SN74HCT240PWTG4 [TI]
Octal Buffers And Line Drivers With 3-State Outputs 20-TSSOP -40 to 85;
| 型号： | SN74HCT240PWTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Octal Buffers And Line Drivers With 3-State Outputs 20-TSSOP -40 to 85 驱动 光电二极管 逻辑集成电路 |
| 文件： | 总19页 (文件大小：857K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCLS174E − MARCH 1984 − REVISED AUGUST 2003
SN54HCT240 . . . J OR W PACKAGE
SN74HCT240 . . . DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current Outputs Drive Up To 15
LSTTL Loads
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 12 ns
pd
6-mA Output Drive at 5 V
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1
2
3
4
5
6
7
8
9
20
V
CC
CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
description/ordering information
GND 10
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The ’HCT240 devices are organized
as two 4-bit buffers/drivers with separate
output-enable (OE) inputs. When OE is low, the
device passes inverted data from the A inputs to
the Y outputs. When OE is high, the outputs are
in the high-impedance state.
SN54HCT240 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
17
16
15
14
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT240N
SN74HCT240N
SN74HCT240DW
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PW
SN74HCT240PWR
SN74HCT240PWT
SNJ54HCT240J
SOIC − DW
SOP − NS
HCT240
HCT240
−40°C to 85°C
TSSOP − PW
HT240
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT240J
SNJ54HCT240W
SNJ54HCT240W
SNJ54HCT240FK
−55°C to 125°C
SNJ54HCT240FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢋ ꢛ ꢦ ꢞ ꢝꢩ ꢤꢣ ꢡꢢ ꢣꢝ ꢟꢦ ꢨꢚ ꢠꢛ ꢡ ꢡꢝ ꢰꢔ ꢍꢘ ꢙꢒ ꢐ ꢘꢗꢱꢂ ꢗꢂꢉ ꢠꢨꢨ ꢦꢠ ꢞ ꢠ ꢟꢥ ꢡꢥꢞ ꢢ ꢠ ꢞ ꢥ ꢡꢥ ꢢꢡꢥ ꢩ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢈꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢈ
ꢋꢅ ꢆꢌ ꢍ ꢎ ꢏ ꢐꢐ ꢑꢒ ꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋꢏꢆ ꢙꢏ ꢆꢀ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
L
H
Z
H
X
logic diagram (positive logic)
1
19
1OE
2OE
18
2
9
7
11
13
1Y1
1Y2
1Y3
1Y4
1A1
2Y1
2Y2
2A1
2A2
2A3
2A4
16
14
12
4
1A2
5
3
6
15
17
1A3
2Y3
2Y4
8
1A4
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS174E − MARCH 1984 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT240
SN74HCT240
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
∆t/∆v
Input transition rise/fall time
Operating free-air temperature
500
125
500
85
ns
°C
T
A
−55
−40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT240 SN74HCT240
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −6 mA
= 20 µA
= 6 mA
4.4 4.499
OH
OH
OL
OL
V
V = V or V
IH
4.5 V
4.5 V
OH
OL
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
0.5
8
0.1
0.4
0.1
0.33
1000
5
V
V = V or V
V
I
IH
IL
I
I
I
V = V
I
or 0
5.5 V
5.5 V
5.5 V
1000
10
nA
µA
µA
I
CC
V
O
= V
or 0,
or 0,
V = V or V
0.01
OZ
CC
CC
I
IH
= 0
IL
V = V
CC
I
O
160
80
I
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
13
SN54HCT240 SN74HCT240
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
25
MIN
MAX
37
MIN
MAX
32
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
t
t
t
A
Y
Y
Y
Y
pd
en
dis
t
12
23
33
29
21
35
53
44
ns
OE
OE
19
32
48
40
19
35
53
44
ns
18
32
48
40
8
12
18
15
ns
7
11
16
14
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢃ ꢈꢉ ꢀꢁꢊ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢈ
ꢋꢅ ꢆꢌ ꢍ ꢎ ꢏ ꢐꢐ ꢑꢒ ꢀ ꢌꢁ ꢓ ꢍꢔ ꢁ ꢑ ꢓꢒ ꢔ ꢕꢑ ꢒꢀ
ꢖꢔ ꢆ ꢄ ꢗ ꢘꢀꢆꢌꢆ ꢑ ꢋꢏꢆ ꢙꢏ ꢆꢀ
SCLS174E − MARCH 1984 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
20
SN54HCT240 SN74HCT240
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
42
MIN
MAX
63
MIN
MAX
53
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
pd
t
en
t
t
A
Y
Y
Y
19
38
56
48
25
52
79
65
ns
OE
22
47
71
59
17
42
63
53
ns
14
38
57
48
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance
No load
40
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS174E − MARCH 1984 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
S1
S2
L
L
50 pF
or
150 pF
t
Open
Closed
Closed
Open
S1
S2
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
t
t
t
L
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
Input
3 V
2.7 V
2.7 V
1.3 V
0.3 V
1.3 V
0.3 V
0 V
t
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
Output
Control
(Low-Level
Enabling)
3 V
0 V
3 V
0 V
Input
1.3 V
1.3 V
1.3 V
1.3 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
V
OH
≈V
CC
In-Phase
Output
Output
Waveform 1
(See Note B)
90%
t
1.3 V
10%
1.3 V
10%
1.3 V
10%
OL
V
OL
OH
t
r
f
f
t
t
t
t
PHL
90%
PLH
PZH
PHZ
Out-of-
Phase
Output
V
V
OH
V
Output
Waveform 2
(See Note B)
90%
t
90%
1.3 V
10%
1.3 V
10%
1.3 V
≈0 V
OL
t
r
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
85505012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
85505012A
SNJ54HCT
240FK
8550501RA
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
J
J
J
20
20
20
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
8550501RA
SNJ54HCT240J
JM38510/65753BRA
M38510/65753BRA
JM38510/
65753BRA
JM38510/
65753BRA
SN54HCT240J
ACTIVE
ACTIVE
CDIP
SOIC
J
20
20
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HCT240J
SN74HCT240DW
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HCT240
SN74HCT240DWE4
SN74HCT240DWG4
SN74HCT240DWR
SN74HCT240DWRE4
SN74HCT240DWRG4
SN74HCT240N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
25
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HCT240
Green (RoHS
& no Sb/Br)
HCT240
2000
2000
2000
20
Green (RoHS
& no Sb/Br)
HCT240
Green (RoHS
& no Sb/Br)
HCT240
Green (RoHS
& no Sb/Br)
HCT240
Pb-Free
(RoHS)
SN74HCT240N
SN74HCT240N
HCT240
SN74HCT240NE4
SN74HCT240NSR
SN74HCT240NSRE4
SN74HCT240NSRG4
SN74HCT240PW
N
20
Pb-Free
(RoHS)
N / A for Pkg Type
NS
NS
NS
PW
2000
2000
2000
70
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
HCT240
SO
Green (RoHS
& no Sb/Br)
HCT240
TSSOP
Green (RoHS
& no Sb/Br)
HT240
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HCT240PWE4
SN74HCT240PWG4
SN74HCT240PWR
SN74HCT240PWRE4
SN74HCT240PWRG4
SN74HCT240PWT
SN74HCT240PWTE4
SN74HCT240PWTG4
SNJ54HCT240FK
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
20
20
20
20
20
20
20
20
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
HT240
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
PW
PW
PW
FK
70
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
HT240
HT240
HT240
HT240
HT240
HT240
HT240
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
85505012A
SNJ54HCT
240FK
SNJ54HCT240J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8550501RA
SNJ54HCT240J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HCT240, SN74HCT240 :
Catalog: SN74HCT240
•
Military: SN54HCT240
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PWR
SN74HCT240PWT
SOIC
SO
DW
NS
20
20
20
20
2000
2000
2000
250
330.0
330.0
330.0
330.0
24.4
24.4
16.4
16.4
10.8
8.2
13.0
13.0
7.1
2.7
2.5
1.6
1.6
12.0
12.0
8.0
24.0
24.0
16.0
16.0
Q1
Q1
Q1
Q1
TSSOP
TSSOP
PW
PW
6.95
6.95
7.1
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HCT240DWR
SN74HCT240NSR
SN74HCT240PWR
SN74HCT240PWT
SOIC
SO
DW
NS
20
20
20
20
2000
2000
2000
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
38.0
38.0
TSSOP
TSSOP
PW
PW
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Applications
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Copyright © 2013, Texas Instruments Incorporated
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