWR
SN74HC367PWT
SN74HC368DR
SN74HC368NSR
SN74HC368PWR
SN74HC368PWT
SOIC
TSSOP
TSSOP
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
2500
2000
250
333.2
367.0
367.0
333.2
367.0
367.0
367.0
333.2
367.0
367.0
367.0
345.9
367.0
367.0
345.9
367.0
367.0
367.0
345.9
367.0
367.0
367.0
28.6
35.0
35.0
28.6
38.0
35.0
35.0
28.6
38.0
35.0
35.0
PW
PW
D
2500
2000
2000
250
SO
NS
PW
PW
D
TSSOP
TSSOP
SOIC
2500
2000
2000
250
SO
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
UL1042
UL1042 - Uk砤d zr體nowa縪nego mieszacza iloczynowegoWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
ZXFV201
QUAD VIDEO AMPLIFIERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
ZXFV201N14
IC-SM-VIDEO AMPWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
ZXFV201N14TA
QUAD VIDEO AMPLIFIERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
ZXFV201N14TC
QUAD VIDEO AMPLIFIERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
ZXFV302N16
IC-SM-4:1 MUX SWITCHWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ETC
ZXFV4089
VIDEO AMPLIFIER WITH DC RESTORATIONWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
ZETEX
©2020 ICPDF网 联系我们和版权申明