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SN74HC643DW-00 [TI]

HC/UH SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO20;
SN74HC643DW-00
型号： SN74HC643DW-00
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

HC/UH SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO20

光电二极管 输出元件 逻辑集成电路
文件： 总21页 (文件大小：1319K)
中文：  中文翻译
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PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
5962-87809012A  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
5962-  
87809012A  
SNJ54HC  
640FK  
5962-8780901RA  
ACTIVE  
CDIP  
J
20  
1
TBD  
A42  
N / A for Pkg Type  
-55 to 125  
5962-8780901RA  
SNJ54HC640J  
SN54HC640J  
SN54HC645J  
SN74HC640DW  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
20  
20  
20  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-40 to 85  
SN54HC640J  
SN54HC645J  
HC640  
DW  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
SN74HC640DWE4  
SN74HC640DWG4  
SN74HC640DWR  
SN74HC640DWRE4  
SN74HC640DWRG4  
SN74HC640N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
DW  
DW  
DW  
DW  
DW  
N
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
2000  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Pb-Free  
(RoHS)  
SN74HC640N  
SN74HC640N  
HC640  
SN74HC640NE4  
SN74HC640NSR  
SN74HC640NSRE4  
SN74HC640NSRG4  
SN74HC640PW  
N
20  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
NS  
NS  
NS  
PW  
2000  
2000  
2000  
70  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
SO  
Green (RoHS  
& no Sb/Br)  
HC640  
SO  
Green (RoHS  
& no Sb/Br)  
HC640  
TSSOP  
Green (RoHS  
& no Sb/Br)  
HC640  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
SN74HC640PWE4  
SN74HC640PWG4  
SN74HC640PWR  
SN74HC640PWRE4  
SN74HC640PWRG4  
SN74HC640PWT  
SN74HC640PWTE4  
SN74HC640PWTG4  
SN74HC645DW  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
PW  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
70  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
HC640  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
DW  
DW  
DW  
DW  
DW  
DW  
N
70  
2000  
2000  
2000  
250  
250  
250  
25  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC640  
Green (RoHS  
& no Sb/Br)  
HC645  
SN74HC645DWE4  
SN74HC645DWG4  
SN74HC645DWR  
SN74HC645DWRE4  
SN74HC645DWRG4  
SN74HC645N  
SOIC  
25  
Green (RoHS  
& no Sb/Br)  
HC645  
SOIC  
25  
Green (RoHS  
& no Sb/Br)  
HC645  
SOIC  
2000  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
HC645  
SOIC  
Green (RoHS  
& no Sb/Br)  
HC645  
SOIC  
Green (RoHS  
& no Sb/Br)  
HC645  
PDIP  
Pb-Free  
(RoHS)  
SN74HC645N  
SN74HC645N  
SN74HC645NE4  
PDIP  
N
20  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
SNJ54HC640FK  
LCCC  
FK  
1
TBD  
N / A for Pkg Type  
5962-  
87809012A  
SNJ54HC  
640FK  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
SNJ54HC640J  
SNJ54HC645FK  
SNJ54HC645J  
ACTIVE  
CDIP  
LCCC  
CDIP  
J
20  
20  
20  
1
TBD  
TBD  
TBD  
A42  
POST-PLATE  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
5962-8780901RA  
SNJ54HC640J  
ACTIVE  
ACTIVE  
FK  
J
1
1
-55 to 125  
SNJ54HC  
645FK  
-55 to 125  
SNJ54HC645J  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
OTHER QUALIFIED VERSIONS OF SN54HC640, SN54HC645, SN74HC640, SN74HC645 :  
Catalog: SN74HC640, SN74HC645  
•
Military: SN54HC640, SN54HC645  
•
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
•
Military - QML certified for Military and Defense Applications  
•
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74HC640DWR  
SN74HC640NSR  
SN74HC640PWR  
SN74HC640PWT  
SN74HC645DWR  
SOIC  
SO  
DW  
NS  
20  
20  
20  
20  
20  
2000  
2000  
2000  
250  
330.0  
330.0  
330.0  
330.0  
330.0  
24.4  
24.4  
16.4  
16.4  
24.4  
10.8  
8.2  
13.0  
13.0  
7.1  
2.7  
2.5  
1.6  
1.6  
2.7  
12.0  
12.0  
8.0  
24.0  
24.0  
16.0  
16.0  
24.0  
Q1  
Q1  
Q1  
Q1  
Q1  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
DW  
6.95  
6.95  
10.8  
7.1  
8.0  
2000  
13.0  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74HC640DWR  
SN74HC640NSR  
SN74HC640PWR  
SN74HC640PWT  
SN74HC645DWR  
SOIC  
SO  
DW  
NS  
20  
20  
20  
20  
20  
2000  
2000  
2000  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
38.0  
38.0  
45.0  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
DW  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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