SN74HC4066NE4 [TI]
QUADRUPLE BILATERAL ANALOG SWITCH; 翻两番双边模拟开关
| 型号： | SN74HC4066NE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE BILATERAL ANALOG SWITCH |
| 文件： | 总20页 (文件大小：578K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
Wide Operating Voltage Range of 2 V to 6 V
Typical Switch Enable Time of 18 ns
Low Power Consumption, 20-µA Max I
Low Input Current of 1 µA Max
High Degree of Linearity
CC
1
2
3
4
5
6
7
1A
1B
2B
2A
2C
V
CC
14
13
12
11
10
9
1C
4C
4A
4B
3B
3A
High On-Off Output-Voltage Ratio
Low Crosstalk Between Switches
Low On-State Impedance . . .
3C
GND
8
50-Ω TYP at V
= 6 V
CC
Individual Switch Controls
description/ordering information
The SN74HC4066 is a silicon-gate CMOS quadruple analog switch designed to handle both analog and digital
signals. Each switch permits signals with amplitudes of up to 6 V (peak) to be transmitted in either direction.
Each switch section has its own enable input control (C). A high-level voltage applied to C turns on the
associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube of 25
SN74HC4066N
SN74HC4066N
Tube of 50
SN74HC4066D
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
SN74HC4066DR
SN74HC4066DT
SN74HC4066NSR
SN74HC4066DBR
SN74HC4066PW
SN74HC4066PWR
HC4066
SOP – NS
HC4066
HC4066
–40°C to 85°C
SSOP – DB
TSSOP – PW
Reel of 2000
HC4066
Reel of 250
SN74HC4066PWT
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each switch)
INPUT
CONTROL
(C)
SWITCH
L
OFF
ON
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
logic diagram, each switch (positive logic)
A
V
CC
V
CC
B
C
One of Four Switches
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Control-input diode current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
I
I
I
CC
I/O port diode current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
I
I
I/O
CC
CC
On-state switch current (V = 0 to V
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
I/O
Continuous current through V
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
CC
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
recommended operating conditions (see Note 3)
MIN NOM
MAX
UNIT
V
†
2
V
V
Supply voltage
I/O port voltage
5
6
CC
0
V
V
V
V
V
I/O
CC
CC
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
1.5
3.15
4.2
0
V
High-level input voltage, control inputs
Low-level input voltage, control inputs
= 4.5 V
= 6 V
V
V
IH
IL
CC
0.3
= 2 V
V
= 4.5 V
= 6 V
0
0.9
1.2
0
= 2 V
1000
500
400
85
∆t/∆v
Input transition rise/fall time
= 4.5 V
= 6 V
ns
T
A
Operating free-air temperature
–40
°C
†
With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals
be transmitted at these low supply voltages.
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25 C
TYP
150
50
A
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
CC
MIN
MAX
2 V
4.5 V
6 V
I
V
= –1 mA, V = 0 to V
= V (see Figure 1)
,
T
C
I
CC
r
r
On-state switch resistance
85
106
Ω
on
IH
30
2 V
320
70
V = V
or GND, V = V
,
IH
I
CC
= –1 mA
C
Peak on-state resistance
4.5 V
6 V
170
215
Ω
on(p)
I
T
50
I
I
Control input current
V
= 0 or V
6 V
±0.1
±100
±0.1
±1000
±5
nA
I
C
CC
or 0, V = V or 0,
CC
V = V
I
C
CC
O
Off-state switch leakage current
6 V
µA
soff
V
= V (see Figure 2)
IL
V = V
(see Figure 3)
or 0, V = V
C
I
CC
IH
I
I
On-state switch leakage current
Supply current
6 V
6 V
±0.1
±5
µA
µA
son
V = 0 or V
I
,
I = 0
O
2
20
CC
CC
A or B
9
3
C
Input capacitance
C
5 V
pF
i
10
10
Feed-through
A to B
C
C
V = 0
I
0.5
9
pF
pF
f
capacitance
Output capacitance
A or B
5 V
o
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range
T
A
= 25 C
TYP
10
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
V
MIN
MAX
75
UNIT
CC
MIN
MAX
60
2 V
4.5 V
6 V
t
t
,
Propagation
delay time
C
= 50 pF
(see Figure 4)
PLH
PHL
L
A or B
B or A
A or B
A or B
4
12
15
13
ns
3
10
2 V
70
180
36
225
45
C
,
= 50 pF
(see Figure 5)
L
L
t
t
,
Switch
turn-on time
PZH
PZL
C
C
4.5 V
6 V
21
ns
ns
18
31
38
2 V
50
200
40
250
50
R
C
= 1 kΩ,
= 50 pF
(see Figure 5)
L
L
t
t
,
Switch
PLZ
PHZ
4.5 V
6 V
25
turn-off time
22
34
43
C
R
= 15 pF,
= 1 kΩ,
2 V
4.5 V
6 V
15
30
30
L
L
Control
input
frequency
f
I
C
C
A or B
A or B
V
C
V
O
= V
or GND,
MHz
CC
= V /2
CC
(see Figure 6)
C
R
= 50 pF,
L
4.5 V
6 V
15
20
Control
feed-through
noise
= R = 600 Ω,
in
C
L
mV
(rms)
V
f
= V or GND,
CC
= 1 MHz
in
(see Figure 7)
operating characteristics, V
= 4.5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per gate
C
C
= 50 pF,
f = 1 MHz
45
pF
pd
L
= 50 pF,
R = 600 Ω,
L
(see Figure 8)
R = 50 Ω,
L
(see Figure 9)
R = 600 Ω,
L
L
†
30
45
MHz
dB
Minimum through bandwidth, A to B or B to A [20 log (V /V )] = –3 dB
O
I
V
C
= V
CC
C
= 10 pF,
= 1 MHz
L
L
L
‡
Crosstalk between any switches
Feed through, switch off, A to B or B to A
Amplitude distortion rate, A to B or B to A
f
in
C
= 50 pF,
= 1 MHz
‡
42
dB
f
in
(see Figure 10)
R = 10 kΩ,
L
C
= 50 pF,
= 1 kHz
0.05%
f
in
(see Figure 11)
†
‡
Adjust the input amplitude for output = 0 dBm at f = 1 MHz. Input signal must be a sine wave.
Adjust the input amplitude for input = 0 dBm at f = 1 MHz. Input signal must be a sine wave.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
V
C
= V
IH
V
CC
V = V
I
V
O
CC
(ON)
GND
VI–O
10–3
ron
+
–
1.0 mA
V
V
I–O
Figure 1. On-State Resistance Test Circuit
V
CC
V
C
= V
IL
A
V
CC
A
B
(OFF)
GND
V
S
= V – V
A B
CONDITION 1: V = 0, V = V
A
B
CC
CONDITION 2: V = V , V = 0
A
CC
B
Figure 2. Off-State Switch Leakage-Current Test Circuit
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
V
C
= V
IH
A
V
CC
A
B
(ON)
GND
V
CC
Open
V
A
= V
TO GND
CC
Figure 3. On-State Leakage-Current Test Circuit
V
CC
V
C
= V
IH
V
CC
V
V
I
(ON)
GND
O
50 Ω
50 pF
TEST CIRCUIT
t
t
f
r
V
CC
V
90%
50%
10%
90%
50%
10%
I
A or B
0 V
t
t
PHL
PLH
V
V
OH
V
O
50%
50%
B or A
OL
VOLTAGE WAVEFORMS
Figure 4. Propagation Delay Time, Signal Input to Signal Output
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
50 Ω
TEST
S1
S2
t
t
GND
V
CC
PZL
PZH
PLZ
V
C
V
GND
GND
CC
R
1 kΩ
L
t
t
V
CC
V
CC
V
O
V
I
V
CC
GND
PHZ
S2
S1
C
50 pF
L
GND
TEST CIRCUIT
V
CC
V
CC
V
C
50%
50%
0 V
0 V
t
t
PZH
PZL
V
OH
V
OH
V
V
50%
O
50%
V
V
OL
OL
(t
, t
PZL PZH
)
V
CC
V
CC
C
50%
50%
0 V
0 V
t
t
PHZ
PLZ
V
OH
V
OH
90%
V
O
10%
(t
V
OL
V
OL
, t
)
PLZ PHZ
VOLTAGE WAVEFORMS
Figure 5. Switching Time (t
, t
t
, t
), Control to Signal Output
PZL PLZ, PZH PHZ
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
V
CC
CC
V
C
50 Ω
V
0 V
C
V
CC
V
O
V = V
I
CC
GND
C
15 pF
V
CC
/2
R
1 kΩ
L
L
Figure 6. Control-Input Frequency
V
V
CC
50 Ω
t
t
f
r
V
C
V
CC
CC
90% 90%
10% 10%
(f = 1 MHz)
t = t = 6 ns
V
C
V
I
V
O
0 V
GND
R
in
600 Ω
R
600 Ω
C
L
50 pF
L
r
f
V
/2
V
CC
/2
CC
Figure 7. Control Feed-Through Noise
V
CC
V
C
= V
CC
0.1 µF
V
V
I
CC
V
I
f
V
O
in
50 Ω
(ON)
GND
R
600 Ω
C
L
50 pF
L
(V = 0 dBm at f = 1 MHz)
I
V
CC
/2
Figure 8. Minimum Through Bandwidth
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74HC4066
QUADRUPLE BILATERAL ANALOG SWITCH
SCLS325G – MARCH 1996 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
V
C
= V
CC
V
CC
V
I
f
V
O1
in
50 Ω
(ON)
GND
R
in
600 Ω
0.1 µF
R
600 Ω
C
L
50 pF
L
V
CC
/2
V
I
V
CC
V
C
= GND
(V = 0 dBm at f = 1 MHz)
I
V
CC
V
O2
(OFF)
GND
R
in
600 Ω
R
600 Ω
C
L
50 pF
L
V
CC
/2
Figure 9. Crosstalk Between Any Two Switches
V
CC
V
C
= GND
0.1 µF
V
V
I
CC
V
I
f
V
O
(OFF)
GND
in
R
in
600 Ω
R
600 Ω
C
L
50 pF
L
50 Ω
(V = 0 dBm at f = 1 MHz)
I
V
CC
/2
V
CC
/2
Figure 10. Feed Through, Switch Off
V
CC
V
C
= V
CC
V
CC
V
I
V
I
f
in
V
O
(ON)
GND
R
10 kΩ
C
L
50 pF
L
10 µF
(V = 0 dBm at f = 1 kHz)
I
V
CC
/2
Figure 11. Amplitude-Distortion Rate
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74HC4066D
ACTIVE
SOIC
D
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066DBLE
SN74HC4066DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066DBRE4
SN74HC4066DBRG4
SN74HC4066DE4
SN74HC4066DG4
SN74HC4066DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066DRE4
SN74HC4066DRG4
SN74HC4066DT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066DTE4
SN74HC4066DTG4
SN74HC4066N
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC4066NE4
SN74HC4066NSR
SN74HC4066NSRG4
SN74HC4066PW
SN74HC4066PWE4
SN74HC4066PWG4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066PWLE
SN74HC4066PWR
OBSOLETE TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066PWRE4
SN74HC4066PWRG4
SN74HC4066PWT
PW
PW
PW
PW
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC4066PWTE4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN74HC4066PWTG4
ACTIVE
TSSOP
PW
14
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
(mm)
16
SN74HC4066DBR
SN74HC4066DR
SN74HC4066NSR
SN74HC4066PWR
DB
D
14
14
14
14
SITE 41
SITE 41
SITE 41
SITE 41
8.2
6.5
8.2
7.0
6.6
9.0
2.5
2.1
2.5
1.6
12
8
16
16
16
12
Q1
Q1
Q1
Q1
16
NS
PW
16
10.5
5.6
12
8
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74HC4066DBR
SN74HC4066DR
SN74HC4066NSR
SN74HC4066PWR
DB
D
14
14
14
14
SITE 41
SITE 41
SITE 41
SITE 41
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
33.0
29.0
NS
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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