SN74HCT157DR [TI]
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS; 四路2号线到1线数据选择器/多路复用器
| 型号： | SN74HCT157DR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS |
| 文件： | 总13页 (文件大小：342K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢉ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢇ ꢂꢈ
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SCLS071D − NOVEMBER 1988 − REVISED OCTOBER 2003
D
D
Operating Voltage Range of 4.5 V to 5.5 V
D
D
D
D
6-mA Output Drive at 5 V
High-Current Outputs Drive Up To 15
LSTTL Loads
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Buffered Inputs and Outputs
D
Typical t = 15 ns
pd
D
Low Power Consumption, 80-µA Max I
CC
SN54HCT157 . . . J OR W PACKAGE
SN74HCT157 . . . D OR N PACKAGE
(TOP VIEW)
SN54HCT157 . . . FK PACKAGE
(TOP VIEW)
A/B
1A
1
2
3
4
5
6
7
8
V
CC
G
16
15
14
13
12
3
2
1
20 19
18
4A
4B
NC
4Y
1B
1Y
NC
2A
2B
4
5
6
7
8
1B
4A
4B
4Y
17
16
15
1Y
2A
2B
11 3A
14 3A
9 10 11 12 13
10
9
2Y
3B
3Y
GND
NC − No internal connection
description/ordering information
These data selectors/multiplexers contain inverters and drivers to supply full data selection to the four output
gates. A separate strobe (G) input is provided. A 4-bit word is selected from one of two sources and is routed
to the four outputs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HCT157N
SN74HCT157D
SN74HCT157DR
SN74HCT157DT
SNJ54HCT157J
SNJ54HCT157W
SNJ54HCT157FK
SN74HCT157N
−40°C to 85°C
HCT157
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT157J
SNJ54HCT157W
SNJ54HCT157FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
ꢋ ꢁ ꢐꢑꢀꢀ ꢕ ꢆꢄ ꢑꢎꢙ ꢔꢀ ꢑ ꢁ ꢕꢆꢑꢍ ꢚꢛ ꢜꢝ ꢞꢟꢠ ꢡꢢꢣ ꢤꢚ ꢠꢟ ꢤꢚꢥ ꢜꢤꢝ ꢏꢎ ꢕ ꢍ ꢋ ꢅꢆ ꢔꢕ ꢁ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢂ ꢈꢉ ꢀꢁꢈ ꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢐ ꢑ ꢒ ꢓꢐ ꢔ ꢁꢑ ꢆ ꢕ ꢇ ꢓꢐꢔ ꢁ ꢑ ꢍꢌꢆꢌ ꢀꢑ ꢐꢑ ꢅꢆꢕ ꢎꢀꢖ ꢗꢋ ꢐꢆ ꢔꢏ ꢐꢑ ꢘꢑꢎꢀ
SCLS071D − NOVEMBER 1988 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUTS
STROBE SELECT
OUTPUT
Y
DATA
G
A/B
A
X
L
B
X
X
X
L
H
L
L
L
L
X
L
L
L
L
H
X
X
H
L
H
H
H
H
logic diagram (positive logic)
2
1A
4
1Y
3
1B
5
2A
7
9
2Y
3Y
6
2B
11
3A
10
3B
14
4A
12
4Y
13
4B
15
G
1
A/B
Pin numbers shown are for the D, J, N, and W packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢉ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢇ ꢂꢈ
ꢊ ꢋꢌꢍ ꢎꢋꢏ ꢐ ꢑ ꢒ ꢓꢐ ꢔꢁꢑ ꢆ ꢕ ꢇ ꢓꢐ ꢔꢁꢑ ꢍꢌꢆꢌ ꢀꢑ ꢐꢑ ꢅꢆꢕ ꢎꢀꢖ ꢗꢋ ꢐꢆ ꢔ ꢏꢐ ꢑꢘ ꢑ ꢎꢀ
SCLS071D − NOVEMBER 1988 − REVISED OCTOBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Storage temperature range, T
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT157
MIN NOM MAX
SN74HCT157
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
t
Input transition (rise and fall) time
Operating free-air temperature
500
125
500
85
ns
°C
t
T
−55
−40
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT157 SN74HCT157
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −6 mA
= 20 µA
= 6 mA
4.4 4.499
OH
OH
OL
OL
V
V
V = V or V
IH
4.5 V
4.5 V
OH
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
8
0.1
0.4
0.1
0.33
1000
80
V = V or V
V
OL
I
IH
IL
I
I
V = V
I
or 0
5.5 V
5.5 V
1000
160
nA
I
CC
V = V
I
or 0,
I
O
= 0
µA
CC
CC
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10*
i
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
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3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢂ ꢈꢉ ꢀꢁꢈ ꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ
ꢊꢋ ꢌ ꢍꢎ ꢋ ꢏꢐ ꢑ ꢒ ꢓꢐ ꢔ ꢁꢑ ꢆ ꢕ ꢇ ꢓꢐꢔ ꢁ ꢑ ꢍꢌꢆꢌ ꢀꢑ ꢐꢑ ꢅꢆꢕ ꢎꢀꢖ ꢗꢋ ꢐꢆ ꢔꢏ ꢐꢑ ꢘꢑꢎꢀ
SCLS071D − NOVEMBER 1988 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
18
SN54HCT157 SN74HCT157
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
28
MIN
MAX
42
MIN
MAX
35
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
A or B
A/B
G
Y
Y
15
25
38
32
20
32
48
40
t
pd
ns
17
29
43
36
18
26
39
33
Y
15
23
35
30
8
15
22
19
t
t
Any
ns
7
14
21
17
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
23
SN54HCT157 SN74HCT157
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
42
MIN
MAX
63
MIN
MAX
52
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
A or B
A/B
G
Y
Y
19
38
52
46
24
46
72
58
t
pd
ns
21
41
61
52
21
39
58
48
Y
19
35
49
43
17
42
63
53
t
t
Any
ns
14
38
57
48
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
12
pF
pd
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ꢠ ꢛ ꢥ ꢤ ꢯꢣ ꢟꢧ ꢞꢜ ꢝ ꢠ ꢟꢤ ꢚꢜ ꢤꢡ ꢣ ꢚ ꢛꢣ ꢝ ꢣ ꢨꢧ ꢟ ꢞꢡꢠ ꢚꢝ ꢭ ꢜꢚꢛ ꢟꢡꢚ ꢤꢟꢚ ꢜꢠꢣ ꢫ
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4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢉ ꢀꢁ ꢈꢃ ꢄꢅ ꢆꢇ ꢂꢈ
ꢊ ꢋꢌꢍ ꢎꢋꢏ ꢐ ꢑ ꢒ ꢓꢐ ꢔꢁꢑ ꢆ ꢕ ꢇ ꢓꢐ ꢔꢁꢑ ꢍꢌꢆꢌ ꢀꢑ ꢐꢑ ꢅꢆꢕ ꢎꢀꢖ ꢗꢋ ꢐꢆ ꢔ ꢏꢐ ꢑꢘ ꢑ ꢎꢀ
SCLS071D − NOVEMBER 1988 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.3 V
1.3 V
(see Note B)
t
t
From Output
Under Test
Test
Point
PLH
PHL
90%
V
V
OH
90%
t
Output
C
= 50 pF
1.3 V
10%
1.3 V
10%
L
(see Note A)
OL
t
r
f
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A.
C
includes probe and test-fixture capacitance.
L
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
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provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
SN74HCT157D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT157DE4
SN74HCT157DG4
SN74HCT157DR
SN74HCT157DRE4
SN74HCT157DRG4
SN74HCT157DT
SN74HCT157DTE4
SN74HCT157DTG4
SN74HCT157N
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
D
D
N
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT157NE4
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
(mm)
SN74HCT157DR
D
16
FMX
330
16
6.5
10.3
12.1
2
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
FMX
Length (mm) Width (mm) Height (mm)
SN74HCT157DR
D
16
342.9
336.6
28.58
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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