SN74HCT14DBLE 概述
HEX SCHMITT-TRIGGER INVERTERS 六角施密特触发反相器 逻辑芯片 栅极
SN74HCT14DBLE 规格参数
是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | SSOP |
包装说明: | SSOP, SSOP14,.3 | 针数: | 14 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.09 | Is Samacsys: | N |
系列: | HCT | JESD-30 代码: | R-PDSO-G14 |
长度: | 6.2 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | INVERTER | 最大I(ol): | 0.004 A |
功能数量: | 6 | 输入次数: | 1 |
端子数量: | 14 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SSOP | 封装等效代码: | SSOP14,.3 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, SHRINK PITCH |
包装方法: | TAPE AND REEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | Prop。Delay @ Nom-Sup: | 40 ns |
传播延迟(tpd): | 40 ns | 认证状态: | Not Qualified |
施密特触发器: | YES | 座面最大高度: | 2 mm |
子类别: | Gates | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 5.3 mm |
Base Number Matches: | 1 |
SN74HCT14DBLE 数据手册
通过下载SN74HCT14DBLE数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载SN54HCT14, SN74HCT14
HEX SCHMITT-TRIGGER INVERTERS
SCLS225E – JULY 1995 – REVISED JULY 2003
Operating Voltage Range of 4.5 V to 5.5 V
Outputs Can Drive Up To 10 LSTTL Loads
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Low Power Consumption, 20-µA Max I
CC
Typical t = 18 ns
pd
SN54HCT14 . . . FK PACKAGE
(TOP VIEW)
SN54HCT14 . . . J OR W PACKAGE
SN74HCT14 . . . D, DB, DGV, N, OR PW PACKAGE
(TOP VIEW)
14
13
12
11
10
9
1A
1Y
V
CC
1
2
3
4
5
6
7
3
2
1
20 19
18
6Y
17 NC
6A
6Y
5A
5Y
4A
4Y
2A
NC
2Y
4
5
6
7
8
2A
16
5A
NC
5Y
2Y
15
3A
NC
3A
14
3Y
9 10 11 12 13
8
GND
NC – No internal connection
description/ordering information
The ’HCT14 devices contain six independent inverters. The devices perform the Boolean function Y = A in
positive logic.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube of 25
Tube of 50
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Reel of 250
Reel of 2000
Tube of 25
Tube of 150
Tube of 55
SN74HCT14N
SN74HCT14N
SN74HCT14D
SN74HCT14DR
SN74HCT14DT
SN74HCT14DBR
SN74HCT14PWR
SN74HCT14PWT
SN74HCT14DGVR
SNJ54HCT14J
SNJ54HCT14W
SNJ54HCT14FK
HCT14
–40°C to 85°C
SSOP – DB
HT14
HT14
TSSOP – PW
TVSOP – DGV
CDIP – J
HT14
SNJ54HCT14J
SNJ54HCT14W
SNJ54HCT14FK
–55°C to 125°C
CFP – W
LCCC – FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT14, SN74HCT14
HEX SCHMITT-TRIGGER INVERTERS
SCLS225E – JULY 1995 – REVISED JULY 2003
logic diagram (positive logic)
A
Y
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT14
SN74HCT14
UNIT
MIN
4.5
0
MAX
MIN
4.5
0
MAX
V
V
V
Supply voltage
5.5
5.5
V
V
CC
Input voltage
V
V
V
V
I
CC
CC
Output voltage
0
0
V
O
CC
CC
85
T
A
Operating free-air temperature
–55
125
–40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT14, SN74HCT14
HEX SCHMITT-TRIGGER INVERTERS
SCLS225E – JULY 1995 – REVISED JULY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
SN54HCT14
SN74HCT14
PARAMETER
TEST CONDITIONS
V
CC
UNIT
MIN
TYP
MAX
MIN
MAX
MIN
MAX
V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
1.2
1.5
1.7
0.9
1
1.9
1.2
1.9
1.2
1.9
T+
V
Positive-going
threshold
1.4
0.5
0.6
0.4
0.4
2.1
1.2
1.4
1.4
1.5
1.4
0.5
0.6
0.4
0.4
2.1
1.2
1.4
1.4
1.5
1.4
0.5
0.6
0.4
0.4
2.1
1.2
1.4
1.4
1.5
V
T–
V
V
Negative-going
threshold
∆V
Hysteresis
(V – V
T+
0.6
0.65
T
)
T–
I
I
I
I
= –20 µA
4.5 V
4.5 V
4.5 V
4.5 V
5.5 V
5.5 V
4.4
4.49
4.3
4.4
3.7
4.4
OH
OH
OL
OL
V
V
V
V
OH
= –4 mA
= 20 µA
= 4 mA
3.98
3.84
0.001
0.17
0.1
0.26
±0.1
2
0.1
0.4
±1
0.1
0.33
±1
OL
I
I
V = V
or GND
or GND,
µA
µA
I
I
CC
CC
V = V
I = 0
O
40
20
CC
I
One input at 0.5 V or 2.4 V,
Other inputs at GND or V
†
∆I
CC
5.5 V
5 V
0.2
3
2.4
10
3
2.9
10
mA
pF
CC
C
VI = V
CC
or GND
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
CC
.
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
20
SN54HCT14
SN74HCT14
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
32
MIN
MAX
48
MIN
MAX
40
4.5 V
5.5 V
4.5 V
5.5 V
t
A
Y
Y
pd
t
18
30
45
38
7
15
22
19
t
ns
6
14
20
17
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
10
pF
pd
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT14, SN74HCT14
HEX SCHMITT-TRIGGER INVERTERS
SCLS225E – JULY 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
From Output
Under Test
Test
Point
Input
1.3 V
1.3 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
1.3 V
10%
1.3 V
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
OH
90%
t
90%
90%
t
Input
1.3 V
10%
1.3 V
10%
Out-of-Phase
Output
1.3 V
10%
1.3 V
10%
0 V
OL
t
t
r
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
pd
PLH
PHL
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT14, SN74HCT14
HEX SCHMITT-TRIGGER INVERTERS
SCLS225E – JULY 1995 – REVISED JULY 2003
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SUPPLY CURRENT
vs
INPUT VOLTAGE
INPUT VOLTAGE
0.5
0.45
0.4
0.5
0.45
0.4
V
CC
= 4.5 V
V
CC
= 5.5 V
V = 0 to V
I
CC
0.35
0.3
0.35
0.3
V = V
I
to 0
CC
V = 0 to V
I
CC
0.25
0.2
0.25
0.2
V = V
I
to 0
CC
0.15
0.15
0.1
0.05
0
0.1
0.05
0
0
0.45 0.9 1.35 1.8 2.26 2.7 3.16 3.61
4
0
0.55 1.1 1.66 2.2 2.76 3.3 3.86 4.4 4.97
V – Input Voltage – V
I
V – Input Voltage – V
I
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
INPUT VOLTAGE
6
5
6
5
V
CC
= 4.5 V
V
CC
= 5.5 V
4
3
2
4
3
2
V = Down
V = Down
I
I
V = Up
I
V = Up
I
1
0
1
0
–1
–1
0
0.75
1.5
2.27
3
3.77
0
0.92
1.84
2.76
3.68
4.6
V – Input Voltage – V
I
V – Input Voltage – V
I
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-86890012A
5962-8689001CA
5962-8689001DA
SN74HCT14D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
14
14
14
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
D
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14DBLE
SN74HCT14DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14DBRE4
SN74HCT14DE4
SN74HCT14DG4
SN74HCT14DGVR
SN74HCT14DGVRE4
SN74HCT14DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
SOIC
TVSOP
TVSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
D
14
14
14
14
14
14
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14DRE4
SN74HCT14DRG4
SN74HCT14DT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14DTE4
SN74HCT14DTG4
SN74HCT14N
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT14NE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT14PWLE
SN74HCT14PWR
OBSOLETE TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14PWRE4
SN74HCT14PWRG4
SN74HCT14PWT
PW
PW
PW
PW
PW
FK
14
14
14
14
14
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT14PWTE4
SN74HCT14PWTG4
SNJ54HCT14FK
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1
TBD
POST-PLATE N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
SNJ54HCT14J
SNJ54HCT14W
ACTIVE
ACTIVE
J
14
14
1
1
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
(mm)
16
SN74HCT14DBR
SN74HCT14DGVR
SN74HCT14DR
SN74HCT14DR
SN74HCT14PWR
DB
DGV
D
14
14
14
14
14
MLA
MLA
MLA
FMX
MLA
8.2
6.8
6.5
6.5
7.0
6.6
4.0
9.0
9.0
5.6
2.5
1.6
2.1
2.1
1.6
12
8
16
16
16
16
12
Q1
Q1
Q1
Q1
Q1
12
16
8
D
0
8
PW
12
8
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74HCT14DBR
SN74HCT14DGVR
SN74HCT14DR
SN74HCT14DR
SN74HCT14PWR
DB
DGV
D
14
14
14
14
14
MLA
MLA
MLA
FMX
MLA
342.9
338.1
342.9
342.9
338.1
336.6
340.5
336.6
336.6
340.5
28.58
20.64
28.58
28.58
20.64
D
PW
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
SN74HCT14DBLE 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
SN74HCT14DBR | TI | HEX SCHMITT-TRIGGER INVERTERS | 完全替代 | |
74HCT14DB | NXP | Hex inverting Schmitt trigger | 类似代替 |
SN74HCT14DBLE 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
SN74HCT14DBR | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DBRE4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DBRG4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DE4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DG4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DGV | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DGVR | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DGVRE4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DGVRG4 | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 | |
SN74HCT14DR | TI | HEX SCHMITT-TRIGGER INVERTERS | 获取价格 |
SN74HCT14DBLE 相关文章
- 2024-09-20
- 5
- 2024-09-20
- 8
- 2024-09-20
- 8
- 2024-09-20
- 6