SN74HCS151D-Q1 [TI]
SN74HCS151-Q1 Automotive 8-to-1 Multiplexer with Schmitt-Trigger Inputs;
| 型号： | SN74HCS151D-Q1 |
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TEXAS INSTRUMENTS |
| 描述： | SN74HCS151-Q1 Automotive 8-to-1 Multiplexer with Schmitt-Trigger Inputs |
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SN74HCS151-Q1
SCLS819B – AUGUST 2020 – REVISED DECEMBER 2021
SN74HCS151-Q1 Automotive 8-to-1 Multiplexer with Schmitt-Trigger Inputs
1 Features
3 Description
•
AEC-Q100 qualified for automotive applications:
– Device temperature grade 1:
–40°C to +125°C, TA
– Device HBM ESD Classification Level 2
– Device CDM ESD Classifcation Level C6
Available in wettable flank QFN (WBQB) package
Wide operating voltage range: 2 V to 6 V
Schmitt-trigger inputs allow for slow or noisy input
signals
Low power consumption
– Typical ICC of 100 nA
– Typical input leakage current of ±100 nA
±7.8-mA output drive at 6 V
The SN74HCS151-Q1 is a data selector/multiplexer
containing full binary decoding to select one of eight
data sources and complementary outputs. The strobe
(G) input must be at a low logic level to enable the
inputs. A high level at the strobe terminal forces the W
output high and the Y output low.
•
•
•
Device Information
PART NUMBER
SN74HCS151PW-Q1
SN74HCS151D-Q1
PACKAGE(1)
TSSOP (16)
SOIC (16)
BODY SIZE (NOM)
5.00 mm × 4.40 mm
9.90 mm × 3.90 mm
3.60 mm × 2.60 mm
•
SN74HCS151WBQB-Q1
WQFN (16)
•
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
Data selection
Multiplexing
Supports Slow Inputs
Low Power
Noise Rejection
Input Voltage
Waveforms
Time
Input Voltage
Time
Standard
CMOS Input
Response
Waveforms
Time
Time
Input Voltage
Schmitt-trigger
CMOS Input
Response
Waveforms
Time
Time
Input Voltage
Benefits of Schmitt-Trigger Inputs
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74HCS151-Q1
SCLS819B – AUGUST 2020 – REVISED DECEMBER 2021
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Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................6
6.6 Switching Characteristics............................................6
6.7 Operating Characteristics........................................... 6
6.8 Typical Characteristics................................................7
7 Parameter Measurement Information............................8
8 Detailed Description........................................................9
8.1 Overview.....................................................................9
8.2 Functional Block Diagram...........................................9
8.3 Feature Description.....................................................9
8.4 Device Functional Modes..........................................12
9 Application and Implementation..................................13
9.1 Application Information............................................. 13
9.2 Typical Application.................................................... 13
10 Power Supply Recommendations..............................15
11 Layout...........................................................................15
11.1 Layout Guidelines................................................... 15
11.2 Layout Example...................................................... 16
12 Device and Documentation Support..........................17
12.1 Documentation Support.......................................... 17
12.2 Receiving Notification of Documentation Updates..17
12.3 Support Resources................................................. 17
12.4 Trademarks.............................................................17
12.5 Electrostatic Discharge Caution..............................17
12.6 Glossary..................................................................17
13 Mechanical, Packaging, and Orderable
Information.................................................................... 18
Package Option Addendum.............................................19
Tape and Reel Information...............................................20
Mechanical Data............................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2020) to Revision B (December 2021)
Page
•
•
•
•
Added WBQB package information to Device Information.................................................................................1
Added WBQB package to Pin Configuration and Functions ..............................................................................3
Added WBQB package to Thermal Information Table.......................................................................................4
Added wettable flanks topic to Feature Description section............................................................................... 9
Changes from August 27, 2020 to October 30, 2020 (from Revision * (August 2020) to Revision
A (October 2020))
Page
•
Removed fmax and updated Transition-time in Switching Characteristics table................................................ 6
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5 Pin Configuration and Functions
D3
1
VCC
16
D3
VCC
D4
1
2
3
4
5
6
16
D2
D1
D0
15
14
D2
D1
D0
2
15
D4
D5
D6
D5
D6
D7
A
3
4
5
6
7
14
13
13
12
11
10
9
PAD
Y
W
12
11
10
Y
D7
A
W
G
B
C
7
8
B
G
GND
8
9
GND
C
D or PW Package
16-Pin SOIC or TSSOP
Top View
WBQB Package
16-Pin WQFN
Top View
Pin Functions
PIN
I/O(2)
DESCRIPTION
SOIC or
TSSOPor
WBQB NO.
NAME
1
2
3
4
5
6
7
8
9
D3
D2
D1
D0
Y
I
I
Data input 3
Data input 2
I
Data input 1
I
Data input 0
O
O
I
Data output
W
Data output, inverted
Output strobe, active low
Ground
G
GND
C
—
I
Address select C
Address select B
Address select A
Data input 7
10
11
12
13
14
15
16
B
I
A
I
D7
D6
D5
D4
VCC
I
I
Data input 6
I
Data input 5
I
Data input 4
—
Positive supply
The thermal pad can be connected to GND or left floating. Do not connect to any other
signal or supply.
Thermal Pad (1)
—
(1) WBQB package only.
(2) Signal Types: I = Input, O = Output, I/O = Input or Output.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
7
UNIT
V
VCC
IIK
Supply voltage
–0.5
Input clamp current(2)
Output clamp current(2)
Continuous output current
VI < –0.5 V or VI > VCC + 0.5 V
VI < –0.5 V or VI > VCC + 0.5 V
VO = 0 to VCC
±20
±20
±35
±70
150
150
mA
mA
mA
mA
°C
IOK
IO
Continuous current through VCC or GND
Junction temperature(3)
TJ
Tstg
Storage temperature
–65
°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) Guaranteed by design.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1) HBM ESD Classification
Level 2
±4000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per AEC Q100-011 CDM ESD Classification
Level C6
±1500
(1) AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2
NOM
MAX
6
UNIT
V
VCC
VI
Supply voltage
Input voltage
5
0
VCC
VCC
125
V
VO
TA
Output voltage
Ambient temperature
0
V
–40
°C
6.4 Thermal Information
SN74HCS151-Q1
D (SOIC)
16 PINS
122.2
THERMAL METRIC(1)
PW (TSSOP)
16 PINS
141.2
WBQB (WQFN)
16 PINS
97.3
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
78.8
80.9
93.8
RθJB
ΨJT
Junction-to-board thermal resistance
85.8
80.6
66.4
Junction-to-top characterization
parameter
27.7
85.5
40.4
80.3
14.6
66.4
°C/W
°C/W
Junction-to-board characterization
parameter
ΨJB
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SN74HCS151-Q1
THERMAL METRIC(1)
PW (TSSOP)
16 PINS
D (SOIC)
16 PINS
WBQB (WQFN)
16 PINS
UNIT
Junction-to-case (bottom) thermal
resistance
RθJC(bot)
N/A
N/A
44.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
VCC
MIN
0.7
1.7
2.1
0.3
0.9
1.2
0.2
0.4
0.6
TYP
MAX UNIT
2 V
1.5
VT+
Positive switching threshold
4.5 V
6 V
3.15
4.2
1.0
2.2
3.0
1.0
1.4
1.6
V
V
V
V
V
2 V
VT-
Negative switching threshold
Hysteresis (VT+ - VT-)(1)
High-level output voltage
Low-level output voltage
4.5 V
6 V
2 V
ΔVT
VOH
VOL
4.5 V
6 V
IOH = -20 µA
VI = VIH or VIL IOH = -6 mA
IOH = -7.8 mA
2 V to 6 V
4.5 V
6 V
VCC – 0.1 VCC – 0.002
4.0
5.4
4.3
5.75
0.002
0.18
0.22
±100
0.1
IOL = 20 µA
2 V to 6 V
4.5 V
6 V
0.1
0.30
0.33
VI = VIH or VIL IOL = 6 mA
IOL = 7.8 mA
II
Input leakage current
Supply current
VI = VCC or 0
6 V
±1000 nA
ICC
Ci
VI = VCC or 0, IO = 0
6 V
2
5
µA
pF
Input capacitance
2 V to 6 V
(1) Guaranteed by design.
6.6 Switching Characteristics
CL = 50 pF; over operating free-air temperature range (unless otherwise noted). See Parameter Measurement Information.
Operating free-air temperature (TA)
PARAMETER
Propagation delay
Transition-time
FROM
TO
VCC
25°C
TYP
–40°C to 125°C
MIN TYP MAX
UNIT
MIN
MAX
32
12
11
33
14
11
29
12
11
9
2 V
21
8
55
20
17
53
20
17
48
17
14
16
9
A, B, or C Y or W
4.5 V
6 V
7
2 V
22
9
tpd
Any D
G
Y or W
Y or W
4.5 V
6 V
ns
7
2 V
19
8
4.5 V
6 V
7
2 V
tt
Any output 4.5 V
6 V
5
ns
4
8
6.7 Operating Characteristics
over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
Power dissipation capacitance
per gate
Cpd
No load
2 V to 6 V
25
pF
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6.8 Typical Characteristics
TA = 25°C
46
44
42
40
38
36
34
32
30
28
26
70
65
60
55
50
45
40
35
30
VCC = 2 V
VCC = 3.3 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VCC = 3.3 V
VCC = 4.5 V
VCC = 6 V
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
Output Sink Current (mA)
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
Output Source Current (mA)
Figure 6-1. Output Driver Resistance in LOW State Figure 6-2. Output Driver Resistance in HIGH State
0.2
0.18
0.16
0.14
0.12
0.1
0.65
0.6
VCC = 2 V
VCC = 4.5 V
VCC = 5 V
VCC = 6 V
0.55
0.5
VCC = 2.5 V
VCC = 3.3 V
0.45
0.4
0.35
0.3
0.08
0.06
0.04
0.02
0
0.25
0.2
0.15
0.1
0.05
0
0
0.5
1
1.5
2
2.5
3
3.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
VI œ Input Voltage (V)
VI œ Input Voltage (V)
Figure 6-3. Supply Current Across Input Voltage,
2-, 2.5-, and 3.3-V Supply
Figure 6-4. Supply Current Across Input Voltage,
4.5-, 5-, and 6-V Supply
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7 Parameter Measurement Information
Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators
having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tt < 2.5 ns.
For clock inputs, fmax is measured when the input duty cycle is 50%.
The outputs are measured one at a time with one input transition per measurement.
Test
Point
VCC
0 V
VOH
VOL
VOH
VOL
Input
Output
Output
50%
50%
From Output
Under Test
(1)
(1)
tPLH
tPHL
(1)
CL
50%
50%
(1) CL includes probe and test-fixture capacitance.
(1)
(1)
tPHL
tPLH
Figure 7-1. Load Circuit for Push-Pull Outputs
50%
50%
(1) The greater between tPLH and tPHL is the same as tpd
.
Figure 7-2. Voltage Waveforms Propagation Delays
VCC
90%
Input
90%
10%
0 V
10%
tr(1)
tf(1)
VOH
90%
10%
90%
Output
10%
VOL
tr(1)
tf(1)
(1) The greater between tr and tf is the same as tt.
Figure 7-3. Voltage Waveforms, Input and Output Transition Times
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8 Detailed Description
8.1 Overview
The SN74HCS151-Q1 is a high speed silicon gate CMOS multiplexer well suited to multiplexing and data routing
applications. It contains a single 8:1 multiplexer.
The SN74HCS151-Q1 operates asynchronously, with the Y output being equal to the input selected by the
address inputs (A, B, C). The W output is always the inverse of the Y output.
The strobe (G) input forces the Y output low, and the W output high, regardless of the state of other inputs.
All inputs include Schmitt-triggers allowing for slow input transitions and providing additional noise margin.
8.2 Functional Block Diagram
G
A
B
C
CBA 111
110
101
100
011
010
001
000
D0
D1
D2
D3
D4
D5
D6
D7
Y
W
Figure 8-1. Logic Diagram (Positive Logic) for SN74HCS151-Q1
8.3 Feature Description
8.3.1 Balanced CMOS Push-Pull Outputs
This device includes balanced CMOS push-pull outputs. The term balanced indicates that the device can sink
and source similar currents. The drive capability of this device may create fast edges into light loads so routing
and load conditions should be considered to prevent ringing. Additionally, the outputs of this device are capable
of driving larger currents than the device can sustain without being damaged. It is important for the output power
of the device to be limited to avoid damage due to overcurrent. The electrical and thermal limits defined in the
Absolute Maximum Ratings must be followed at all times.
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Unused push-pull CMOS outputs should be left disconnected.
8.3.2 CMOS Schmitt-Trigger Inputs
This device includes inputs with the Schmitt-trigger architecture. These inputs are high impedance and are
typically modeled as a resistor in parallel with the input capacitance given in the Electrical Characteristics table
from the input to ground. The worst case resistance is calculated with the maximum input voltage, given in the
Absolute Maximum Ratings table, and the maximum input leakage current, given in the Electrical Characteristics
table, using Ohm's law (R = V ÷ I).
The Schmitt-trigger input architecture provides hysteresis as defined by ΔVT in the Electrical Characteristics
table, which makes this device extremely tolerant to slow or noisy inputs. While the inputs can be driven much
slower than standard CMOS inputs, it is still recommended to properly terminate unused inputs. Driving the
inputs with slow transitioning signals will increase dynamic current consumption of the device. For additional
information regarding Schmitt-trigger inputs, please see Understanding Schmitt Triggers.
8.3.3 Clamp Diode Structure
The inputs and outputs to this device have both positive and negative clamping diodes as depicted in Figure 8-2.
CAUTION
Voltages beyond the values specified in the Absolute Maximum Ratings table can cause damage
to the device. The input and output voltage ratings may be exceeded if the input and output clamp-
current ratings are observed.
VCC
Device
+IIK
+IOK
Input
Output
Logic
GND
-IIK
-IOK
Figure 8-2. Electrical Placement of Clamping Diodes for Each Input and Output
8.3.4 Wettable Flanks
This device includes wettable flanks for at least one package. See the Features section on the front page of the
data sheet for which packages include this feature.
Package
Package
Solder
Standard Lead
We able Flank Lead
Pad
PCB
Figure 8-3. Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After
Soldering
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Wettable flanks help improve side wetting after soldering which makes QFN packages easier to inspect with
automatic optical inspection (AOI). A wettable flank can be dimpled or step-cut to provide additional surface
area for solder adhesion which assists in reliably creating a side fillet as shown in Figure 8-3. Please see the
mechanical drawing for additional details.
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8.4 Device Functional Modes
Function Table lists the functional modes of the SN74HCS151-Q1.
Table 8-1. Function Table
INPUTS(1)
OUTPUTS
SELECT
STROBE
Y
W
C
X
L
B
X
L
A
X
L
G
H
L
L
L
L
L
L
L
L
L
H
D0
D1
D2
D3
D4
D5
D6
D7
D0
D1
D2
D3
D4
D5
D6
D7
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
(1) H = High Voltage Level, L = Low Voltage Level, X = Don't Care
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The SN74HCS151-Q1 is an 8-to-1 data selector/multiplexer. This application shows an example of using the
device with all required connections.
9.2 Typical Application
VCC
VCC
A
B
C
0.1…F
3:8
DECODER
System
Controller
D0
D1
D2
D3
D4
D5
D6
D7
Device 0
Device 2
Device 4
Device 6
Device 1
Device 3
Device 5
Device 7
Y
8:1
Multiplexer
W
G
GND
Figure 9-1. Typical application block diagram
9.2.1 Design Requirements
•
•
•
All signals in the system operate at 5 V
Avoid unstable state by not having LOW signals on both inputs
Q output is HIGH when S is LOW
– Q output remains HIGH until R is LOW
9.2.1.1 Power Considerations
Ensure the desired supply voltage is within the range specified in the Recommended Operating Conditions. The
supply voltage sets the device's electrical characteristics as described in the Electrical Characteristics.
The positive voltage supply must be capable of sourcing current equal to the total current to be sourced by all
outputs of the SN74HCS151-Q1 plus the maximum static supply current, ICC, listed in Electrical Characteristics
and any transient current required for switching. The logic device can only source as much current as is provided
by the positive supply source. Be sure not to exceed the maximum total current through VCC listed in the
Absolute Maximum Ratings.
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The ground must be capable of sinking current equal to the total current to be sunk by all outputs of the
SN74HCS151-Q1 plus the maximum supply current, ICC, listed in Electrical Characteristics, and any transient
current required for switching. The logic device can only sink as much current as can be sunk into its ground
connection. Be sure not to exceed the maximum total current through GND listed in the Absolute Maximum
Ratings.
The SN74HCS151-Q1 can drive a load with a total capacitance less than or equal to 50 pF while still meeting
all of the data sheet specifications. Larger capacitive loads can be applied; however, it is not recommended to
exceed 50 pF.
The SN74HCS151-Q1 can drive a load with total resistance described by RL ≥ VO / IO, with the output voltage
and current defined in the Electrical Characteristics table with VOH and VOL. When outputting in the high state,
the output voltage in the equation is defined as the difference between the measured output voltage and the
supply voltage at the VCC pin.
Total power consumption can be calculated using the information provided in CMOS Power Consumption and
Cpd Calculation.
Thermal increase can be calculated using the information provided in Thermal Characteristics of Standard Linear
and Logic (SLL) Packages and Devices.
CAUTION
The maximum junction temperature, TJ(max) listed in the Absolute Maximum Ratings, is an additional
limitation to prevent damage to the device. Do not violate any values listed in the Absolute Maximum
Ratings. These limits are provided to prevent damage to the device.
9.2.1.2 Input Considerations
Input signals must cross Vt-(min) to be considered a logic LOW, and Vt+(max) to be considered a logic HIGH. Do
not exceed the maximum input voltage range found in the Absolute Maximum Ratings.
Unused inputs must be terminated to either VCC or ground. These can be directly terminated if the input is
completely unused, or they can be connected with a pull-up or pull-down resistor if the input is to be used
sometimes, but not always. A pull-up resistor is used for a default state of HIGH, and a pull-down resistor is used
for a default state of LOW. The resistor size is limited by drive current of the controller, leakage current into the
SN74HCS151-Q1, as specified in the Electrical Characteristics, and the desired input transition rate. A 10-kΩ
resistor value is often used due to these factors.
The SN74HCS151-Q1 has no input signal transition rate requirements because it has Schmitt-trigger inputs.
Another benefit to having Schmitt-trigger inputs is the ability to reject noise. Noise with a large enough amplitude
can still cause issues. To know how much noise is too much, please refer to the ΔVT(min) in the Electrical
Characteristics. This hysteresis value will provide the peak-to-peak limit.
Unlike what happens with standard CMOS inputs, Schmitt-trigger inputs can be held at any valid value without
causing huge increases in power consumption. The typical additional current caused by holding an input at a
value other than VCC or ground is plotted in the Typical Characteristics.
Refer to the Feature Description section for additional information regarding the inputs for this device.
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9.2.1.3 Output Considerations
The positive supply voltage is used to produce the output HIGH voltage. Drawing current from the output will
decrease the output voltage as specified by the VOH specification in the Electrical Characteristics. The ground
voltage is used to produce the output LOW voltage. Sinking current into the output will increase the output
voltage as specified by the VOL specification in the Electrical Characteristics.
Push-pull outputs that could be in opposite states, even for a very short time period, should never be connected
directly together. This can cause excessive current and damage to the device.
Two channels within the same device with the same input signals can be connected in parallel for additional
output drive strength.
Unused outputs can be left floating. Do not connect outputs directly to VCC or ground.
Refer to Feature Description section for additional information regarding the outputs for this device.
9.2.2 Detailed Design Procedure
1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the
device and electrically close to both the VCC and GND pins. An example layout is shown in the Layout
section.
2. Ensure the capacitive load at the output is ≤ 50 pF. This is not a hard limit, however it will ensure
optimal performance. This can be accomplished by providing short, appropriately sized traces from the
SN74HCS151-Q1 to one or more of the receiving devices.
3. Ensure the resistive load at the output is larger than (VCC / IO(max)) Ω. This will ensure that the maximum
output current from the Absolute Maximum Ratings is not violated. Most CMOS inputs have a resistive load
measured in MΩ; much larger than the minimum calculated above.
4. Thermal issues are rarely a concern for logic gates; the power consumption and thermal increase, however,
can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd
Calculation.
9.2.3 Application Curve
Y
G
CBA
D0
b000
b010
b001
b000
D1
D2
Figure 9-2. Application timing diagram
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results, as shown in the
following layout example.
11 Layout
11.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
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unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
11.2 Layout Example
GND VCC
Recommend GND flood fill for
improved signal isolation, noise
reduction, and thermal dissipation
Bypass capacitor
placed close to the
device
0.1 ꢀF
16
D3
1
VCC
Unused input
tied to VCC
D2
D1
D0
Y
2
3
4
5
6
7
8
15
14
13
12
11
10
9
D4
D5
D6
D7
A
Unused output
left floating
W
G
B
Unused input
tied to GND
Avoid 90°
corners for
signal lines
GND
C
Figure 11-1. Example layout for the SN74HCS151-Q1.
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12 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
•
•
•
Texas Instruments, HCMOS Design Considerations application report
Texas Instruments, CMOS Power Consumption and Cpd Calculation application report
Texas Instruments, Designing With Logic application report
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Package Option Addendum
Packaging Information
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Finish (6)
Op Temp
(°C)
Device
Orderable Device
Status (1)
Pins
Eco Plan (2)
MSL Peak Temp(3)
Marking (4) (5)
SN74HCS151QDRQ1
SN74HCS151QPWRQ1
SN74HCS151QWBQBRQ1
ACTIVE
ACTIVE
ACTIVE
SOIC
TSSOP
WQFN
D
16
16
16
2500
2000
3000
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
HCS151Q
HCS151Q
CS594Q
PW
BQB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Other Qualified Versions of SN74HCS151-Q1 :
•
Catalog: SN74HCS151
Note: Qualified Version Definitions:
Catalog - Ti's standard catalog product
•
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Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
P1 Pitch between successive cavity centers
W
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Reel
Reel
Package Package
A0
B0
K0
P1
W
Pin1
Device
Pins SPQ Diameter Width W1
Type
Drawing
(mm) (mm) (mm) (mm) (mm) Quadrant
(mm)
330.0
330.0
180.0
(mm)
16.4
12.4
12.4
SN74HCS151QDRQ1
SN74HCS151QPWRQ1
SOIC
D
16
16
16
2500
2000
3000
6.5
6.9
2.8
10.3
5.6
2.1
1.6
1.2
8.0
8.0
4.0
16.0
12.0
12.0
Q1
Q1
Q1
TSSOP
PW
BQB
SN74HCS151QWBQBRQ1 WQFN
3.8
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type
SOIC
Package Drawing Pins
SPQ
2500
2000
3000
Length (mm) Width (mm)
Height (mm)
35.0
SN74HCS151QDRQ1
SN74HCS151QPWRQ1
SN74HCS151QWBQBRQ1
D
16
16
16
853.0
853.0
210.0
449.0
449.0
185.0
TSSOP
PW
BQB
35.0
WQFN
35.0
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Mechanical Data
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74HCS151QDRQ1
SN74HCS151QPWRQ1
SN74HCS151QWBQBRQ1
ACTIVE
ACTIVE
ACTIVE
SOIC
TSSOP
WQFN
D
16
16
16
2500 RoHS & Green
2000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
HCS151Q
PW
BQB
NIPDAU
NIPDAU
HCS151Q
CS151Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HCS151-Q1 :
Catalog : SN74HCS151
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HCS151QDRQ1
SOIC
D
16
16
16
2500
2000
3000
330.0
330.0
180.0
16.4
12.4
12.4
6.5
6.9
2.8
10.3
5.6
2.1
1.6
1.2
8.0
8.0
4.0
16.0
12.0
12.0
Q1
Q1
Q1
SN74HCS151QPWRQ1 TSSOP
PW
BQB
SN74HCS151QWBQBRQ WQFN
1
3.8
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HCS151QDRQ1
SN74HCS151QPWRQ1
SN74HCS151QWBQBRQ1
SOIC
TSSOP
WQFN
D
16
16
16
2500
2000
3000
853.0
853.0
210.0
449.0
449.0
185.0
35.0
35.0
35.0
PW
BQB
Pack Materials-Page 2
GENERIC PACKAGE VIEW
BQB 16
2.5 x 3.5, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226161/A
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PACKAGE OUTLINE
WQFN - 0.8 mm max height
INDSTNAME
BQB0016B
A
2.6
2.4
B
PIN 1 INDEX AREA
3.6
3.4
0.1 MIN
(0.13)
SECTION A-A
TYPICAL
C
0.8 MAX
SEATING PLANE
0.05
0.00
0.08 C
1.1
0.9
2X 0.5
(0.2) TYP
9
8
10X 0.5
7
10
(0.16)
SYMM
SYMM
2X
2.5
17
2.1
1.9
0.3
16X
0.2
0.1
0.05
C A B
C
15
2
PIN 1 ID
(OPTIONAL)
1
16
0.5
0.3
16X
SYMM
4226135/A 08/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
INDSTNAME
BQB0016B
(2.3)
(1)
1
16
16X (0.6)
16X (0.25)
2
15
10X (0.5)
SYMM
17
(2)
(3.3)
2X (0.75)
10
7
(R0.05) TYP
(Ø 0.2) VIA
TYP
8
9
2X (0.5)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
4226135/A 08/2020
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271)
.
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
WQFN - 0.8 mm max height
INDSTNAME
BQB0016B
(2.3)
(0.95)
1
16
16X (0.6)
16X (0.25)
2
15
17
10X (0.5)
SYMM
(1.79)
(3.3)
2X (0.75)
10
7
(R0.05) TYP
METAL TYP
8
9
2X (0.5)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
85% PRINTED COVERAGE BY AREA
SCALE: 20X
4226135/A 08/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
NOTE 4
1.2 MAX
0.19
B
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
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