SN74HCT32DBLE [TI]
QUADRUPLE 2-INPUT POSITIVE-OR GATES; 四路2输入正或门
| 型号： | SN74HCT32DBLE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE 2-INPUT POSITIVE-OR GATES |
| 文件： | 总14页 (文件大小：498K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54HCT32, SN74HCT32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS064E – NOVEMBER 1988 – REVISED AUGUST 2003
Operating Voltage Range of 4.5 V to 5.5 V
Outputs Can Drive Up To 10 LSTTL Loads
Typical t = 13 ns
pd
4-mA Output Drive at 5 V
Low Power Consumption, 20-µA Max I
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
CC
SN54HCT32 . . . J OR W PACKAGE
SN74HCT32 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54HCT32 . . . FK PACKAGE
(TOP VIEW)
1A
1B
V
CC
4B
4A
1
2
3
4
5
6
7
14
13
12
3
2
1
20 19
18
4A
NC
4Y
1Y
NC
2A
4
5
6
7
8
1Y
17
16
2A
11 4Y
10
9
2B
3B
3A
3Y
15 NC
14
9 10 11 12 13
NC
2B
2Y
3B
8
GND
NC – No internal connection
description/ordering information
The ’HCT32 devices contain four independent 2-input OR gates. They perform the Boolean function
Y
A • B or Y
A
B
in positive logic.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube of 25
Tube of 50
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HCT32N
SN74HCT32N
SN74HCT32D
SN74HCT32DR
SN74HCT32DT
SN74HCT32NSR
SN74HCT32DBR
SN74HCT32PW
SN74HCT32PWR
SN74HCT32PWT
SNJ54HCT32J
SNJ54HCT32W
SNJ54HCT32FK
HCT32
–40°C to 85°C
SOP – NS
HCT32
HT32
SSOP – DB
TSSOP – PW
HT32
CDIP – J
CFP – W
LCCC – FK
SNJ54HCT32J
SNJ54HCT32W
SNJ54HCT32FK
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT32, SN74HCT32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS064E – NOVEMBER 1988 – REVISED AUGUST 2003
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
Y
A
B
X
H
L
H
X
L
H
H
L
logic diagram (positive logic)
A
B
Y
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCT32
MIN NOM
SN74HCT32
MIN NOM
UNIT
MAX
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
∆t/∆v
Input transition rise/fall time
Operating free-air temperature
500
125
500
85
ns
°C
T
A
–55
–40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT32, SN74HCT32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS064E – NOVEMBER 1988 – REVISED AUGUST 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT32
SN74HCT32
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= –20 µA
= –4 mA
= 20 µA
= 4 mA
4.4 4.499
OH
OH
OL
OL
V
V = V or V
IH
4.5 V
4.5 V
OH
OL
I
IL
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
2
0.1
0.4
0.1
0.33
1000
20
V
V = V or V
V
I
IH
I
I
V = V
I
or 0
5.5 V
5.5 V
1000
40
nA
I
CC
CC
V = V
I
or 0,
I
O
= 0
µA
CC
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
15
SN54HCT32
SN74HCT32
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
24
MIN
MAX
35
MIN
MAX
30
4.5 V
5.5 V
4.5 V
5.5 V
t
t
A or B
Y
Y
pd
13
22
32
27
9
15
22
19
ns
t
8
14
20
17
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per gate
No load
20
pF
pd
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54HCT32, SN74HCT32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCLS064E – NOVEMBER 1988 – REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
From Output
Under Test
Test
Point
Input
1.3 V
1.3 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
1.3 V
10%
1.3 V
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
3 V
0 V
V
V
OH
2.7 V
2.7 V
Input
1.3 V
0.3 V
1.3 V
0.3 V
90%
t
Out-of-Phase
Output
1.3 V
10%
1.3 V
10%
OL
t
t
t
r
f
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time with one input transition per measurement.
D. and t are the same as t
t
.
pd
PLH
PHL
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74HCT32D
ACTIVE
SOIC
D
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32DBLE
SN74HCT32DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
14
14
TBD
Call TI
Call TI
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32DBRE4
SN74HCT32DBRG4
SN74HCT32DE4
SN74HCT32DG4
SN74HCT32DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32DRE4
SN74HCT32DRG4
SN74HCT32DT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32DTE4
SN74HCT32DTG4
SN74HCT32N
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HCT32NE4
SN74HCT32NSR
SN74HCT32NSRE4
SN74HCT32NSRG4
SN74HCT32PW
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32PWE4
SN74HCT32PWG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32PWLE
SN74HCT32PWR
OBSOLETE TSSOP
PW
PW
14
14
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HCT32PWRE4
SN74HCT32PWRG4
SN74HCT32PWT
PW
PW
PW
14
14
14
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN74HCT32PWTE4
SN74HCT32PWTG4
ACTIVE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HCT32DBR
SN74HCT32DR
SN74HCT32DR
SN74HCT32NSR
SN74HCT32PWR
SN74HCT32PWT
SSOP
SOIC
DB
D
14
14
14
14
14
14
2000
2500
2500
2000
2000
250
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
12.4
12.4
8.2
6.5
6.5
8.2
6.9
6.9
6.6
9.0
9.0
10.5
5.6
5.6
2.5
2.1
2.1
2.5
1.6
1.6
12.0
8.0
16.0
16.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
D
8.0
SO
NS
PW
PW
12.0
8.0
TSSOP
TSSOP
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HCT32DBR
SN74HCT32DR
SN74HCT32DR
SN74HCT32NSR
SN74HCT32PWR
SN74HCT32PWT
SSOP
SOIC
DB
D
14
14
14
14
14
14
2000
2500
2500
2000
2000
250
346.0
333.2
346.0
346.0
346.0
346.0
346.0
345.9
346.0
346.0
346.0
346.0
33.0
28.6
33.0
33.0
29.0
29.0
SOIC
D
SO
NS
PW
PW
TSSOP
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明